Manualshelf

User Manual

ManualsBrandsTAIYO YUDEN ManualsElectronicsCatM1 Module
41424344454647484950
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CL5ADAH2Z
Confidential
2020.11.05 rev.1.1
8. Handling Precautions
8.1. Thermal Management
CLxADAH2Z have high power consumption and due to their very small size, need to be designed
properly for heat dissipation.
8.2. Desire and Conditions
This specification describes desire and conditions especially for mounting.
8.2.1. Environment conditions for use and storage
1. Store the components in an environment of < 40°C /90％RH if they are in a moisture
barrier bag packed by TAIYO YUDEN.
2. Keep the factory ambient conditions at < 30°C /60％RH .
3. Store the components in an environment of < 25±5°C /10%RH after the bag is opened.
(The condition is also applied to a stay in the manufacture process).
8.2.2. Conditions for handling of products
Make sure all of the moisture barrier bags have no holes, cracks or damages at receiving. If an
abnormality is found on the bag, its moisture level must be checked in accordance with 2 of 8.2.2.
Refer to the label on the bag.
1. All of the surface mounting process (reflow process) must be completed in 12 months
from the bag sea date.
2. Make sure humidity in the bag is less than 10%RH immediately after open, using a
humidity indicator card sealed with the components.
3. All of the surface mounting process (reflow process including rework process) must be
completed in 168 hours after the bag is opened (inclusive of any other processes).
4. If any conditions in 8.2.1. or condition 2 and 3 of 8.2.2. are not met, bake the components
in accordance with the conditions at 125°C 24h.
5. As a rule, baking the components in accordance with conditions 4 of 8.2.2. shall be once.
6. Since semi-conductors are inside of the components, they must be free from static
electricity while handled. (<100V) Use ESD protective floor mats, wrist straps, ESD
protective footwear, air ionizers etc., if necessary.
7. Please make sure that there are lessen mechanical vibration and shock for this module,
and do not drop it.
8. Please recognize pads of back side at surface mount.
9. This module should not be cleaned.