Datasheet

SK22A – SK215A
Taiwan Semiconductor
6 Version: R2212
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-1994.
3. PACKAGE OUTLINE REFERENCE:
JEDEC DO-214, VARIATION AC, ISSUE D.
4 MOLDED PLASTIC BODY DIMENSIONS DO NOT
INCLUDE MOLD FLASH.
5 MOLDED PLASTIC BODY LATERAL DIMENSIONS
TO BE DETERMINED AT DATUM PLANE H.
6. DWG NO. REF: HQ2SD07-DO214SMC-034 REV A.
4.60
4.06
5.33
4.95
2.83
2.29
B
A
0.13 C A B
C
1.58
1.27
H
2.50
1.95
2.30
1.90
0.20
0.05
C
H
0.13 C A B
DETAIL A
4
5
4
5
SEATING
PLANE
DETAIL A, ROTATED -90°
(SCALE 2:1)
P/N = MARKING CODE
G = GREEN COMPOUND
YW = DATE CODE
F = FACTORY CODE
MARKING DIAGRAM
CATHODE
INDICATOR
GYWF
P/N
1.41
0.75
0.31
0.15
4.00
1.90
1.60
SUGGESTED PAD
LAYOUT