Datasheet

SK52C SK520C
Taiwan Semiconductor
6 Version: R2212
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
SUGGESTED PAD LAYOUT
6.80
8.15
7.75
0.13 C A B
7.15
6.60
6.25
5.55
4
5
3.20
2.90
H
C
2.65
1.95
2.45
1.90
0.20
0.05
C
1.60
0.75
0.31
0.15
H
2.00
3.60
A
B
NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-1994.
3. PACKAGE OUTLINE REFERENCE:
JEDEC DO-214, VARIATION AB, ISSUE D.
4 MOLDED PLASTIC BODY DIMENSIONS DO NOT
INCLUDE MOLD FLASH.
5 MOLDED PLASTIC BODY LATERAL DIMENSIONS
TO BE DETERMINED AT DATUM PLANE H.
6. DWG NO. REF: HQ2SD07-DO214SMC-036 REV A.
4
5
SEATING
PLANE
DETAIL A, ROTATED -9
(SCALE 3:1)
0.13 C A B
P/N = MARKING CODE
G = GREEN COMPOUND
YW = DATE CODE
F = FACTORY CODE
MARKING DIAGRAMMARKING DIAGRAM
CATHODE
INDICATOR
GYWF
P/N