Datasheet

ManualsBrandsTaiwan Semiconductor ManualsActive ComponentsRectifier 1 mA SOD 128 Single Tape on Full reel

S1DFS – S1MFS

Taiwan Semiconductor

1 Version: C2103

1A, 200V - 1000V Standard Surface Mount Rectifier

FEATURES

● Glass passivated chip junction

● Ideal for automated placeme

● Moisture sensitivity level: level 1, per J-STD-020

● RoHS Compliant

● Halogen-free according to IEC 61249-2-21

APPLICATIONS

● DC to DC converter

● Switching mode converters and inverters

● General purpose

MECHANICAL DATA

● Case: SOD-128

● Molding compound meets UL 94V-0 flammability rating

● Terminal: Matte tin plated leads, solderable per J-STD-002

● Meet JESD 201 class 2 whisker test

● Polarity: Indicated by cathode band

● Weight: 0.027g (approximately)

KEY PARAMETERS

PARAMETER

VALUE

UNIT

RRM

200 - 1000

FSM

J MAX

150

°C

Package

SOD-128

Configuration

Single die

SOD-128

ABSOLUTE MAXIMUM RATINGS (T

= 25°C unless otherwise noted)

PARAMETER

SYMBOL

S1DFS

S1GFS

S1JFS

S1KFS

S1MFS

UNIT

Marking code on the device

S1DFS

S1GFS

S1JFS

S1KFS

S1MFS

Repetitive peak reverse voltage

RRM

200

400

600

800

1000

Reverse voltage, total rms value

R(RMS)

140

280

420

560

700

Forward current

Surge peak forward current, 8.3 ms

single half sine-wave superimposed

on rated load

FSM

Junction temperature

-55 to +150

°C

Storage temperature

STG

-55 to +150

°C

Summary of content (5 pages)

PAGE 1
S1DFS – S1MFS Taiwan Semiconductor 1A, 200V - 1000V Standard Surface Mount Rectifier FEATURES ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placeme Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● DC to DC converter ● Switching mode converters and inverters ● General purpose PARAMETER VALUE UNIT IF 1 A VRRM 200 - 1000 V IFSM 30 A TJ MAX 150 °C Package SOD-128 Configuration Single die
PAGE 2
S1DFS – S1MFS Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 29 °C/W Junction-to-ambient thermal resistance RӨJA 82 °C/W Junction-to-case thermal resistance RӨJC 30 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 0.5A, TJ = 25°C Forward voltage IF = 1.0A, TJ = 25°C (1) IF = 0.
PAGE 3
S1DFS – S1MFS Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 CAPACITANCE (pF) 1 1 f=1.0MHz Vsig=50mVp-p 0.1 0 25 50 75 100 125 1 150 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics 10 TJ=125°C 1 0.1 0.01 TJ=25°C 0.
PAGE 4
S1DFS – S1MFS Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS SOD-128 SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code 4 Version: C2103
PAGE 5
S1DFS – S1MFS Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only.