Sun™ Ultra™ 60 Service Manual Sun Microsystems, Inc. 901 San Antonio Road Palo Alto, CA 94303-4900 U.S.A. 650-960-1300 Part No. 805-1709-12 Revision A, August 2001 Send comments about this document to: docfeedback@sun.
Copyright 2001 Sun Microsystems, Inc., 901 San Antonio Road, Palo Alto, CA 94303-4900 U.S.A. All rights reserved. This product or document is distributed under licenses restricting its use, copying, distribution, and decompilation. No part of this product or document may be reproduced in any form by any means without prior written authorization of Sun and its licensors, if any. Third-party software, including font technology, is copyrighted and licensed from Sun suppliers.
Contents Preface 1. 2. 3. xvii Product Description 1-1 1.1 I/O Devices 1.2 System Unit Features 1.3 System Unit Components SunVTS Overview 1-3 1-5 2-1 2.1 SunVTS Description 2.2 SunVTS Operation Power-On Self-Test 1-3 2-1 2-2 3-1 3.1 POST Overview 3-2 3.2 Pre-POST Preparation 3-2 3.2.1 Setting Up a Tip Connection 3.2.2 Verifying the Baud Rate 3-3 3-4 3.3 Initializing POST 3-5 3.4 Maximum and Minimum Levels of POST 3-6 3.4.1 diag-level Variable Set to max 3-7 3.
3.4.3 4. POST Progress and Error Reporting 3.5 Bypassing POST 3.6 Additional Keyboard Control Commands 3.7 System and Keyboard LEDs 3.8 Initializing Motherboard POST 3-21 Troubleshooting Procedures 3-22 3-22 3-23 4-1 4.1 Power-On Failure 4.2 Video Output Failure 4.3 Disk Drive or CD-ROM Drive Failure 4.4 Power Supply Test 4.5 DIMM Failure 4.6 OpenBoot PROM On-Board Diagnostics 4.7 3-18 4-2 4-3 4-3 4-5 4-7 4-8 4.6.1 watch-clock 4-9 4.6.2 watch-net and watch-net-all 4.6.
. 7. 8. NVRAM 4-22 4.7.11 Audio 4.7.12 SCSI 4.7.13 All Above 4-22 4-23 4-23 Safety and Tool Requirements 5.1 Safety Requirements 5.2 Symbols 5.3 Safety Precautions 5.4 6. 4.7.10 5-1 5-2 5-2 5-3 5.3.1 Modification to Equipment 5-3 5.3.2 Placement of a Sun Product 5-3 5.3.3 Power Cord Connection 5.3.4 Electrostatic Discharge 5.3.5 Lithium Battery Tools Required Power On and Off 5-3 5-4 5-4 5-4 6-1 6.1 Powering On the System Unit 6-2 6.
8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 PCI Fan Assembly 8-5 8.2.1 Removing the PCI Fan Assembly 8-5 8.2.2 Replacing the PCI Fan Assembly 8-6 Hard Drive Bay With SCSI Assembly 8-7 8.3.1 Removing the SCSI Drive Bay 8-7 8.3.2 Replacing the SCSI Drive Bay 8-9 Cable Assemblies 8-11 8.4.1 Removing the Peripheral Power Cable Assembly 8-11 8.4.2 Replacing the Peripheral Power Cable Assembly 8-12 8.4.3 Removing the Diskette Drive Cable Assembly 8-12 8.4.
9. Removing the Shroud Assembly 8-38 8.10.2 Replacing the Shroud Assembly 8-39 Storage Devices 9.1 9.2 10. 8.10.1 9-1 Hard Drive 9-2 9.1.1 Removing a Hard Drive 9-2 9.1.2 Replacing a Hard Drive 9-3 Removable Media Assembly Drive 9-4 9.2.1 Removing the RMA 9-4 9.2.2 Removing the CD-ROM Drive or Any X-Option Tape Drive 9-6 9.2.3 Replacing the CD-ROM Drive or Any X-Option Tape Drive 9-8 9.2.4 Removing the Diskette Drive 9-8 9.2.5 Replacing the Diskette Drive 9-9 9.2.
10.4.2 10.5 10.6 10.7 11. DIMM Replacing the UPA Graphics Card 10-12 10.5.1 Removing a DIMM 10-13 10.5.2 Replacing a DIMM 10-15 Audio Card 10-16 10.6.1 Removing the Audio Card 10-16 10.6.2 Replacing the Audio Card 10-18 Motherboard 10-19 10.7.1 Removing a Motherboard 10-20 10.7.2 Replacing a Motherboard 10-23 Illustrated Parts List 11-1 A. Product Specifications A-1 A.1 Physical Specifications A.2 Electrical Specifications A.3 Environmental Requirements B.
C. Functional Description C.1 System Unit C-1 C-2 C.1.1 UPA Interconnect C-4 C.1.2 System Controller C-5 C.1.3 PCI Bus C.1.4 EBus2 Devices C.1.5 UltraSPARC II Processor C.1.6 Memory System C.1.7 Graphics and Imaging C.1.8 Peripherals C.1.9 Other RMA Storage Device X-Options C-6 C-7 C-8 C-9 C-14 C-15 C-19 C.1.10 Keyboard and Mouse, Diskette, and Parallel Port C.1.11 Serial Port C.1.12 Ethernet C-22 C-24 C.1.13 Audio Card and Connector C.1.14 SCSI C.1.15 ASICs C.
C.
Figures FIGURE 1-1 Ultra 60 Desktop Workstation FIGURE 1-2 System Unit Front View 1-4 FIGURE 1-3 System Unit Rear View FIGURE 3-1 Setting Up a TIP Connection FIGURE 3-2 Sun Type-5 Keyboard 3-5 FIGURE 4-1 Power Supply Connector J2901 4-6 FIGURE 4-2 Power Supply Connector J2902 4-6 FIGURE 4-3 Power Supply Connector J2903 4-7 FIGURE 6-1 System Unit Power-On (Front Panel) FIGURE 6-2 Sun Type-5 Keyboard 6-3 FIGURE 6-3 System Unit Power-Off (Front Panel) FIGURE 7-1 Lock Block Location
FIGURE 8-6 Removing and Replacing the RMA EMI Filler Panel FIGURE 8-7 Removing and Replacing the Chassis Foot FIGURE 8-8 Removing and Replacing the Speaker Assembly FIGURE 8-9 System Unit Power-Off (Front Panel) FIGURE 8-10 Lock Block Location FIGURE 8-11 Removing the Side Access Cover FIGURE 8-12 Attaching the Wrist Strap to the Chassis FIGURE 8-13 Removing and Replacing a PCI Card 8-23 FIGURE 8-14 Removing and Replacing a UPA Graphics Card FIGURE 8-15 Removing and Replacing the PCI Fan
FIGURE 10-8 Removing and Replacing the Motherboard (Part 2 of 2) FIGURE 10-9 Location of the Motherboard Serial Port Jumpers 10-24 FIGURE 10-10 Identifying Jumper Pins FIGURE 11-1 System Unit Exploded View FIGURE B-1 Keyboard/Mouse Connector Pin Configuration B-2 FIGURE B-2 Serial Port A and B Connector Pin Configuration FIGURE B-3 TPE Connector Pin Configuration FIGURE B-4 UltraSCSI Connector Pin Configuration FIGURE B-5 Audio Connector Configuration FIGURE B-6 Parallel Port Connector Pi
Figures xiv
Tables TABLE 1-1 Supported I/O Devices TABLE 1-2 System Unit Replaceable Components TABLE 2-1 SunVTS Documentation 2-2 TABLE 3-1 Diag-Level Switch Settings TABLE 3-2 Keyboard LED Patterns 3-21 TABLE 4-1 Internal Drives Identification 4-4 TABLE 4-2 Power Supply Connector J2901 Pin Description 4-6 TABLE 4-3 Power Supply Connector J2902 Pin Description 4-6 TABLE 4-4 Power Supply Connector J2903 Pin Description 4-7 TABLE 4-5 DIMM Physical Memory Address TABLE 4-6 Selected OBP On-Board D
TABLE B-4 UltraSCSI Connector Pin Assignments TABLE B-5 Audio Connector Line Assignment B-11 TABLE B-6 Parallel Port Connector Pin Assignments TABLE B-7 MII Connector Pin Assignments TABLE B-8 UPA Graphics Card Connector Pin Assignments B-16 TABLE C-1 UPA Port Identification Assignments TABLE C-2 DIMM Bank-to-U-Number Mapping C-13 TABLE C-3 IL = 0, DIMM Bank-to-Physical Address Mapping TABLE C-4 Diskette Drive Signals and Functions C-17 TABLE C-5 Supported Hard Drives TABLE C-6 Audio Ca
Preface The Sun Ultra 60 Service Manual provides detailed procedures that describe the removal and replacement of replaceable parts in the Ultra™ 60 computer (system unit). The service manual also includes information about the use and maintenance of the system unit. This book is written for technicians, system administrators, authorized service providers (ASPs), and advanced computer system end users who have experience troubleshooting and replacing hardware.
TABLE P-1 Document Organization (Continued) Chapter Number/Title Content Description Chapter 4, “Troubleshooting Procedures” Provides troubleshooting advice and suggested corrective actions for hardware problems. Chapter 5, “Safety and Tool Requirements” Explains how to work safely when servicing the system unit. Chapter 6, “Power On and Off” Provides step-by-step procedures to power on and power off the system unit.
See one or more of the following for this information: ■ Solaris 2.x Handbook for SMCC Peripherals. ■ AnswerBook™ online documentation for the Solaris™ 2.x software environment. ■ Other software documentation that you received with your system. Typographic Conventions TABLE P-2 Typographic Conventions Typeface or Symbol Meaning Examples AaBbCc123 The names of commands, files, and directories; on-screen computer output. Edit your .login file. Use ls -a to list all files. % You have mail.
TABLE P-3 xx Shell Prompts Shell Prompt C shell superuser machine_name# Bourne shell and Korn shell $ Bourne shell and Korn shell superuser # Sun Ultra 60 Service Manual • August 2001
Related Documents TABLE P-4 Related Documents Application Title Part Number Configuration Sun Ultra 60 System Reference Manual 802-4147 Configuration Solaris Handbook for SMCC Peripherals 802-7675 Diagnostics SunVTS 2.0 User’s Guide 802-5331 Diagnostics SunVTS 2.0 Test Reference Manual 802-5330 Diagnostics SunVTS 2.
TABLE P-4 Related Documents (Continued) Application Title Part Number Specification 8-mm Tape Drive Specifications 802-5775 Specification 4-mm, DDS-2 Tape Drive Specifications 802-7790 Specification Manual Eject Diskette Drive Specifications 805-1133 User 24-Inch Premium (22.
Sun Welcomes Your Comments Sun is interested in improving its documentation and welcomes your comments and suggestions. You can email your comments to Sun at: docfeedback@sun.com Please include the part number (805-1709-12) of your document in the subject line of your email.
xxiv Sun Ultra 60 Service Manual • August 2001
CHAPTER 1 Product Description The Ultra 60 desktop workstation is a multiprocessor device that uses the family of UltraSPARC™ processors. It supports high-performance processing and high-performance graphics. FIGURE 1-1 illustrates the Ultra 60 desktop workstation.
System unit Monitor (24-inch optional) Keyboard Mouse/pad FIGURE 1-1 1-2 Ultra 60 Desktop Workstation Sun Ultra 60 Service Manual • August 2001
1.1 I/O Devices The Ultra 60 desktop workstation uses the I/O devices listed in TABLE 1-1.
FIGURE 1-2 illustrates the system unit front view. FIGURE 1-3 illustrates the system unit rear view. System unit electronics and peripherals contain (or may be upgraded to contain) the following features: ■ Tower enclosure with 350-watt power supply. ■ Support for modular UltraSPARC II processor with up to a 4-megabyte (Mbyte) Ecache and system operating frequencies from 100 megahertz (MHz) to 400 MHz. ■ 83.3-MHz to 120-MHz UPA coherent memory interconnect.
AC power inlet Parallel DB25 connector Keyboard/mouse connector Serial connector (2) RS-423/RS-232 TPE connector MII connector 68-pin SCSI connector Audio module connector UPA graphics (2) PCI 66 connector 1 PCI 2, 3, 4 connector (3) FIGURE 1-3 1.3 System Unit Rear View System Unit Components TABLE 1-2 lists the system unit components by part number. A brief description of each listed component is also provided.
Note – Consult your authorized Sun sales representative or service provider to confirm a part number prior to ordering a replacement part. TABLE 1-2 System Unit Replaceable Components Component Description Motherboard System board Hard drive bay with SCSI Mechanical hard drive housing 4.2-Gbyte SCSI assembly Hard disk drive, 3.5-inch x 1.0-inch 9.1-Gbyte SCSI assembly Hard disk drive, 3.5-inch x 1.
TABLE 1-2 System Unit Replaceable Components (Continued) Component Description 32-Mbyte DIMM 60-ns, 32-Mbyte DIMM 64-Mbyte DIMM 60-ns, 64-Mbyte DIMM 128-Mbyte DIMM 60-ns, 128-Mbyte DIMM NVRAM/TOD Time of day, 48T59, with carrier CD-ROM drive 12X-speed CD-ROM drive, 644-Mbyte SunCD™ 4-mm tape drive 4-Gbyte/8-Gbyte, 4-mm tape drive, DDS-2 4-mm tape drive 12-Gbyte/24-Gbyte, 4-mm tape drive, DDS-3 8-mm tape drive 14-Gbyte, 8-mm tape drive TPE cable (category 5) Twisted-pair Ethernet cable
1-8 Sun Ultra 60 Service Manual • August 2001
CHAPTER 2 SunVTS Overview This chapter contains an overview of the SunVTS™ diagnostic tool. This chapter contains the following topics: 2.1 ■ SunVTS Description—page 2-1 ■ SunVTS Operation—page 2-2 SunVTS Description The SunVTS software executes multiple diagnostic hardware tests from a single user interface. SunVTS verifies the configuration, functionality, and reliability of most hardware controllers and devices.
2.2 SunVTS Operation TABLE 2-1 lists the documentation for the SunVTS software. These documents are available on the Solaris on Sun Hardware AnswerBook, which is on the SMCC Updates for the Solaris release.
CHAPTER 3 Power-On Self-Test This chapter describes how to initiate power-on self-test (POST) diagnostics. The examples given in this chapter are representative, details of actual test results may be different, depending on system configurations.
3.1 POST Overview POST is useful in determining if a portion of the system unit has failed and should be replaced. POST detects approximately 95 percent of system unit faults and is located in the system board OpenBoot™ PROM (OBP). The setting of two NVRAM variables, the diag-switch? and the diag-level flag, determine if POST is executed. TABLE 3-1 lists the diag-switch? and diag-level flag settings for disabling POST (off), enabling POST maximum (max), or enabling POST minimum (min).
3.2.1 Setting Up a Tip Connection A tip connection enables a remote shell window to be used as a terminal to display test data of a system being tested. Serial port A or serial port B of a tested system unit is used to establish the tip connection between the system unit being tested and another Sun workstation monitor or TTY-type terminal. The tip connection is used in a SunOSTM window and provides features to help with the OBP. To set up a tip connection: 1. See FIGURE 3-1.
4. In a shell window on the Sun workstation, type tip hardwire. hostname% tip hardwire connected Note – The shell window is now a tip window directed to the serial port of the system unit being tested. When power is applied to the system unit being tested, POST messages will be displayed in this window. 5. When POST is completed, disconnect the tip window as follows: a. Open a shell window. b. Type ps -a to view the active tip line and process ID (PID) number. c.
3.3 Initializing POST POST is initilized in two ways: ■ By setting the diag-switch? to true and the diag-level to max or min, followed by power cycling the system unit ■ By simultaneously pressing the keyboard Stop and D keys while power is applied to the system unit To set the diag-switch? to true and power cycle the system unit: 1. At the system prompt, type: ok setenv diag-switch? true 2.
3. Verify the following: a. The display prompt is no longer displayed. b. The monitor power-on indicator flashes on and off. c. The keyboard Caps Lock key indicator flashes on and off. 4. When the POST is complete, type the following at the system prompt: ok setenv diag-switch? false 3.4 Maximum and Minimum Levels of POST Two levels of POST are available: maximum (max) level and minimum (min) level. The system initiates the selected level of POST based upon the setting of diag-level, a NVRAM variable.
3.4.1 diag-level Variable Set to max When the diag-level variable is set to max, POST enables an extended set of diagnostic-level tests. This mode requires approximately 2 minutes and 15 seconds to complete (with 128 Mbytes of DIMM installed). CODE EXAMPLE 3-1 identifies a typical serial port A POST output with the diag-level variable set to max CODE EXAMPLE 3-1 diag-level Variable Set to max Executing Power On SelfTest 0> 0>@(#) Sun Ultra 60(UltraSPARC-II 2-way) UPA/PCI POST x.x.
CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued) 2> <00> DMMU TLB Tag Access Test 2> <00> DMMU TLB RAM Access Test 2> <00> IMMU TLB Tag Access Test 2> <00> IMMU TLB RAM Access Test 2> <00> Probe Ecache 2>INFO:CPU 296 MHz: 2048KB Ecache 2> <00> Ecache RAM Addr Test 2> <00> Ecache Tag Addr Test 2> <00> Ecache Tag Test 2> <00> Invalidate Ecache Tags 2> <00> Map PROM/STACK/NVRAM in DMMU 2> <00> Update Slave Stack/Frame Ptrs 0> <00> DMMU Hit/Miss Test 0> <00> IMMU Hit/Miss Test 0> <00> DMMU Little E
CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued) 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> ECC Memory Addr Test 0>INFO:128MB Bank 0 0>INFO: 0MB Bank 1 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> Memory Status Test 0>INFO:128MB Bank 0 0>INFO: 0MB Bank 1 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> V9 Instruction Test 0> <00> CPU Tick and Tick Compare Reg Test 0> <00> CPU Soft Trap Test 0> <00> CPU Softint Reg and Int Test 2> <00> V9 Instruction Test 2> <00> CPU Tick and Tick Compare Reg T
CODE EXAMPLE 3-1 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 2> 0> 0> 0> 0> 0> 0> 0> 0> 0> 3-10 <1f> <1f> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <00> <1f> <1f> <1f> <1f> <1f> <1f> diag-level Variable Set to max (Continued) PBMB Control/Status Reg Test PBMB Diag Reg Test FPU Regs Test FPU
CODE EXAMPLE 3-1 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> <1f> diag-level Variable Set to max (Continued) Streaming DMA CE ECC Rd Err Ebus Test Streaming DMA CE ECC Rd Err Lpbk T
CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued) 0> <1f> Stream DMA Rd, IOMMU Hit, Scache Hit (prev wr) Lpbk Test 0> <1f> Stream DMA Wr, IOMMU miss, Scache Miss Ebus Test 0> <1f> Stream DMA Wr, IOMMU miss, Scache Miss Lpbk Test 0> <1f> Stream DMA Wr, IOMMU hit, Scache Miss Ebus Test 0> <1f> Stream DMA Wr, IOMMU hit, Scache Miss Lpbk Test 0> <1f> Stream DMA Wr, IOMMU Miss, Scache(prev rd) Hit Ebus Test 0> <1f> Stream DMA Wr, IOMMU Miss, Scache(prev rd) Hit Lpbk Test 0> <1f> Stream DMA Wr, IOMMU
CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued) 0>INFO:128MB Bank 0 0>INFO: 0MB Bank 1 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> Block Memory Test 0>INFO:128MB Bank 0 0>INFO: 0MB Bank 1 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> ECC Blk Memory Test 0>INFO:128MB Bank 0 0>INFO: 0MB Bank 1 0>INFO: 0MB Bank 2 0>INFO: 0MB Bank 3 0> <00> UltraSPARC-2 Prefetch Instructions Test 0> <00>Test 0: prefetch_mr 0> <00>Test 1: prefetch to non-cacheable page 0> <00>Test 2: prefetch to page with dmmu mi
CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued) 2> <00>Test 7: prefetcha with asi 0x76 is noped 2> <00>Test 8: prefetch with fcn 5 2> <00>Test 9: prefetch with fcn 2 2> <00>Test 10: prefetch with fcn 12 2> <00>Test 11: prefetch with fcn 16 is noped 2> <00>Test 12: prefetch with fcn 29 is noped 2> <00>Test 13: prefetcha with asi 0x15 is noped 2> <00>Test 14: prefetch with fcn 3 2> <00>Test 15: prefetcha14 with fcn 2 2> <00>Test 16: prefetcha80_mr 2> <00>Test 17: prefetcha81_1r 2> <00>Test 18: p
CODE EXAMPLE 3-2 diag-level Variable Set to min (Continued) 0> <00> IMMU TLB RAM Access Test 0> <00> Probe Ecache 0>INFO:CPU 296 MHz: 2048KB Ecache 0> <00> Ecache RAM Addr Test 0> <00> Ecache Tag Addr Test 0> <00> Ecache Tag Test 0> <00> Invalidate Ecache Tags 0>INFO: Processor 2 - UltraSPARC-II.
CODE EXAMPLE 3-2 diag-level Variable Set to min (Continued) 2> <00> FPU ASI Access Test 2> <00> Dcache RAM Test 2> <00> Dcache Tag Test 2> <00> Icache RAM Test 2> <00> Icache Tag Test 2> <00> Icache Next Test 2> <00> Icache Predecode Test 0> <1f> Init Psycho 0> <1f> PIO Read Error, Master Abort Test 0> <1f> PIO Read Error, Target Abort Test 0> <1f> PIO Write Error, Master Abort Test 0> <1f> PIO Write Error, Target Abort Test 0> <1f> Timer Increment Test 0> <1f> Consistent DMA UE ECC Rd Err Lpbk Test 0> <1
CODE EXAMPLE 3-2 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> 0> diag-level Variable Set to min (Continued) <1f> Psycho Perf Cntl Reg Test <1f> PIO Decoder and BCT Test <1f> PCI Byte Enable Test <1f> Counter/Timer Limit Regs Test <1f> Timer Reload Test <1f> Timer Periodic Test <1f> Mondo Int Map (short) Reg Test <1f> Mondo Int Set/Clr Reg Test <1f> Psycho IOMMU Regs Test <1f> Psycho IOMMU RAM Address Test <1f> Ps
CODE EXAMPLE 3-2 diag-level Variable Set to min (Continued) 0> <00>Test 18: prefetcha10_mw 0> <00>Test 19: prefetcha80_17 is noped 0> <00>Test 20: prefetcha10_6: illegal instruction trap 0> <00>Test 21: prefetcha11_1w 0> <00>Test 22: prefetcha81_31 0> <00>Test 23: prefetcha11_15: illegal instruction trap 2> <00> UltraSPARC-2 Prefetch Instructions Test 2> <00>Test 0: prefetch_mr 2> <00>Test 1: prefetch to non-cacheable page 2> <00>Test 2: prefetch to page with dmmu misss 2> <00>Test 3: prefetch miss does n
If an error occurs during the POST execution, the keyboard Caps Lock key indicator stops flashing and an error code is displayed using the Caps Lock, Compose, Scroll Lock, and Num Lock key indicators. The error code indicates a particular system hardware failure. Note – An error code may only be visible for a few seconds. Observe the Caps Lock, Compose, Scroll Lock, and Num Lock key indicators closely while POST is active.
CODE EXAMPLE 3-3 Typical Error Code Failure Message (Continued) 0> <00> SC Dtag Init 0> <00> Probe Memory 0>INFO:128MB Bank 0 0>INFO:No memory detected in Bank 1 0>INFO:No memory detected in Bank 2 0>INFO:No memory detected in Bank 3 0> <00> Malloc Post Memory 0> <00> Init Post Memory 0> <00> Post Memory Addr Test 0>mem_utils.c mem_err_bd_desc = 00000000.00000000, xor = 80808000.
TABLE 3-2 Keyboard LED Patterns Caps Lock Compose Scroll Lock Num Lock Meaning of Pattern On Off Off Off System motherboard Off On Off Off CPU module 0 Off On On Off CPU module 1 On Off Off On No memory detected On On Off Off Memory bank 0 On On Off On Memory bank 1 On On On Off Memory bank 2 On On On On Memory bank 3 Off Off Off On NVRAM 3.5 Bypassing POST POST can be disabled and thereby bypassed. To bypass POST: 1.
3.6 Additional Keyboard Control Commands ■ Stop Key If the diag-level is set to either max or min and the diag-level switch? variable is set to true and POST is not to be executed when the system is powered on, press and hold the keyboard Stop key and press the keyboard power-on key. Note – Press and hold the Stop key for approximately 5 seconds. ■ Stop and N Keys To set the system NVRAM parameters to the original default settings, press and hold the Stop and N keys before powering on the system.
3.8 Initializing Motherboard POST To initialize the motherboard POST: 1. Power off the system unit. 2. At the keyboard, simultaneously press and hold the Stop and D keys and press the power-on key. Note – Video output is disabled while POST is initialized. Note – If the POST output results are to be viewed, a tip connection must be set up. See Section 3.2.1, “Setting Up a Tip Connection” on page 3-3. 3.
3-24 Sun Ultra 60 Service Manual • August 2001
CHAPTER 4 Troubleshooting Procedures This chapter describes how to troubleshoot possible hardware problems and includes suggested corrective actions.
4.1 Power-On Failure This section provides examples of power-on failure symptoms and suggested actions. Symptom The system unit does not power up when the keyboard power switch is pressed. Action Check the keyboard connection. Ensure that the keyboard is properly connected to the system unit. Check the AC power cord. Ensure that the AC power cord is properly connected to the system unit and to the wall receptacle. Verify that the wall receptacle is supplying AC power to the system unit.
Action Press the keyboard power-on key and watch the keyboard. The keyboard LEDs should light briefly and a tone from the keyboard should be heard. If a tone is not heard or if the keyboard LEDs do not light briefly, the system unit power supply may be defective. See Section 4.4, “Power Supply Test” on page 4-5. If a keyboard tone is heard and the keyboard LEDs light briefly but the system unit still fails to initialize, see Section 3.8, “Initializing Motherboard POST” on page 3-23. 4.
Symptom A hard drive read, write, or parity error is reported by the operating system or customer application. A CD-ROM drive read error or parity error is reported by the operating system or customer application. Action Replace the drive indicated by the failure message. The operating system identifies the internal drives as listed in TABLE 4-1.
If the hard drive responds correctly to probe-scsi, the message identified in CODE EXAMPLE 4-4 is displayed. If the drives respond and a message is displayed, the system SCSI controller has successfully probed the devices. This is an indication that the motherboard is operating correctly. If one drive does not respond to the SCSI controller probe but the other does, replace the unresponsive drive.
1 2 4 5 6 7 8 9 10 11 12 FIGURE 4-1 Power Supply Connector J2901 TABLE 4-2 Power Supply Connector J2901 Pin Description 13 14 15 Pin Description Pin Description 1 Rtn 9 SUPPLY TRIP L 2 +3.3 Vdc SENSE 10 POWERON L 3 Rtn 11 -12 Vdc 4 +5.0 Vdc SENSE 12 POWER OK 5 POWER SET0 NEG 13 Gnd 6 +3.
11 2 4.5 324 53 6 74 8 9510 11612 FIGURE 4-3 Power Supply Connector J2903 TABLE 4-4 Power Supply Connector J2903 Pin Description Pin Function Pin Function 1 +3.3 Vdc Rtn 4 +3.3 Vdc 2 +3.3 Vdc Rtn 5 +3.3 Vdc 3 +3.3 Vdc Rtn 6 +3.3 Vdc DIMM Failure At times, the operating system, diagnostic program, or POST may not display a DIMM location (U number) as part of a memory error message.
TABLE 4-5 DIMM Physical Memory Address DIMM Slot 4.6 DIMM Pair (non-interleave) U0701 U0702 00000000 - 0fffffff U0703 U0704 10000000 - 1fffffff U0801 U0802 20000000 - 2fffffff U0803 U0804 30000000 - 3fffffff U0901 U0902 80000000 - 8fffffff U0903 U0904 90000000 - 9fffffff U1001 U1002 a0000000 - afffffff U1003 U1004 b0000000 - bfffffff OpenBoot PROM On-Board Diagnostics The following sections describe the OpenBoot PROM (OBP) on-board diagnostics.
4.6.1 watch-clock watch-clock reads a register in the NVRAM/TOD chip and displays the result as a seconds counter. During normal operation, the seconds counter repeatedly increments from 0 to 59 until interrupted by pressing any key on the Sun Type-5 keyboard. CODE EXAMPLE 4-1 identifies the watch-clock output message. CODE EXAMPLE 4-1 watch-clock Output Message {0} ok watch-clock Watching the ‘seconds’ register of the real time clock chip. It should be ‘ticking’ once a second. Type any key to stop.
CODE EXAMPLE 4-3 watch-net-all Output Message {0} ok watch-net-all /pci@1f,4000/network@1,1 Hme register test --- succeeded. Internal loopback test -- succeeded. Transceiver check -- Using Onboard Transceiver - Link Up. passed Using Onboard Transceiver - Link Up. Looking for Ethernet Packets. ‘.’ is a Good Packet. ‘X’ is a Bad Packet. Type any key to stop. ... 4.6.
CODE EXAMPLE 4-5 probe-scsi-all Output Message (Continued) Target 6 Unit 0 Removable Read Only device XM5701TASUN12XCD0997 {0} ok probe-scsi-all /pci@1f,4000/scsi@3,1 TOSHIBA /pci@1f,4000/scsi@3 Target 0 Unit 0 Disk QUANTUM VK4550J SUN4.2G8600 Target 6 Unit 0 Removable Read Only device TOSHIBA XM5701TASUN12XCD0997 4.6.4 test alias name, device path, -all The test command, combined with a device alias or device path, enables a device self-test program.
TABLE 4-6 Selected OBP On-Board Diagnostic Tests Type of Test Description Preparation test screen Tests system video graphics hardware and monitor. Diag-switch? NVRAM parameter must be true for the test to execute. test floppy Tests diskette drive response to commands. A formatted diskette must be inserted into the diskette drive. test net Performs internal/external loopback test of the system auto-selected Ethernet interface.
2. At the ok prompt, type: ok% test screen Verifying This will Verifying This will FFB Frame ok Console Mode for Frame Buffer Board take a few minutes Frame Buffer Memory used for console mode take about two minutes Buffer functional test passed 3. When the UPA graphics card on-board diagnostics are completed, type: ok% setenv diag-switch? false diag-switch? = false 4.
2. Verify that the OBDiag screen is displayed (CODE EXAMPLE 4-7).
5. At the OBDiag menu prompt, type 15 to enable toggle script-debug messages. 4.7.1 PCI/Cheerio The PCI/Cheerio diagnostic performs the following: 1. vendor_ID_test – Verifies the Cheerio ASIC vendor ID is 108e. 2. device_ID_test – Verifies the Cheerio ASIC device ID is 1000. 3. mixmode_read – Verifies the PCI configuration space is accessible as half-word bytes by reading the EBus2 vendor ID address. 4. e2_class_test – Verifies the address class code.
4.7.2 EBus DMA/TCR Registers The EBus DMA/TCR registers diagnostic performs the following: 1. DMA_reg_test – Performs a walking ones bit test for control status register, address register, and byte count register of each channel. Verifies that the control status register is set properly. 2. DMA_func_test – Validates the DMA capabilities and FIFOs. Test is executed in a DMA diagnostic loopback mode.
CODE EXAMPLE 4-11 identifies the Ethernet output message. CODE EXAMPLE 4-11 Ethernet Output Message Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 2 TEST=’ethernet_test’ SUBTEST=’my_channel_reset’ SUBTEST=’hme_reg_test’ SUBTEST=’global_reg1_test’ SUBTEST=’global_reg2_test’ SUBTEST=’bmac_xif_reg_test’ SUBTEST=’bmac_tx_reg_test’ SUBTEST=’mif_reg_test’ SUBTEST=’mac_internal_loopback_test’ SUBTEST=’10mb_xcvr_loopback_test’ SUBTEST=’100mb_phy_loopback_test’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4.7.
4.7.5 Mouse The mouse diagnostic performs a keyboard-to-mouse loopback. CODE EXAMPLE 4-13 identifies the mouse output message. CODE EXAMPLE 4-13 Mouse Output Message Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4 TEST=’mouse_test’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4.7.6 Floppy The floppy diagnostic verifies the diskette drive controller initialization. It also validates the status of a selected disk drive and reads the diskette drive header.
CODE EXAMPLE 4-15 CODE EXAMPLE 4-15 identifies the parallel port output message. Parallel Port Output Message Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 6 TEST=’parallel_port_test’ SUBTEST=’dma_read’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4.7.8 Serial Port A The serial port A diagnostic invokes the uart_loopback test. The uart_loopback test transmits and receives 128 characters and checks the transaction validity.
CODE EXAMPLE 4-16 Serial Port A Output Message (Continued) SUBTEST=’internal_loopback’ BAUDRATE=’230400’ SUBTEST=’internal_loopback’ BAUDRATE=’307200’ SUBTEST=’internal_loopback’ BAUDRATE=’460800’ SUBTEST=’internal_loopback’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> Note – The serial port A diagnostic will stall if the TIP line is installed on serial port A. CODE EXAMPLE 4-17 identifies the serial port A output message when the TIP line is installed on serial port A.
4.7.9 Serial Port B The serial port B diagnostic is identical to the serial port A diagnostic. CODE EXAMPLE 4-18 identifies the serial port B output message. Note – The serial port B diagnostic will stall if the tip line is installed on serial port B.
4.7.10 NVRAM The NVRAM diagnostic verifies the NVRAM operation by performing a write and read to the NVRAM. CODE EXAMPLE 4-19 identifies the NVRAM output message. CODE EXAMPLE 4-19 NVRAM Output Message Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 9 TEST=’nvram_test’ SUBTEST=’write/read_patterns’ SUBTEST=’write/read_inverted_patterns’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4.7.11 Audio The audio diagnostic performs the following: 1. cs4231_test – Verifies the cs4231 internal registers. 2.
4.7.12 SCSI The SCSI diagnostic validates both the SCSI chip and the SCSI bus subsystem. CODE EXAMPLE 4-21 identifies the SCSI output message. CODE EXAMPLE 4-21 SCSI Output Message Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 11 TEST=’selftest’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 4.7.13 All Above The all above diagnostic validates the system unit. CODE EXAMPLE 4-22 identifies the all above output message.
CODE EXAMPLE 4-22 All Above Output Message (Continued) SUBTEST=’hme_reg_test’ SUBTEST=’global_reg1_test’ SUBTEST=’global_reg2_test’ SUBTEST=’bmac_xif_reg_test’ SUBTEST=’bmac_tx_reg_test’ SUBTEST=’mif_reg_test’ SUBTEST=’mac_internal_loopback_test’ SUBTEST=’10mb_xcvr_loopback_test’ SUBTEST=’100mb_phy_loopback_test’ TEST=’keyboard_test’ SUBTEST=’internal_loopback’ TEST=’mouse_test’ TEST=’floppy_test’ SUBTEST=’floppy_id0_read_test’ TEST=’parallel_port_test’ SUBTEST=’dma_read’ TEST=’uarta_test’ ‘UART A in use
CODE EXAMPLE 4-22 All Above Output Message (Continued) BAUDRATE=’230400’ SUBTEST=’internal_loopback’ BAUDRATE=’307200’ SUBTEST=’internal_loopback’ BAUDRATE=’460800’ SUBTEST=’internal_loopback’ TEST=’nvram_test’ SUBTEST=’write/read_patterns’ SUBTEST=’write/read_inverted_patterns’ TEST=’audio_test’ SUBTEST=’cs4231_test’ Codec_ID=’8a’ Version_ID=’a0’ TEST=’selftest’ Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> Chapter 4 Troubleshooting Procedures 4-25
4-26 Sun Ultra 60 Service Manual • August 2001
CHAPTER 5 Safety and Tool Requirements This chapter describes the safety requirements, symbols, safety precautions, and tools required.
5.1 Safety Requirements For protection, observe the following safety precautions when setting up the equipment: 5.2 ■ Follow all cautions, warnings, and instructions marked on the equipment. ■ Ensure that the voltages and frequency rating of the power receptacle match the electrical rating label on the equipment. ■ Never push objects of any kind through openings in the equipment. They may touch dangerous voltage points or short components resulting in fire or electric shock.
5.3 Safety Precautions Follow all safety precautions. 5.3.1 Modification to Equipment Caution – Do not make mechanical or electrical modifications to the equipment. Sun Microsystems is not responsible for regulatory compliance of a modified Sun product. 5.3.2 Placement of a Sun Product Caution – To ensure reliable operation of the Sun product and to protect it from overheating, openings in the equipment must not be blocked or covered.
5.3.4 Electrostatic Discharge Caution – DIMMs, circuit boards, and hard drives contain electronic components that are extremely sensitive to static electricity. Ordinary amounts of static electricity from clothes or work environment can destroy components. Do not touch the components themselves or any metal parts. Wear the wrist strap when the system unit access panel is open. 5.3.5 Lithium Battery Caution – On Sun system boards, a lithium battery is molded into the real-time clock, SDS No.
CHAPTER 6 Power On and Off This chapter contains procedures to power on and power off the Ultra 60 computer. This chapter contains the following topics: ■ Powering On the System Unit—page 6-2 ■ Powering Off the System Unit—page 6-3 Note – The actions required to remove and replace the major subassemblies are also illustrated with photographs and audio/visual instructions on the Sun Ultra 60 ShowMe How Multimedia Documentation, part number 704-5886.
6.1 Powering On the System Unit To power on the system unit: 1. Turn on power to all connected peripherals. Note – Peripheral power is activated prior to system power so the system can recognize the peripherals when it is activated. 2. Connect the AC power cord. 3. Set the front panel power switch to the On position (FIGURE 6-1) or press the Sun Type-5 keyboard power on key (FIGURE 6-2). 4. Verify the following: a. The front panel LED is on. b. The system fans are spinning.
Power on key FIGURE 6-2 6.2 Sun Type-5 Keyboard Powering Off the System Unit Caution – Prior to turning off the system unit power, exit from the operating system. Failure to do so may result in data loss. Caution – Wear an antistatic wrist strap and use an ESD-protected mat when handling components. When servicing or removing system unit components, attach an ESD strap to your wrist, then to a metal area on the chassis, and then disconnect the power cord from the system unit and the wall receptacle.
4. Verify the following: a. The front panel LED is off. b. The system fans are not spinning. Caution – Disconnect the AC power cord prior to servicing system components. 5. Turn off the power to the monitor. 6. Disconnect cables to any peripheral equipment.
CHAPTER 7 Internal Access This chapter describes how to access the Ultra 60 computer for service. This chapter contains the following topics: ■ Removing the Side Access Cover—page 7-2 ■ Attaching the Wrist Strap—page 7-3 ■ Replacing the Side Access Cover—page 7-4 Note – Removal and replacement of selected system unit components are also illustrated with photographs and audio/visual instructions on the Sun Ultra 60 ShowMe How Multimedia Documentation, part number 704-5886.
7.1 Removing the Side Access Cover 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Disconnect the lock block (FIGURE 7-1). Lock block FIGURE 7-1 Lock Block Location 3. Remove the side access cover as follows (FIGURE 7-2): a. Lay the system in the service position. b. Grasp the side panel and pull it toward the back of the system. c. Disengage the side access cover from the chassis hooks. d.
Side access cover System unit (service position) System unit front FIGURE 7-2 7.2 Removing the Side Access Cover Attaching the Wrist Strap Caution – Wear an antistatic wrist strap and use an ESD-protected mat when handling components. When servicing or removing system unit components, attach an ESD strap to your wrist, then to a metal area on the chassis, and then disconnect the power cord from the system unit and the wall receptacle.
Wrist strap Chassis System unit rear FIGURE 7-3 7.3 Attaching the Wrist Strap to the Chassis Replacing the Side Access Cover 1. Position the side access cover (FIGURE 7-4). 2. Engage the side access cover and the chassis hooks. Push the access cover towards the system unit front. 3. Connect the lock block (FIGURE 7-1). 4. Position the system unit in the operating position.
Side access cover System unit front FIGURE 7-4 System unit (service position) Replacing the Side Access Cover Chapter 7 Internal Access 7-5
7-6 Sun Ultra 60 Service Manual • August 2001
CHAPTER 8 Major Subassemblies This chapter describes how to remove and replace the major subassemblies.
8.1 Power Supply To remove and replace the power supply, proceed as follows. 8.1.1 Removing the Power Supply 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – When removing the power supply, attach the copper end of the wrist strap to the system unit chassis, not the power supply. 3. Attach the wrist strap. See Section 7.
Peripheral power cable Power supply (partially extended) Captive screw (4) FIGURE 8-1 8.1.2 Removing and Replacing the Power Supply (Part 1 of 2) Replacing the Power Supply Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the power supply as follows (FIGURE 8-1 and FIGURE 8-2): a.
Power cable FIGURE 8-2 Removing and Replacing the Power Supply (Part 2 of 2) g. Slide the power supply toward the chassis front until the power supply rear panel is flush with the chassis. h. Using a number 2 Phillips-head screwdriver, tighten the captive screws securing the power supply to the chassis. Note – Tighten the captive screws in a clockwise order beginning with the upper right captive screw. 2. Connect the AC power cord. 3. Detach the wrist strap. 4. Replace the side access cover.
8.2 PCI Fan Assembly To remove and replace the PCI fan assembly, proceed as follows. 8.2.1 Removing the PCI Fan Assembly 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat.
Locking snap PCI fan assembly Power harness Stud Stud Speaker assembly (reference) Chassis slots FIGURE 8-3 8.2.2 Removing and Replacing the PCI Fan Assembly Replacing the PCI Fan Assembly Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Position the PCI fan over the speaker assembly (FIGURE 8-3). 2.
a. Position the studs into the chassis slots and engage. b. Press the locking snap and engage. c. Connect the power harness to the motherboard. d. Replace any long PCI cards. See Section 10.3.2, “Replacing a PCI Card” on page 10-9. 3. Connect the AC power cord. 4. Detach the wrist strap. 5. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 6. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 8.
4. Remove the SCSI drive bay as follows (FIGURE 8-4): a. Remove the hard drive(s). See Section 9.1.1, “Removing a Hard Drive” on page 9-2. b. Disconnect the SCSI cables from the motherboard connectors. c. Disconnect the peripheral power cable. d. Remove the peripheral power cable from the cable routing clips. e. Remove the diskette drive cable from the plastic spring clips installed adjacent to the drive bay. f. Unfeed the peripheral power cable through the chassis opening. g.
Screw (2) SCSI drive bay FIGURE 8-4 8.3.2 Removing and Replacing the SCSI Drive Bay Replacing the SCSI Drive Bay Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the SCSI drive bay as follows (FIGURE 8-4): a. Position the SCSI drive bay on the channel slides and slide it in.
b. Using a number 2 Phillips-head screwdriver, replace the screws securing the SCSI drive bay to the chassis. c. Connect the SCSI cables to the motherboard connectors. d. Press the SCSI cables into the cage hole and beneath the PCI fan assembly. e. Replace the peripheral power cable into the cable routing clips. f. Replace the diskette drive cable into the plastic spring clips installed adjacent to the drive bay. g. Replace the hard drive(s). See Section 9.1.2, “Replacing a Hard Drive” on page 9-3.
8.4 Cable Assemblies To remove and replace the peripheral power cable assembly and the diskette drive cable assembly, proceed as follows. Note – Unconnected peripheral power cables should remain clipped inside the main chassis. 8.4.1 Removing the Peripheral Power Cable Assembly 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2.
8.4.2 Replacing the Peripheral Power Cable Assembly Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Position the peripheral power cable assembly into the chassis. 2. Replace the peripheral power cable through the cable routing clips. 3. Connect the following: a.
Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 3. Attach the wrist strap. See Section 7.2, “Attaching the Wrist Strap” on page 7-3. 4. Disconnect the diskette drive cable assembly as follows: a. Partially remove the drive tray. See Section 9.2.1, “Removing the RMA” on page 9-4. b.
e. Replace the drive tray. See Section 9.2.6, “Replacing the RMA” on page 9-9. 3. Connect the AC power cord. 4. Detach the wrist strap. 5. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 6. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 8.5 EMI Filler Panels To remove and replace the EMI filler panels from the front bezel or the drive tray, proceed as follows. 8.5.1 Removing an EMI Filler Panel 1.
Bezel EMI Filler panel (3) FIGURE 8-5 Removing and Replacing the Bezel EMI Filler Panel RMA Filler panel (3) FIGURE 8-6 8.5.2 Removing and Replacing the RMA EMI Filler Panel Replacing an EMI Filler Panel 1. Position and snap the EMI filler panel into the RMA (FIGURE 8-6). 2. Replace the RMA. See Section 9.2.6, “Replacing the RMA” on page 9-9. 3. Position and snap the EMI filler panel into the bezel (FIGURE 8-5).
8.6 Chassis Foot To remove and replace a chassis foot, proceed as follows. 8.6.1 Removing the Foot 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Lay the system unit in the service position. 3. Using a number 2 Phillips-head screwdriver, loosen the screw securing the foot to the chassis (FIGURE 8-7). 4. Remove the foot.
8.6.2 Replacing the Foot 1. Position the foot (FIGURE 8-7). 2. Using a number 2 Phillips-head screwdriver, tighten the screw securing the foot to the chassis. 3. Position the system unit in the operating position. 4. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 8.7 Speaker Assembly To remove and replace the speaker assembly, proceed as follows. 8.7.1 Removing the Speaker Assembly 1. Power off the system unit. See Section 6.
Speaker assembly Screw Speaker cable FIGURE 8-8 8.7.2 Removing and Replacing the Speaker Assembly Replacing the Speaker Assembly Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Position the speaker assembly in the chassis (FIGURE 8-8). 2. Connect the speaker cable to the motherboard. 3.
4. Replace the PCI fan assembly. See Section 8.2.2, “Replacing the PCI Fan Assembly” on page 8-6. 5. Connect the AC power cord. 6. Detach the wrist strap. 7. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 8. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 8.8 DC Switch Assembly To remove and replace the DC switch assembly, proceed as follows. 8.8.
FIGURE 8-9 System Unit Power-Off (Front Panel) Caution – Disconnect the AC power cord prior to servicing system components. 2. Disconnect the lock block (FIGURE 8-2).
3. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface.
4. Attach the wrist strap. See Section 7.2, “Attaching the Wrist Strap” on page 7-3.
5. Remove any long PCI cards and UPA graphics cards (FIGURE 8-5 and FIGURE 8-6): See Section 10.3.1, “Removing a PCI Card” on page 10-7.
Bracket tab UPA graphics card FIGURE 8-14 8-24 Removing and Replacing a UPA Graphics Card Sun Ultra 60 Service Manual • August 2001
6. Remove the PCI fan assembly (FIGURE 8-7): See Section 8.2.1, “Removing the PCI Fan Assembly” on page 8-5.
7. Remove the hard drive(s) (FIGURE 8-8): See Section 9.1.1, “Removing a Hard Drive” on page 9-2. Hard drive handle Handle latch Hard drive SCSI drive bay FIGURE 8-16 Removing and Replacing a Hard Drive Caution – Prior to removing the SCSI drive bay, ensure that all necessary cables have been removed and that all cables are clear of the chassis area surrounding the drive bay area.
8. Remove the SCSI drive bay (FIGURE 8-17): a. Disconnect the SCSI cables. Note – For better access to the SCSI cable terminator board connector, partially remove the RMA (removal media assembly). To partially remove the RMA, refer to Section 9.2 in the Sun Ultra 60 Service Manual. b. Disconnect the peripheral power cable. c. Remove the peripheral power cable from the cable routing clips. d. Remove the diskette drive cable from the plastic spring clips installed adjacent to the drive bay. e.
Screw (2) To terminator board SCSI cable SCSI drive bay SCSI cable RMA FIGURE 8-17 8-28 Removing and Replacing the SCSI Drive Bay Sun Ultra 60 Service Manual • August 2001
9. Disconnect the DC switch assembly power connector from motherboard connector J3504 (FIGURE 8-18). DC power connector DC power cable routing FIGURE 8-18 J3504 DC Switch Assembly Cable Routing 10. Remove the DC switch assembly power cable from the cable routing clips. 11. Remove the front panel (FIGURE 8-19): a. Remove the front panel bezel. b. Remove the front panel nameplate and light pipe. c.
Front panel Screw (4) Light pipe Bezel Nameplate FIGURE 8-19 Removing and Replacing the Front Panel 12. Remove the DC switch assembly from the front panel (FIGURE 8-20): a. Accessing the rear of the front panel and using a small flat-blade screwdriver, press the detent tab on one side of the DC switch assembly while pushing the switch toward the front of the front panel. b. Repeat Step a for the other side of the DC switch assembly. c.
Detent tab (2) FIGURE 8-20 8.8.2 Removing and Replacing the Front Panel DC Switch Assembly Replacing the DC Switch Assembly This procedure revises the DC switch assembly replacement procedure found in the Sun Ultra 60 Service Manual, part number 805-1709. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface.
1. Replace the DC switch assembly through the front of the front panel (FIGURE 8-20): a. Feed the DC switch assembly power cable through the front of the front panel. b. Using a small flat-blade screwdriver, press the detent tab on one side of the DC switch assembly while pushing the switch into the front panel from the front. c. Repeat Step b for the other side of the DC switch assembly. d.
c. Connect the SCSI cables. d. If necessary, replace the RMA (refer to Section 9.2 in the Sun Ultra 60 Service Manual. e. Feed the peripheral power cable through the chassis opening. f. Route the diskette drive cable through the plastic spring clips installed adjacent to the drive bay. g. Route the peripheral power cable through the cable routing clips. h. Connect the peripheral power cable. 6. Replace the hard drive(s) (FIGURE 8-16): See Section 9.1.2, “Replacing a Hard Drive” on page 9-3.
Side access cover System unit (service position) System unit front FIGURE 8-21 Replacing the Side Access Cover 12. Connect the lock block (FIGURE 8-10). 13. Position the system unit in the operating position. 14. Reconnect cables to any peripheral equipment. 15. Turn on the power to the monitor. 16. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2.
FIGURE 8-22 System Unit Power-On (Front Panel) Power on key FIGURE 8-23 Sun Type-5 Keyboard Chapter 8 Major Subassemblies 8-35
8.9 CPU Fan Assembly To remove and replace the CPU fan assembly, proceed as follows. 8.9.1 Removing the CPU Fan Assembly 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat.
Metal handle Snap catch Shroud assembly Power cable FIGURE 8-24 8.9.2 Removing and Replacing the CPU Fan Assembly Replacing the CPU Fan Assembly Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Connect the CPU fan assembly as follows (FIGURE 8-24): a.
2. Connect the AC power cord. 3. Detach the wrist strap. 4. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 5. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 8.10 Shroud Assembly To remove and replace the shroud assembly, proceed as follows. 8.10.1 Removing the Shroud Assembly 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.
6. Remove the shroud assembly from the motherboard. Power cable Locking lever Captive screw Captive screw FIGURE 8-25 8.10.2 Removing and Replacing the Shroud Assembly Replacing the Shroud Assembly Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Position the shroud assembly onto the motherboard. 2.
a. Lower the locking lever to lock the shroud assembly to the motherboard. b. Using a number 2 Phillips-head screwdriver, tighten the captive screws securing the shroud assembly to the motherboard. c. Connect the power cable to the motherboard connector J2601. 3. Replace the CPU modules. See Section 10.1.3, “Replacing the CPU Module” on page 10-4. 4. Connect the AC power cord. 5. Detach the wrist strap. 6. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 7.
CHAPTER 9 Storage Devices This chapter describes how to remove and replace the Ultra 60 storage devices. This chapter contains the following topics: ■ Hard Drive—page 9-2 ■ Removable Media Assembly Drive—page 9-4 Note – The actions required to remove and replace the major subassemblies are also illustrated with photographs and audio/visual instructions on the Sun Ultra 60 ShowMe How Multimedia Documentation, part number 704-5886.
9.1 Hard Drive To remove and replace a hard drive, proceed as follows. 9.1.1 Removing a Hard Drive 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 3.
Hard drive handle Handle latch Hard drive Drive bay FIGURE 9-1 9.1.2 Removing and Replacing a Hard Drive Replacing a Hard Drive Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the hard drive as follows (FIGURE 9-1): a. Holding the drive handle, insert the hard drive into the drive bay. b.
c. Close the hard drive handle to lock the hard drive into the system unit. 2. Connect the AC power cord. 3. Detach the wrist strap. 4. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 5. Power-on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 9.2 Removable Media Assembly Drive To remove and replace a removable media assembly (RMA) drive, it is necessary to remove and replace the RMA.
3. Attach the wrist strap. See Section 7.2, “Attaching the Wrist Strap” on page 7-3. 4. Remove the RMA as follows (FIGURE 9-2): a. Remove the front bezel. b. Using a number 2 Phillips-head screwdriver, loosen the captive screws securing the RMA to the chassis. c. Partially remove the RMA from the chassis. d. Disconnect the peripheral cables and the power cables from the drives (not illustrated). e. Remove the RMA from the chassis. 5. Place the RMA on an antistatic mat.
RMA Diskette drive CD-ROM drive (or 4-mm or 8-mm tape drive) Captive screw (2) Front bezel FIGURE 9-2 9.2.2 Removing and Replacing a RMA Drive (Part 1 of 2) Removing the CD-ROM Drive or Any X-Option Tape Drive Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1.
RMA Screw (4) CD-ROM drive or any X-option tape drive (not illustrated) Captive screw (2) Screw (4) Diskette drive FIGURE 9-3 Removing and Replacing a RMA Drive (Part 2 of 2) 2. Using a number 2 Phillips-head screwdriver, remove the four screws securing the CD-ROM drive or tape drive to the RMA. 3. Remove the CD-ROM drive or tape drive and place it on an antistatic mat.
9.2.3 Replacing the CD-ROM Drive or Any X-Option Tape Drive Note – If installing a CD-ROM drive or any X-option tape drive (verses replacing), ensure that the peripheral power cable and all data cables are properly routed through the clips adjacent to the drive bay. Route the SCSI data cable through both plastic spring clips installed adjacent to the hard disk drive bay. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat.
9.2.5 Replacing the Diskette Drive Note – If installing a diskette drive (verses replacing), ensure that the peripheral power cable and all data cables are properly routed through the clips adjacent to the drive bay. Route the diskette drive cable through both plastic spring clips installed adjacent to the hard disk drive bay. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat.
5. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 6. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2.
CHAPTER 10 Motherboard and Component Replacement This chapter describes how to remove and replace the Ultra 60 motherboard and motherboard components.
10.1 CPU Module To remove and replace the CPU module, proceed as follows. 10.1.1 Special Considerations for Systems With 450 MHz CPU Modules If you plan on installing either the Solaris™ 2.5.1 or Solaris 2.6 operating environment, you must install it using the Operating Environment Installation CD included with your new system. During the installation process, this CD installs certain software upgrade patches that support these Solaris releases running at the 450 MHz CPU speed.
3. Attach a wrist strap. See Section 7.2, “Attaching the Wrist Strap” on page 7-3. 4. Remove the CPU module as follows (FIGURE 10-1): a. Using the thumbs of both hands, simultaneously lift the two levers on the CPU module upward and to the side to approximately 135 degrees. b. Lift the CPU module upward until it clears the system unit chassis. 5. Place the CPU module on an antistatic mat.
10.1.3 Replacing the CPU Module Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the CPU module as follows (FIGURE 10-1): a. On the antistatic mat, hold the CPU module in an upright position with the plastic surface facing you. b. Move the levers on the CPU module to the 135-degree position.
c. Lower the CPU module along the vertical plastic guides until the module touches the motherboard slot socket. Lock the CPU module in place as follows: i. With both hands, simultaneously turn and press the levers down to the fully horizontal position. ii. Firmly press the module down into the socket until it is fully seated and the levers are fully locked. 2. Connect the AC power cord. 3. Detach the wrist strap. 4. Replace the side access cover. See Section 7.
5. Remove the NVRAM/TOD as follows (FIGURE 10-2): a. Locate the NVRAM/TOD and carrier on the motherboard. b. Grasp the NVRAM/TOD carrier at each end and pull straight up. Note – Gently wiggle the NVRAM/TOD as necessary. 6. Place the NVRAM/TOD and carrier on an antistatic mat. NVRAM/TOD Carrier FIGURE 10-2 10.2.2 Removing and Replacing the NVRAM/TOD Replacing the NVRAM/TOD Caution – Use proper ESD grounding techniques when handling components.
1. Replace the NVRAM/TOD as follows (FIGURE 10-2): a. Position the NVRAM/TOD and carrier on the motherboard. b. Carefully insert the NVRAM/TOD and carrier into the socket. Note – The carrier is keyed so the NVRAM/TOD can be installed only one way. c. Push the NVRAM/TOD into the carrier until properly seated. 2. Replace the power supply. See Section 8.1.2, “Replacing the Power Supply” on page 8-3. 3. Connect the AC power cord. 4. Detach the wrist strap. 5. Replace the side access cover. See Section 7.
4. Attach the wrist strap. See Section 7.2, “Attaching the Wrist Strap” on page 7-3. 5. Remove the PCI card as follows (FIGURE 10-3): a. Using a Phillips-head screwdriver, remove the screw securing the PCI card bracket tab to the system unit chassis (not illustrated). Caution – Avoid damaging the connector by not applying force to one end or one side of the board. b. At the two upper corners of the PCI card, pull the card straight up from the slot. c. Remove the PCI card. 6.
10.3.2 Replacing a PCI Card Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Note – Read the PCI card product guide for information about jumper or switch settings, slot requirements, and required tools. 1. Replace the PCI card as follows (FIGURE 10-3): a. Position the PCI card into the chassis. b.
10.4 UPA Graphics Card To remove and replace a UPA graphics card, proceed as follows. 10.4.1 Removing the UPA Graphics Card 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Disconnect the video cable from the graphics card video connector. 3. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components.
Screw UPA graphics card FIGURE 10-4 10.4.2 Removing and Replacing a UPA Graphics Card Replacing the UPA Graphics Card Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the UPA graphics card as follows (FIGURE 10-4): a. Position the UPA graphics card into the chassis. b.
c. Lower the UPA graphics card connector so that it touches its associated UPA card slot on the motherboard. Caution – Avoid damaging the connector by not applying force to one end or one side of the board. Note – The UPA graphics card connector is a double-row connector that requires two levels of insertion. When installing the graphics card, ensure that the connector is fully seated into the slot. d.
Caution – Each DIMM bank must contain at least four DIMMs of equal density (for example: four 32-Mbyte DIMMs) to function properly. Do not mix DIMM densities in any bank. Note – The system unit must have at least four identical DIMMs installed in any DIMM bank. TABLE 10-1 identifies DIMM installation locations. TABLE 10-1 10.5.
4. Remove the power supply. See Section 8.1.1, “Removing the Power Supply” on page 8-2. 5. Locate the DIMM to be removed. 6. Push the lever away from the DIMM. 7. Remove the DIMM from the socket (FIGURE 10-5). 8. Place the DIMM on an antistatic mat.
10.5.2 Replacing a DIMM Caution – DIMMs are made of electronic components that are extremely sensitive to static electricity. Ordinary amounts of static electricity from clothing or work environment can destroy the DIMM. Caution – Do not remove any DIMM from the antistatic container until ready to install it on the motherboard. Handle DIMMs only by their edges. Do not touch DIMM components or metal parts. Always wear a grounding strap when handling DIMMs.
Note – Proper DIMM seating is verified by a clicking sound. Ensure proper seating occurs. 4. Replace the power supply. See Section 8.1.2, “Replacing the Power Supply” on page 8-3. 5. Connect the AC power cord. 6. Detach the wrist strap. 7. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 8. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. 10.6 Audio Card To remove and replace the audio card, proceed as follows. 10.6.
5. Remove the audio card as follows (FIGURE 10-6): a. Using a Phillips-head screwdriver, remove the screw securing the audio card bracket tab to the system unit chassis. Caution – Avoid damaging the connector by not applying force to one end or one side of the board. b. Remove the UPA graphics card(s). See Section 10.4.1, “Removing the UPA Graphics Card” on page 10-10. c. At the two upper corners of the audio card, pull the card straight up from the slot. d. Remove the audio card. 6.
Screw Audio card FIGURE 10-6 10.6.2 Removing and Replacing the Audio Card Replacing the Audio Card Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 1. Replace the audio module as follows (FIGURE 10-6): a. Position the audio module into the chassis. b.
c. At the two upper corners of the card, push the card straight down into the slot until the card is fully seated. d. Using a Phillips-head screwdriver, replace the screw securing the audio module to the system unit chassis. e. Replace the UPA graphics card(s). See Section 10.4.2, “Replacing the UPA Graphics Card” on page 10-11. 2. Connect the AC power cord. 3. Detach the wrist strap. 4. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 5.
10.7.1 Removing a Motherboard 1. Power off the system unit. See Section 6.2, “Powering Off the System Unit” on page 6-3. 2. Remove the side access cover. See Section 7.1, “Removing the Side Access Cover” on page 7-2. Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. 3. Attach a wrist strap. See Section 7.
■ Loosen the two captive screws (until they pop up) securing the shroud assembly and the motherboard to the chassis (FIGURE 10-8). e. Grasping the shroud assembly handle, lift the motherboard from the chassis. Caution – Handle the motherboard by the handle, back panel, or the edges only. 6. Place the motherboard on an antistatic mat. 7. Remove the following from the motherboard: ■ ■ ■ ■ CPU modules. See Section 10.1.2, “Removing the CPU Module” on page 10-2. NVRAM/TOD with carrier. See Section 10.2.
Handle Captive screw (not illustrated) Motherboard Captive screw (not illustrated) FIGURE 10-8 10-22 Removing and Replacing the Motherboard (Part 2 of 2) Sun Ultra 60 Service Manual • August 2001
10.7.2 Replacing a Motherboard Caution – Use proper ESD grounding techniques when handling components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Caution – Handle the motherboard by the handle, back panel, or the edges only. Note – Jumpers J2604 and J2605 can be set to either RS-423 or RS-232 serial interface. The jumpers are preset for RS-423.
Top U1004 U1003 U1002 U1001 U0904 U0903 U0902 U0901 U0804 U0803 U0802 U0801 U0704 U0703 U0702 U0701 Jumpers J2702 J2604 J2605 J2801 J2804 J0102 J0202 J3001 Bottom FIGURE 10-9 Location of the Motherboard Serial Port Jumpers Note – Motherboard jumpers are identified with part numbers. Jumper pins are located immediately adjacent to the part number. Pin 1 is marked with an asterisk in any of the positions shown (FIGURE 10-10). Ensure that the serial port jumpers are set correctly.
3. Replace the motherboard as follows: a. Replace the following to the motherboard: ■ ■ ■ ■ NVRAM/TOD with carrier. See Section 10.2.2, “Replacing the NVRAM/TOD” on page 10-6. DIMMs. See Section 10.5.2, “Replacing a DIMM” on page 10-15. Shroud assembly. See Section 8.10.2, “Replacing the Shroud Assembly” on page 8-39. CPU modules. See Section 10.1.3, “Replacing the CPU Module” on page 10-4. b. Grasping the shroud assembly handle, position the motherboard into the chassis. c.
5. Connect the AC power cord. 6. Detach the wrist strap. 7. Replace the side access cover. See Section 7.3, “Replacing the Side Access Cover” on page 7-4. 8. Reset the #power-cycles NVRAM variable to zero as follows: a. Power on the system unit. See Section 6.1, “Powering On the System Unit” on page 6-2. b. Press the keyboard Stop and A keys after the system banner appears on the monitor. c. At the ok prompt, type: ok setenv #power-cycles 0 d.
CHAPTER 11 Illustrated Parts List This chapter lists the authorized replaceable parts for the Ultra 60 computer (system unit). FIGURE 11-1 illustrates an exploded view of the system unit. TABLE 11-1 lists the system unit replaceable components. A brief description of each listed component is also provided.
20 1 19 2 3 18 17 4 5 16 15 14 13 6 12 11 7 9 10 FIGURE 11-1 11-2 System Unit Exploded View Sun Ultra 60 Service Manual • August 2001 8
TABLE 11-1 System Unit Replaceable Components Numerical Reference Component Description 1 2.1-Gbyte SCSI assembly Hard disk drive 1 4.2-Gbyte SCSI assembly Hard disk drive 1 9.
TABLE 11-1 System Unit Replaceable Components (Continued) Numerical Reference Component Description 16 16-Mbyte DIMM 60-ns, 16-Mbyte DSIMM 16 32-Mbyte DIMM 60-ns, 32-Mbyte DSIMM 16 64-Mbyte DIMM 60-ns, 64-Mbyte DSIMM 16 128-Mbyte DIMM 60-ns, 128-Mbyte DSIMM 17 Audio module Audio applications 18 Shroud assembly Fan shroud 19 CPU fan assembly Fan assembly, part of shroud assembly 20 CPU module 300-MHz, 2-Mbyte external cache Not illustrated Diskette drive cable Diskette drive ca
APPENDIX A Product Specifications This appendix provides product specifications for the Ultra 60 computer.
A.1 Physical Specifications TABLE A-1 lists physical specifications for the system unit. TABLE A-1 A.2 System Unit Physical Specifications Specification U.S.A. Height 17.70 in. Width 7.50 in. 19.00 cm Depth 17.60 in. 49.60 cm Weight (approximate) 38.80 lb. 17.60 kg Electrical Specifications TABLE A-2 lists electrical specifications for the system unit.
A.3 Environmental Requirements TABLE A-3 lists environmental requirements for the system unit.
A-4 Sun Ultra 60 Service Manual • August 2001
APPENDIX B Signal Descriptions This appendix describes the Ultra 60 motherboard connector signals and pin assignments.
B.1 Keyboard/Mouse and Serial Ports A and B B.1.1 Keyboard/Mouse Connector The keyboard/mouse connector is a DIN-8 type connector located on the motherboard back panel. FIGURE B-1 illustrates the keyboard/mouse connector configuration and TABLE B-1 lists the connector pin assignments.
B.1.2 Serial Port A and B (RS-423/RS-232) Connectors The serial port A and B connectors are DB-25 type connectors located on the motherboard back panel. FIGURE B-2 illustrates the serial port A and serial port B connector configuration and TABLE B-2 lists the connector pin assignments.
TABLE B-2 Serial Port A and B Connector Pin Assignments (Continued) Pin Mnemonic Signal Name Description 5 CTS Clear To Send Used by the DCE to indicate if it is ready to receive data from the DTE. When CTS, DSR, RTS and DTR are ON, the DCE is ready to transmit data received from the DTE across the communications channel. When only CTS is ON, the DCE is ready to accept dialing or control signals only. When CTS is OFF, the DTE should not transfer data across TXD.
TABLE B-2 Pin Signal Name Description 18 Not connected None. 19 Not connected None. Data Terminal Ready Used to control switching of the DCE to the communication channel. 21 Not connected None. 22 Not connected None. 23 Not connected None. Terminal Clock Generated by the DTE to provide timing information to the DCE. Used only in synchronous mode and only when the driver requests a locally generated clock. Otherwise, TXC echoes the modem-generated clock.
8 B.
11 34 34 35 35 68 68 FIGURE B-4 UltraSCSI Connector Pin Configuration TABLE B-4 UltraSCSI Connector Pin Assignments Pin Signal Name Description 1 Gnd Ground 2 Gnd Ground 3 Gnd Ground 4 Gnd Ground 5 Gnd Ground 6 Gnd Ground 7 Gnd Ground 8 Gnd Ground 9 Gnd Ground 10 Gnd Ground 11 Gnd Ground 12 Gnd Ground 13 Gnd Ground 14 Gnd Ground 15 Gnd Ground 16 Gnd Ground Appendix B Signal Descriptions B-7
TABLE B-4 B-8 UltraSCSI Connector Pin Assignments (Continued) Pin Signal Name Description 17 Termpower Termpower 18 Termpower Termpower 19 Not used Undefined 20 Gnd Ground 21 Gnd Ground 22 Gnd Ground 23 Gnd Ground 24 Gnd Ground 25 Gnd Ground 26 Gnd Ground 27 Gnd Ground 28 Gnd Ground 29 Gnd Ground 30 Gnd Ground 31 Gnd Ground 32 Gnd Ground 33 Gnd Ground 34 Gnd Ground 35 Dat<12>_ Data 12 36 Dat<13>_ Data 13 37 Dat<14>_ Data 14 38 Dat<15>_ D
TABLE B-4 UltraSCSI Connector Pin Assignments (Continued) Pin Signal Name Description 40 Dat<0>_ Data 0 41 Dat<1>_ Data 1 42 Dat<2>_ Data 2 43 Dat<3>_ Data 3 44 Dat<4>_ Data 4 45 Dat<5>_ Data 5 46 Dat<6>_ Data 6 47 Dat<7>_ Data 7 48 Par0 l_ Parity 0 49 Gnd Ground 50 Term_dis_ Term disable 51 Termpower Termpower 52 Termpower Termpower 53 Not used Undefined 54 Gnd Ground 55 Atn_ Attention 56 Gnd Ground 57 Bsy_ Busy 58 Ack_ Acknowledge 59 Rst_ Res
TABLE B-4 UltraSCSI Connector Pin Assignments (Continued) Pin Signal Name Description 63 Req_ Request 64 IO_ In/Out 65 Dat<8>_ Data 8 66 Dat<9>_ Data 9 67 Dat<10>_ Data 10 68 Dat<11>_ Data 11 Note: _ (underscore) signifies active low B.4 Audio Connectors The audio connectors are located on the audio card. These connectors use EIA standard 3.5-mm/0.125-inch jacks. FIGURE B-5 illustrates each audio connector configuration and TABLE B-5 lists each connector line assignment.
Headphones B.5 Line-out Line-in Microphone FIGURE B-5 Audio Connector Configuration TABLE B-5 Audio Connector Line Assignment Component Headphones Line Out Line In Microphone Tip Left channel Left channel Left channel Left channel Ring (center) Right channel Right channel Right channel Right channel Shield Ground Ground Ground Ground Parallel Port Connector The parallel port connector is a DB-25 type connector located on the motherboard back panel.
13 1 25 B-12 14 FIGURE B-6 Parallel Port Connector Pin Configuration TABLE B-6 Parallel Port Connector Pin Assignments Pin Mnemonic Signal Name Description 1 Data_Strobe_L Data Strobe Low Set low during forward channel transfers to latch data into peripheral device. Set high during reverse channel transfers. 2 to 9 Data[0..7] Data0 Thru Data7 The main data bus for the parallel port. Data0 is the least significant bit (LSB). Are not used during reverse channel transfers.
TABLE B-6 Parallel Port Connector Pin Assignments (Continued) Pin Mnemonic Signal Name Description 14 AFXN_L Auto Feed Low Set low by the host to drive the peripheral into auto-line feed mode during forward channel transfer. During reverse channel transfer, set low to indicate host can receive peripheral device data and then set high to acknowledge receipt of peripheral data. 15 ERROR_L Error Low Set low by the peripheral device to indicate an error during forward channel transfer.
B.6 Media Independent Interface Connector The media independent interface (MII) connector is located on the mother board back panel. FIGURE B-7 illustrates the MII connector configuration and TABLE B-7 lists the connector pin assignments.
TABLE B-7 MII Connector Pin Assignments (Continued) Pin Signal Name Description 13 Tx en Transmit data enable 14 Txd0 Transmit data 0 15 Txd1 Transmit data 1 16 Txd2 Transmit data 2 17 Txd3 Transmit data 3 18 Col Collision detected 19 Crs Carrier sense 20 Pwr Power 21 Pwr Power 22 Gnd Ground 23 Gnd Ground 24 Gnd Ground 25 Gnd Ground 26 Gnd Ground 27 Gnd Ground 28 Gnd Ground 29 Gnd Ground 30 Gnd Ground 31 Gnd Ground 32 Gnd Ground 33 Gnd Groun
TABLE B-7 B.7 MII Connector Pin Assignments (Continued) Pin Signal Name Description 36 Gnd Ground 37 Gnd Ground 38 Gnd Ground 39 Gnd Ground 40 Pwr Power UPA Graphics Card Connector The UPA graphics card connector is located on the UPA graphics card. FIGURE B-8 illustrates the UPA graphics card connector configuration and TABLE B-8 lists the connector pin assignments.
TABLE B-8 UPA Graphics Card Connector Pin Assignments (Continued) Pin Signal Name Description 2 Vert Sync Vertical Sync 3 Sense <0> Sense <0> 4 Gnd Ground 5 Comp Sync Composite Sync 6 Horiz Sync Horizontal Sync 7 Serial Write Serial Write 8 Sense <1> Sense <1> 9 Sense <2> Sense <2> 10 Gnd Ground Appendix B Signal Descriptions B-17
B-18 Sun Ultra 60 Service Manual • August 2001
APPENDIX C Functional Description This section provides a functional description for the Ultra 60 computer (system unit).
C.1 System Unit The system unit is an UltraSPARC port architecture (UPA)-based multiprocessor machine that uses peripheral component interconnect (PCI) as the I/O bus. The CPU modules, PSYCHO+ ASIC (UPA-to-PCI bridge), and UPA graphics cards communicate with each other using the UPA protocol. The CPU modules and the PSYCHO+ ASIC are UPA master-slave devices. The UPA graphics cards are UPA slave-only devices.
UPA_AD2 UPA_AD3 UPA_AD0 Memory address/control Marvin ASIC CPU module 0 UPA_AD1 Control CPU module 1 PSYCHO+ ASIC Memory UPA_DATA 1 UPA_DATA0 144 144 UPA graphics slots 0, 1 UPA_DATA2 Memory data 576 K9+ ASIC 64 UPA_DATA3 72 Clock control SCSI bus 66-MHz/64-bit PCI bus 33-MHz/64-bit PCI bus (External) Symbios SCSI bus controller PCI slot 2 Cheerio ASIC (Internal) 8 PCI slot 3 EBus2 Audio module Serial ports XCVR PCI slot 4 PCI 66 Slot 1 SuperIO ASIC 10/100 Ethernet RISC ASI
C.1.1 UPA Interconnect The UltraSPARC port architecture (UPA) provides a packet-based interconnect between the UPA clients: CPU modules, PSYCHO+ ASIC, UPA graphics cards. Electrical interconnection is provided through four address buses and four data buses. See FIGURE C-2.
UPA_AD0 UPA_ADDRBUS0 <35:0> CPU module 0 UPA_DATA0 P Bus UPA_AD1 UPA_AD2 Marvin ASIC UPA_DATA1 PSYCHO+ ASIC UPA_DATA3 XB9+ ASIC I Bus UPA_AD3 UPA_ADDRBUS1 <28:0> UPA_AD3 FIGURE C-2 C.1.2 CPU module 1 UPA graphics 0 UPA graphics 1 UPA_DATA2 UPA_DATA2 UPA Address and Data Buses Functional Block Diagram System Controller The system controller ASIC, also known as Marvin, implements the central resource for the UPA protocol.
C.1.3 PCI Bus The peripheral component interconnect (PCI) bus is a high-performance 32-bit or 64-bit bus with multiplexed address and data lines. The PCI bus provides electrical interconnect between highly integrated peripheral controller components, peripheral add-on devices, and the processor/memory system. There are two PCI buses (FIGURE C-1). All PCI slots can accommodate “long” PCI cards, and each slot supplies up to 15W of power. Each bus is controlled by the UPA-to-PCI bridge (PSYCHO+) ASIC.
C.1.3.3 Cheerio ASIC The PCI-to-EBus/Ethernet controller (Cheerio) ASIC bridges the PCI bus to the EBus, enabling communication between the PCI bus and all miscellaneous I/O functions, as well as the connection to slower on-board functions. The Cheerio ASIC also contains the 10/100Mb Ethernet controller. For a brief description of the Cheerio ASIC, see Section C.1.15.3, “Cheerio” on page C-34. C.1.4 EBus2 Devices The EBus2 bus is controlled by the Cheerio ASIC, and supports several ports and devices. C.
C.1.4.5 Audio Audio has been moved on to a plug-in module using a Crystal Semiconductor CS4231 codec chip. C.1.5 UltraSPARC II Processor The UltraSPARC II processor is a high-performance, highly-integrated superscalar processor implementing the SPARC-V9 64-bit RISC architecture. The UltraSPARC II processor is capable of sustaining the execution of up to four instructions per cycle even in the presence of conditional branches and cache misses.
C.1.6 Memory System The memory system (FIGURE C-3) consists of three components: the system controller (Marvin ASIC), the buffered crossbar chip (K9+ ASIC), and the memory module. The Marvin ASIC generates memory addresses and control signals to the memory module. The Marvin ASIC also coordinates the data transfers among the DIMMs through two 144-bit-wide processor data buses (UPA_DATA0 and UPA_DATA1) and the two I/O data bus; UPA_DATA2 and UPA_DATA3. DIMMs are organized in banks in groups of four (quads).
MEM_ADDR MEM_RASA2_L MEM_RASA0_L Marvin ASIC MEM_CASR2_L MEM_CASR0_L MEM_WRR2_L Memory interface MEM_WRR0_L MEM_A_SEL MEM_B_SEL Memory module MEM_A_RD MEM_B_RD MEM_A_WR MEM_B_WR UPA_DATA0<143..000> K9+ ASIC MEM_DAT<575..000> UPA_DATA1<143..000> UPA_DATA2<63..00> UPA_DATA3<71..00> FIGURE C-3 Memory System Functional Block Diagram As shown in FIGURE C-4, the memory module is arranged in four banks. DIMMs are always accessed four at a time.
Bank 0 U0701 MEM_ADR_A WE_A_L Bank 1 MEM_ADR_A U0702 U0703 U0801 U0802 WE_A_L U0704 RAS0_L RAS1_L CAS0_L CAS0_L U0803 U0804 MEM_DAT MEM_DAT Bank 2 U0901 MEM_ADR_B WE_B_L Bank 3 MEM_ADR_B U0902 U0903 U1001 U1002 WE_B_L U0904 U1003 U1004 RAS2_L RAS3_L CAS2_L CAS2_L MEM_DAT FIGURE C-4 Memory Module Functional Block Diagram Appendix C Functional Description C-11
System Top U1004 U1003 Bank 3 U1002 U1001 U0904 Bank 2 U0903 U0902 U0901 System Front U0804 U0803 Bank 1 U0802 U0801 U0704 Bank 0 U0703 U0702 U0701 System Bottom FIGURE C-5 C-12 DIMM Mapping Sun Ultra 60 Service Manual • August 2001
C.1.6.1 DIMM The DIMM is a 60-nanosecond, fast-page-mode-style DIMM. Four DIMM configurations are supported in the system unit: 16-Mbyte, 32-Mbyte, 64-Mbyte, and 128-Mbyte. The minimum memory capacity is 64 Mbytes (four 16-Mbyte DIMMs). The maximum memory capacity is 2 Gbytes (sixteen 128-Mbyte DIMMs). A block of data (64 bytes) always comes from one bank of DIMMs. An error code containing the address of where a failure occurred, as well as the associated syndrome, is logged when an ECC error occurs.
TABLE C-3 IL = 0, DIMM Bank-to-Physical Address Mapping DIMM Bank PA[30:28] 0000 0 0001 0010 1 0011 1000 2 1001 1010 3 1011 C.1.6.2 Memory System Timing The Marvin ASIC generates the memory addresses and control signals to the memory system. The UPA clock is the clock source for the Marvin ASIC and operates as fast as 120-MHz. C.1.7 Graphics and Imaging The system unit takes advantage of UPA features to provide high-performance graphics.
The single buffer UPA graphics card accelerates applications-like windowing, 2-D graphics, imaging, and video. The DBZ UPA graphics card adds double-buffering capabilities and a Z-buffer for accelerating 3-D graphics and animation. The single buffer graphics card uses a 75-MHz frame buffer clock and the DBZ graphics card uses an 83-MHz clock. C.1.7.
C.1.8.1 CD-ROM Drive The CD-ROM drive is a standard SCSI interface device with multimedia features. This includes multi-session capability and fast access (12X-speed) for image and video data. The CD-ROM drive dimensions are 5.94 inch (149.5 mm) x 7.78 inch (196 mm) x 1.71 inch (43 mm) and the drive slot is a standard 1.6-inch (40.64 mm) bay that uses industry standard bezels. Headphone access, eject, pin eject, and volume control are available on the front panel.
standby mode. The diskette drive is connected to the SCSI backplane with a 34-pin ribbon cable. The maximum cable length is 1.5 meters. From the SCSI backplane, the diskette drive is cabled to the motherboard with the SCSI connections. Diskette Drive Signals TABLE C-4 lists diskette drive signals by mnemonic name and provides the function. TABLE C-4 Diskette Drive Signals and Functions Signal Name Function MODE_SELECT When active low, MODE_SELECT sets the drive for a 1.2-Mbyte formatted disk.
TABLE C-4 C.1.8.3 Diskette Drive Signals and Functions (Continued) Signal Name Function TRACK0 When active low, TRACK0 indicates that the track zero sensor has been activated and that the heads are over the outermost cylinder. WRITE_PROTECT When active low, WRITE_PROTECT indicates that the inserted diskette is writeprotected and that drive write operations are disabled. READ_DATA When active, READ_DATA enables data from the disk to be transferred to the host through this signal line.
C.1.9 Other RMA Storage Device X-Options The system unit supports other RMA storage device X-options that can be installed in the system unit in lieu of the CD-ROM drive. These storage device X-options include the 4-GByte 4-mm DDS and DDS3 tape drives, the 12-GByte 4-mm DDS3 tape drive, the 8705XDX, 7-GByte tape drive, and the SLR5 QIC tape drive. For a listing of all X-options, refer to the product guide. C.1.
Parallel port DB-25 EMI filter Parallel port SuperIO Cheerio ASIC Serial port 1 2 Keyboard Mouse EMI filter Keyboard & mouse DIN-8 Diskette drive Mode select Density sense Diskette drive edge connector EBus Diskette controller FIGURE C-6 C.1.10.2 Keyboard and Mouse, Diskette, and Parallel Port Functional Block Diagram Diskette Port The diskette port is supported by a diskette controller, located on the SuperIO ASIC, and the Cheerio ASIC.
Power is supplied to the diskette drive from a separate connector pigtailed from the power supply. The diskette drive operates from the 5-Vdc supply and draws a maximum power of 1.1 watts operating and 44 milliwatts in standby mode. The diskette drive is connected to the SCSI backplane with a 34-pin ribbon cable. Maximum cable length is 1.5 meters. From the SCSI backplane, it is cabled to the motherboard with the SCSI connections. C.1.10.
C.1.11 Serial Port The system unit incorporates two serial ports. Each serial port is synchronous and asynchronous with full modem controls. All serial port functions are controlled by a serial port controller that is electrically connected to the system through the EBus. Line drivers and line receivers control the serial port signal levels and provide RS-232 and RS-423 compatibility. Each serial port interfaces through its own DB-25 connector.
Port A Serial port A DB-25 Line receiver RS-232/-423 select EBus Serial port controller EMI filter Line driver Serial port B DB-25 Slew rate select Port B FIGURE C-7 EMI filter Line receiver Serial Port Functional Block Diagram Serial Port Functions The serial port provides a variety of functions. Modem connection to the serial port allows access to the internet. Synchronous X.25 modems are used for telecommunications in Europe.
The preferred signaling protocol is RS-423. The higher voltages of R-232 make it difficult to switch at the higher baud rates. The maximum rate for RS-232 is approximately 64 Kbaud while the maximum rate for RS-423 is 460.8 Kbaud. The system default is set to RS-232. Synchronous Rates The serial synchronous ports operate at any rate from 50 Kbaud to 256 Kbaud when the clock is generated from the serial port controller.
The PHY chip integrates a 100BASE-T physical coding sub-layer (PCS) and a complete 10BASE-T module in a single chip. It provides a standard MII to communicate between the physical signaling and the medium access control layers for both 100BASE-X and 10BASE-T operations. The PHY IC interfaces to the 100Mbps physical-medium-dependent transceiver Twister IC.
C.1.12.2 External Transceivers The following external transceivers are connected through the MII port: ■ ■ ■ ■ C.1.12.3 6211 Micro 100BASE-FX FastEthernet transceiver CT4-1030 100BASE-T4 transceiver CFX-107X 100BASE-FX transceiver XF467A MII-to-AUI transceiver External Cables The MII port supports a 0.5-meter long, 40-conductor, 20 signal-ground, STP cable. The single-ended impedance of the cable is 68 ohms (+/-10%).
FIGURE C-8 illustrates MII being used to interconnect both integrated circuits and circuit assemblies. This enables separate signal transmission paths to exist between the reconciliation sublayer, embedded in the Cheerio ASIC, and a local PHY IC, and between the reconciliation sublayer and a remote PHY IC. The unidirectional paths between the reconciliation sublayer and the local PHY IC are composed of sections A1, B1, C1 and D1.
C.1.13 Audio Card and Connector The audio card provides various audio applications from telephone-quality speech to CD-quality music. The audio card supports four jacks of identical type: line in, line out, headphone out, and microphone in. TABLE C-6 lists the major features of the audio card and FIGURE C-9 illustrates a functional block diagram.
The audio connector supports the following: ■ Nine Codec address lines ■ Eight Codec data lines ■ Control lines: Write, read, Codec chip select, PROM chip select, reset ■ Codec DMA support signals: playback request, playback acknowledge, capture request, and capture acknowledge ■ Codec power down line ■ Audio analog lines: DC volume control line ■ Audio present ■ ■ Power/ground: Two +12 Vdc lines, one -12 Vdc line, one Vcc line, five digital grounds, and four analog grounds Two spare pins M
C.1.14 SCSI The system unit implements a small computer system interface (SCSI) Fast-20 (UltraSCSI) parallel interface bus. The UltraSCSI provides the following: ■ ■ ■ Efficient peer-to-peer I/O bus devices. Mechanical, electrical, and timing specification definition that support transfer rates of 20 or 40 Mbytes per second (corresponding to the data path width of an 8-bit, or 16-bit bus, respectively). Peak bandwidth of 40 Mbytes per second (with implemented 16-bit bus width).
The Fast-20 electrical characteristics for the host adapter and target device include: ■ ■ ■ ■ ■ C.1.14.2 Vil (input low) equals 1.0 Vdc maximum (signal true) Vih (input high) equals 1.9 Vdc minimum (signal false) Iil (input low current) equals +/- 20 µA at Vi equals 0.5 Vdc Iih (input high current) equals +/- 20 µA at Vi equals 2.7 Vdc Minimum input hysteresis equals 0.3 Vdc Supported Target Devices The SCSI subsystem supports a maximum of four internal devices, including the host adapter.
C.1.14.4 Internal SCSI Subassembly The internal SCSI subassembly consists of two cable assemblies and two SCSI cards. The SCSI subassembly is attached to the motherboard using an insulation displacement connector (IDC) receptacle attached to a 80-conductor cable. In addition to the SCSI signals, the 80-conductor cable carries diskette drive and system LED signals to the SCSI backplane card. The IDC receptacle mates with a right-angle plug that is mounted on the motherboard.
C.1.14.5 SCSI ID Selection The motherboard host adapter is assigned the SCSI identification of 7 for both ports. The two internal drives attached to the SCA-2 connectors have a SCSI identification of 0 and 1, while the CD-ROM has an identification of 6. C.1.15 ASICs The system unit achieves a high level of integration through application-specific intergrated circuits (ASICs). All ASICs are 1149.1 (JTAG) compliant.
C.1.15.2 Marvin The Marvin ASIC provides system control. It controls the UPA interconnect between the major system unit components and main memory. The Marvin ASIC provides the following: ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ C.1.15.
C.1.15.5 ■ One 64-bit merge buffer used to perform partial DVMA write in consistent mode. The merge buffer participates in the UPA coherence protocol. ■ Two separate 16-entry streaming caches, one for each bus segment, for accelerating some kinds of PCI DVMA activity. Single IOMMU with 16-entry TLB for mapping DVMA addresses for both buses (IOMMU used to translate 32-bit or 64-bit PCI addresses into 41-bit UPA addresses).
C.1.16 ■ Determines system clock frequency ■ Controls reset generation ■ Performs PCI bus and miscellaneous interrupt concentration for PSYCHO+ ■ Controls flash PROM programming, frequency margining, and lab console operation ■ 33-MHz operation ■ 3.3-Vdc and 5-Vdc supply voltage SuperIO The SuperIO is a commercial, off-the-shelf component that controls the keyboard, diskette, and parallel port interfaces.
TABLE C-8 Power Supply Output Values (Continued) Output Voltage (Vdc) Max Current (A) Regulation Band 3 12.0 6.0 11.65 to 12.60 4 -12.0 0.4 -12.60 to -11.40 5 2.5 to 3.5 25.0 +/- 2% Note – The combined power of output 1 and output 3 must be less than 300 watts. C.2.1 Control Signals With the exception of the PowerOn signal, all power supply control signals are at TTL signal levels. TABLE C-9 lists these control signal values.
Turning the System Unit On The system unit can be turned on in the following ways: ■ ■ ■ C-38 Keyboard switch Set the TOD timer to wake-up at a given time Power switch on front of system Sun Ultra 60 Service Manual • August 2001
Turning the System Unit Off The system unit can be turned off in the following ways: ■ ■ ■ ■ ■ Type power-off from shell window (this does a graceful shutdown) Halt system and type power-off from the OBP Activate Energy Star Press the keyboard Shift and Power key simultaneously from the OBP Press power switch on front of system unit Note – Energy Star powers off the system only after a period of inactivity and will turn the system back on if set by the user.
TABLE C-10 300-MHz (3.3-ns) CPU Module(s) Power Estimate Description Qty 2.5-Vdc Core (amps) 3.3-Vdc System (amps) Watt (max) Watt (max) ea. ea. sub ea. sub 0.909 8.18 3.00 27.00 33.33 33.33 0.90 0.90 2.6 5.20 sub SRAM (8 data +1 tag) 9 CPU module core + I/O 1 CPU module I/O 1 BDB (@ 2.5 Vdc, EPIC 4) 2 CPU module 1 15.41 8.45 66.43 CPU module 1 15.41 8.45 66.43 13.33 13.33 0.27 1.04 0.27 2.
TABLE C-12 PCI Card (3.3 Vdc) Power Estimate Voltage Rail (Vdc) PCI Cards (Max No.) Current each (amps) Current total (amps) 5 3 0 0 3.3 1 4.55 18.18 +12 4 0.5 2.0 -12 4 0.1 0.4 Total Power (W) <= 60 Memory System TABLE C-13 lists the power estimates for the memory subsystem. TABLE C-13 Memory Subsystem Power Estimate Number of DIMMs WC current total [amps] Total Power @5 Vdc [W] 16 9.33 46.
TABLE C-14 Mass Storage Device Power Estimates (Continued) Description Qty 5-Vdc System (amps) Hard drive, 1.6-inch 7200 rpm 2 1.5 3.0 1.65 3.3 20.0 40.0 Mammoth tape 1 2.4 2.4 0.7 0.7 17.0 17.0 DBZ graphics 0 0.4 0 0.1 0 20 0.0 3 12 0.5 2.0 15 60.0 4 4.0 4.8 9.6 185 264 PCI (5 Vdc) 2.5-Vdc Core (amps) 3.3-Vdc System (amps) 12-Vdc System (amps) 5 0 4.6 18.2 4 PCI (3.3 Vdc) MII 1 Fan 2 Total 0.8 0.1 0.4 0.8 20.0 C.2.2 -12Vdc System [amps] 28.4 15.
C.2.3 Standard System Facilities In addition to the previously listed features, the system unit provides the following: C.3 ■ TOD/NVRAM for clock and identification functions ■ Flash PROM for operating system initialization. The flash PROM is re-programmable through UNIX and OBP utilities. ■ Single LED for status. If LED is lighted, the system unit has power and some functional intelligence through OBP. Motherboard FIGURE C-12 illustrates a block diagram of the system unit motherboard.
J2802 NVRAM/ TOD Serial Port A (Bottom) J4003 DIMM bank 2 U0904 U0903 U0902 U0901 DIMM bank 1 U0804 U0803 U0802 U0801 DIMM bank 0 U0704 U0703 U0702 U0701 Serial Port B (Top) J4002 TPE J2301 Rear MII J2101 U1004 U1003 U1002 U1001 J0202 J2804 J2605 Keyboard/Mouse J2501 DIMM bank 3 J2902 J3001J0102 J2801 J2604 J2702 Parallel Port J2502 J2903 J2901 J2703 Top CPUSlot 1 (J0201) SCSI J1901 Audio J3501 CPU Slot 0 (J0101) Monitor 0 J3301 Monitor 1 J3401 PCI 66 1 J1301 PCI 2 J1401 Internal SC
C.4 Jumper Descriptions Jumper configurations can be changed by setting jumper switches on the motherboard. The motherboard’s jumpers are preset at the factory. A jumper switch is closed (sometimes referred to as shorted) with the plastic cap inserted over two pins of the jumper. A jumper is open with the plastic cap inserted over one or no pin(s) of the jumper. FIGURE C-13 shows the different jumper settings that are used on the motherboard.
C.4.1 Serial Port Jumpers Serial port jumpers J2604 and J2605 can be set to either RS-423 or RS-232 serial interface. The jumpers are preset for RS-423. RS-232 is required for digital telecommunication within the European Community. TABLE C-16 identifies serial port jumper settings. If the system is being connected to a public X.25 network, the serial port mode jumper setting may need to change from RS-423 to RS-232 mode. To change the serial port mode jumper setting: 1. Power off the system unit.
C.4.2 Flash PROM Jumpers Flash PROM jumpers J2703 and J2704 are for reprogramming specific code blocks and remote programming of the flash PROM. TABLE C-17 identifies the flash PROM jumper settings. The default shunt setting of J2703 is on pins 1 and 2. Placing the shunt on pins 2 and 3 enables reprogramming of the flash PROM. TABLE C-17 C.
■ ■ ■ C.5.2 Sixteen DIMMs (grouped in banks of four) Four PCI slots One UPA64S module Enclosure Features Enclosure features include: ■ ■ ■ ■ ■ C.6 Good access for internal upgrades and service Optimized system board layout Graphics expansion module (UPA64S connector) Processor placed on plug-in module.
Appendix C Functional Description C-49
C-50 Sun Ultra 60 Service Manual • August 2001
Glossary address ASIC A unique location within computer or peripheral memory. Reference made to an address is usually for retrieving or storing data. Application-specific integrated circuit. ASP Authorized service provider. boot A term used to identify the process of reading initial software into the computer. boot PROM CDE CD-ROM DBZ DCE In Sun workstations, contains the PROM monitor program, a command interpreter used for booting, resetting, low-level configuration, and simple test procedures.
DTAG DTE Data terminal equipment. ECP Extended capability port. An IEEE.1284 standard. EMI Electro-magnetic interference. Electrical characteristic that directly or indirectly contributes to a degradation in performance of an electronic system. Ethernet A type of network hardware that provides communication between systems connected directly together by transceiver taps, transceiver cables, and various cable types such as coaxial, twisted-pair, and fiber-optic.
PCI Peripheral component interconnect. A high-performance 32- or 64-bit-wide bus with multiplexed address and data lines. PCIO PCI-to-EBus/Ethernet controller. An ASIC that bridges the PCI bus to the EBus, enabling communication between the PCI bus and all miscellaneous I/O functions, as well as the connection to slower on-board functions. PCMCIA PID POR Personal computer memory card international association. Process ID. Power-on reset. POST Power-on self-test.
UPA UPA AD 0 UPA address bus 0. Provides data interface between CPU module 0 and the QSC ASIC. UPA AD 1 UPA address bus 1. Provides data interface between CPU module 1 and the QSC ASIC.Supports slave UPA connection to the expansion slot for graphics capability. UPA AD 2 UPA address bus 2. Provides data interface between QSC ASIC and the U2P ASIC. UPA AD 3 UPA address bus 3. Provides data interface between QSC ASIC and the UPA graphics. UPA DATA 0 UPA data bus 0.
Index A B agency compliance, all above output message, ASIC FBC, C-35 C-48 3-4 built-in speaker, C-42 bypassing POST, 3-21 baud rate, verifying, 4-23 C-7, C-34 QSC, C-34 RISC, C-35 XB9+, C-33 ASICs, C-33 PCIO, C C-16 removing, 9-6 replacing, 9-8 CD-ROM drive, attaching wrist strap to chassis, 7-4, 8-22, 8-23, 8-24 audio card connector, C-28 features, C-28 functional block diagram, connector, B-10 line assignments, B-11 pin configuration, B-11 module removing, 10-16 replacing, 10-18 output messa
serial port A, B-3 serial port B, B-3 TPE, B-6 UltraSCSI, B-7 UPA graphics card, B-16 pin configuration audio, B-11 keyboard/mouse, B-2 MII, B-14 parallel port, B-12 TPE, B-6 UltraSCSI, B-7 UPA graphics card, B-16 serial port A, B-3 serial port B, TPE, bank location, bank-to-U-number mapping, failure, 4-7 physical address mapping IL = 0, C-14 physical memory address, 10-13 10-15 row location, 10-13 socket pair location, 10-13 disk drive failure, 4-3 diskette drive, C-16 cable assembly removing, 8-12 repl
error reporting, POST, Ethernet, data bus, C-5 description, C-1 3-18 C-24 automatic negotiation, C-25 C-26 C-26 MII port timing, C-26 MII power, C-26 output message, 4-17 transceivers, external, C-26 connectors, external cables, external cables, C-26 cables, SCSI, C-31 G graphics, C-14 card features, C-15 performance, C-15 H hard drive removing, 9-2 9-3 supported, C-18 host adapter, C-30 replacing, F failure CD-ROM drive, 4-3 4-7 disk drive, 4-3 power-on, 4-2 video output, 4-3 FBC ASIC, C-35
identifying, C-45 jumpers flash PROM, C-47 serial port, port timing model, power, C-27 C-26 minimum level of POST, 3-6 motherboard component replacement, 10-1 C-46 3-23 10-20 replacement, 10-1 replacing, 10-23 mouse output message, 4-18 initializing POST, K removing, keyboard LED patterns, 3-21 4-17 6-3, 8-35 output message, Sun type-5, keyboard/mouse connector, B-2 pin assignments, B-2 pin configuration, B-2 port, C-19 functional block diagram, N C-20 NVRAM output message, 4-22 NVRAM/TOD rem
4-17 floppy, 4-18 keyboard, 4-17 mouse, 4-18 NVRAM, 4-22 parallel port, 4-19 PCI/PCIO, 4-15 probe-scsi, 4-10 probe-scsi all, 4-10 SCSI, 4-23 serial port A, 4-19 component interconnect bus, power cable assembly removing, 8-11 replacing, 8-12 peripherals, C-15 Ethernet, serial port A with TIP line, serial port B, test, C-6 C-16 diskette drive, C-16 physical specifications, A-2 system unit, A-2 ported, C-16 CD-ROM drive, POST bypassing, 4-20 4-21 4-11 4-9 watch-net, 4-9 watch-net all, 4-10 watch-cloc
pre-POST preparation, 3-2 power supply, setting up tip connection, verifying baud rate, probe SCSI, 4-10 SCSI-all, 3-3 3-4 4-10 processor, UltraSPARC II, product description, 1-1 specifications, 4-10 4-10 C-8 A-1 progress reporting, POST, 9-4 8-7 shroud assembly, 8-38 side access cover, 7-2 UPA graphics card, 10-10 x-option tape drive, 9-6 SCSI drive bay, probe scsi all output message, probe scsi output message, procedures troubleshooting, 4-1 RMA, 8-2 3-18 replaceable components system un
S safety requirements, specifications electrical, A-2 5-2 physical, SCSI, C-30 drive bay removing, 8-7 replacing, 8-9 external cables, C-31 host adapter, product, standard system facilities, internal SCSI sub-assembly, C-32 C-31 C-45 supported target devices, selected jumper settings, serial port, C-22 asynchronous rates, C-24 cable length, C-24 components, C-22 EIA levels, C-23 functions, C-23 jumper settings, 10-23, C-46 jumpers, C-46 slew rate, C-24 synchronous rates, C-24 port A connector, B-
PCI cards, C-40 power-off (front panel), rear view, V 6-4, 8-20 1-5 replaceable components, 3-4 video output failure, 4-3 verifying baud rate, 1-6, 11-3 W T watch -clock, 4-5 test power supply, tip connection, setting up, -clock output message, tools required, 5-4 TPE connector pin assignments, B-6 pin configuration, B-6 TPE connector, B-5 troubleshooting procedures, 4-1 typical error code failure message, typographic conventions, 3-19 Ultra 60 series desktop workstation, UltraSCSI connecto
