User Manual

Table Of Contents

Model SM200 Data Sheet · Document Number 430145-01B · Page 14 of 21

1.6.2 Pb-Free Soldering Paste

Use of “No Clean” soldering paste is strongly recommended, as it does not require

cleaning after the soldering process

1.6.3 Cleaning

In general, cleaning the populated modules is strongly discouraged. Residuals under

the module cannot be easily removed with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the

gap between the host board and the module. The combination of soldering flux

residuals and encapsulated water could lead to short circuits between

neighboring pads. Water could also damage any stickers or labels.

• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux

residuals into the two housings, which is not accessible for post-washing

inspection. The solvent could also damage any stickers or labels.

• Ultrasonic cleaning could damage the module permanently.

The best approach is to consider using a “no clean” soldering paste and eliminate the

post-soldering cleaning step.

1.6.4 Optical Inspection

After soldering the Module to the host board, consider optical inspection to check the

following:

• Proper alignment and centering of the module over the pads.

• Proper solder joints on all pads.

• Excessive solder or contacts to neighboring pads, or vias.

1.6.5 Repeating Reflow Soldering

Only a single reflow soldering process is encouraged for host boards.

1.6.6 Wave Soldering

If a wave soldering process is required on the host boards due to the presence of

leaded components, only a single wave soldering process is encouraged.