Datasheet

ManualsBrandsTaiwan Semiconductor ManualsDiodesSchottky Diode 500mA SOD-123

B0520LW,B0530W,B0540W

- Low power loss, high current capability, low VF

- Surface mount device type

- Moisture sensitivity level 1

- Matte Tin (Sn) lead finish with Nickel (Ni) under plate

- Halogen-free according to IEC 61249-2-21

- Case: Bend lead SOD-123 small outline plastic package

- Polarity: Indicated by cathode band

- Weight: 0.01 g (approximately)

SYMBOL UNIT

RRM

FSM

θJA

°C/W

, T

STG

°C

Notes: 1. Test Condition: 8.3ms single half sine-wave superimposed on rated load

Notes: 2. Valid provided that electrodes are kept at ambient temperature

SYMBOL UNIT

=250μA

=130μA

=20μA

=100mA

=500mA

=1000mA

= 10V

= 15V

= 20V

= 30V

= 40V

= 0 V C

Version: I1601

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

Junction Capacitance

= 25°C

f=1.0MHz

(BR)

0.300

170

Reverse Leakage Current

(Maximum Value)

130

250

0.385

0.430

0.510

0.620

μA

-55 to +125

244

B0520LW

B0530W

B0540W

410

5.5

500

Junction and Storage Temperature Range

Power Dissipation

PARAMETER

B0520LW

B0530W

B0540W

SOD-123

MECHANICAL DATA

- Terminal: Matte tin plated, lead free,

Reverse Voltage

Forward Voltage

(Maximum Value)

= 25°C

solderable per MIL-STD-202, Method 208 guaranteed

- High temperature soldering guaranteed : 260°C/10s

0.375

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T

=25°C unless otherwise noted)

PARAMETER

Reverse Breakdown Voltage

(Minimum Value)

Taiwan Semiconductor

Small Signal Product

Low VF SMD Schottky Barrier Diode

FEATURES

Thermal Resistance (Junction to Ambient) (Note 2)

Repetitive Peak Reverse Voltage

Mean Forward Current @ T

=100°C (Lead Temperature)

Non-Repetitive Peak Forward Surge Current (Note 1)

Summary of content (5 pages)

PAGE 1
B0520LW,B0530W,B0540W Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Low power loss, high current capability, low VF - Surface mount device type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) under plate - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 SOD-123 MECHANICAL DATA - Case: Bend lead SOD-123 small outline plastic package - Terminal: Matte tin plated, lead
PAGE 2
B0520LW,B0530W,B0540W Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Forward Current Derating Curve Fig.1 Typical Forward Characteristics 0.75 B0540W 1 IO Mean Forward Current (A) IF Forward Current (A) 10 B0530W B0520LW 0.1 0.5 0.25 Fig. 4 0 0.01 0.0 0.2 0.4 0.6 0.8 0 1.0 25 50 100 125 150 TL , Lead Temperature (°C) VF Forward Voltage (V) Fig. 4 Typical Junction Capacitance Fig.
PAGE 3
B0520LW,B0530W,B0540W Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. B05xxx (Note 1, 2) PACKING CODE PACKING CODE SUFFIX RH G PACKAGE PACKING SOD-123 3K / 7" Reel Note 1: "xxx" defines voltage from 20V (B0520LW) to 40V (B0540W) Note 2: Whole series with green compound EXAMPLE EXAMPLE PART NO. B0540W RH PART NO.
PAGE 4
B0520LW,B0530W,B0540W Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS SOD-123 DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.40 1.80 0.055 0.071 B 3.55 3.85 0.140 0.152 C 0.45 0.70 0.018 0.028 D 2.55 2.85 0.100 0.112 E 0.95 1.35 0.037 0.053 F 0.05 0.15 0.50 REF G H - 0.10 0.002 0.006 0.02 REF - 0.004 SUGGEST PAD LAYOUT DIM. Unit (mm) Unit (inch) Min Min G 2.25 0.089 X 0.90 0.035 X1 4.05 0.159 Y 0.95 0.037 MARKING Part No.
PAGE 5
B0520LW,B0530W,B0540W Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document.