Integration Manual
Table Of Contents
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in 2G connected mode
- 1.5.1.3 VCC current consumption in 3G connected mode
- 1.5.1.4 VCC current consumption in LTE connected mode
- 1.5.1.5 VCC current consumption in cyclic low power idle mode / active mode
- 1.5.1.6 VCC current consumption in fixed active mode
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interfaces
- 1.9 Data communication interfaces
- 1.10 eMMC interface
- 1.11 Digital Audio interfaces
- 1.12 ADC interfaces
- 1.13 General Purpose Input/Output
- 1.14 Reserved pins (RSVD)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Jamming detection
- 1.15.3 IP modes of operation
- 1.15.4 Dual stack IPv4 and IPv6
- 1.15.5 Embedded TCP/IP and UDP/IP
- 1.15.6 Embedded FTP and FTPS
- 1.15.7 Embedded HTTP and HTTPS
- 1.15.8 SSL and TLS
- 1.15.9 Firmware update Over AT (FOAT)
- 1.15.10 Firmware update Over The Air (FOTA)
- 1.15.11 Power Saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for the external battery charging circuit
- 2.2.1.8 Guidelines for external charging and power path management circuit
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Guidelines for VCC supply layout design
- 2.2.1.11 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interfaces
- 2.6 Data communication interfaces
- 2.7 eMMC interface
- 2.8 Digital Audio interface
- 2.9 ADC interfaces
- 2.10 General Purpose Input/Output
- 2.11 Reserved pins (RSVD)
- 2.12 Module placement
- 2.13 Module footprint and paste mask
- 2.14 Thermal guidelines
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- 6 FCC Notes
- Appendix
- Glossary
- Related documents
- Revision history
- Contact
TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 114 of 143
1.8 V audio device with slave role connected to a digital audio interface of the module set as master
1.8 V audio device with master role connected to a digital audio interface of the module set as slave
3.0 V audio device with slave role connected to a digital audio interface of the module set as master
3.0 V audio device with master role connected to a digital audio interface of the module set as slave
The same circuits can be implemented for both I2S0 and I2S1 digital audio interfaces of the module.
TOBY-L3 series
(Master, 1.8V)
BCLK
LRCLK
SDIN
SDOUT
GND
V_INT
I2Sx_CLK
I2Sx_WA
I2Sx_TXD
I2Sx_RXD
Audio Device
(Slave, 1.8V)
GND
TOBY-L3 series
(Slave, 1.8V)
BCLK
LRCLK
SDIN
SDOUT
GND
V_INT
I2Sx_CLK
I2Sx_WA
I2Sx_TXD
I2Sx_RXD
Audio Device
(Master, 1.8V)
GND
VDD
1V8
VDD
1V8
1V8
B1 A1
GND
U1
B3 A3
VCCB
VCCA
Unidirectional
Voltage Translator
C2
C1
3V0
DIR2
DIR3OE
DIR1
B2
A2
B4 A4
DIR4
TOBY-L3 series
(Master, 1.8V)
BCLK
LRCLK
SDIN
SDOUT
GND
V_INT
I2Sx_CLK
I2Sx_WA
I2Sx_TXD
I2Sx_RXD
Audio Device
(Slave, 3.0V)
GND
VDD
TOBY-L3 series
(Slave, 1.8V)
BCLK
LRCLK
SDIN
SDOUT
GND
V_INT
I2Sx_CLK
I2Sx_WA
I2Sx_TXD
I2Sx_RXD
Audio Device
(Master, 3.0V)
GND
VDD
1V8
B1 A1
GND
U2
B3 A3
VCCB
VCCA
Unidirectional
Voltage Translator
C4
C3
3V0
DIR2
DIR4
OE
DIR3
B2 A2
B4 A4
DIR1
Figure 57: I
2
S interface application circuit with an external audio codec to provide voice capability
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
100 nF Capacitor Ceramic X5R 0402 10% 10V
GRM155R71C104KA01 – Murata
U1, U2
Unidirectional Voltage Translator
SN74AVC4T774
11
- Texas Instruments
Table 44: Example of components for an audio voice codec application circuit
Figure 58 and Table 45 describe an application circuit for the PCM digital audio interface providing basic
voice capability using an external audio voice codec, in particular the Realtek ALC5660 audio codec.
DAC and ADC integrated in the external audio codec respectively converts an incoming digital data
stream to analog audio output through a mono amplifier and converts the microphone input signal to
the digital bit stream over the digital audio interface.
A digital side-tone mixer integrated in the external audio codec provides loopback of the
microphones/ADC signal to the DAC/headphone output.
11
Voltage translator providing partial power down feature, thus external 3 V rail can be also ramped up before V_INT 1.8 V rail