Service Manual Part 1
8+
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Refer to Figure 3.9.
(a) Capacitors, Resistors, MELF & SOT
Hold the nozzle of the hot air tool above the component and keep it moving to
ensure that the PCB is not damaged.
Remove the SMD and clean away any glue using the hot air tool and a pair of
tweezers.
Remove any excess solder from the pads using solderwick.
Deposit a small amount of solder paste on the pads using the solder paste dis-
penser or syringe.
Apply heat evenly to both sides of the device using the hot air gun or Weller Pyro-
pen
®
, until all the paste has reflowed. As this happens, the device will self-align
on the pads. If necessary, use tweezers to prevent the SMD from moving while
heat is being applied.
(b) SOIC, VSO, QFP, LCCC & PLCC
Hold the nozzle of the hot air tool on top of the leads and keep it moving to ensure
that the PCB is not damaged. A hot air tool with the correct size nozzle must be
used.
After a few seconds heating, use a very gentle twisting motion to allow the device
to move away from its associated pads.
Carefully remove all excess solder from the pads using a soldering iron and sol-
derwick.
Apply an even amount of solder paste along the full length of the pads, using flux
where necessary.
Align the device accurately on the pads and apply a slight pressure with the
tweezers to hold in place.
Hold the heat nozzle at an angle and move it slowly along the leads, ensuring that
the paste reflows properly.
If any fine bridges occur, use a spike or solderwick to clear. If this is necessary,
apply more solder paste before using the hot air gun again.