User Manual

DRAFT COPY
Generated on
9/16/2014
10
SNAP Engine SM220 Series Data Sheet — 430000-01A
Parameter Value
TLiquidus 217ºC
Time above TL 30-60 sec (recommended: 40 sec)
Tpeak 230º - 250ºC (recommended: 235ºC)
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Figure 5: Reflow Profile Graph
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the
soldering process.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap
between the host board and the module. The combination of soldering flux residuals and
encapsulated water could lead to short circuits between neighboring pads. Water could also
damage any stickers or labels.