Integration Manual
Table Of Contents
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in 2G connected mode
- 1.5.1.3 VCC current consumption in 3G connected mode
- 1.5.1.4 VCC current consumption in LTE connected mode
- 1.5.1.5 VCC current consumption in cyclic low power idle mode / active mode
- 1.5.1.6 VCC current consumption in fixed active mode
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interfaces
- 1.9 Data communication interfaces
- 1.10 eMMC interface
- 1.11 Digital Audio interfaces
- 1.12 ADC interfaces
- 1.13 General Purpose Input/Output
- 1.14 Reserved pins (RSVD)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Jamming detection
- 1.15.3 IP modes of operation
- 1.15.4 Dual stack IPv4 and IPv6
- 1.15.5 Embedded TCP/IP and UDP/IP
- 1.15.6 Embedded FTP and FTPS
- 1.15.7 Embedded HTTP and HTTPS
- 1.15.8 SSL and TLS
- 1.15.9 Firmware update Over AT (FOAT)
- 1.15.10 Firmware update Over The Air (FOTA)
- 1.15.11 Power Saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for the external battery charging circuit
- 2.2.1.8 Guidelines for external charging and power path management circuit
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Guidelines for VCC supply layout design
- 2.2.1.11 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interfaces
- 2.6 Data communication interfaces
- 2.7 eMMC interface
- 2.8 Digital Audio interface
- 2.9 ADC interfaces
- 2.10 General Purpose Input/Output
- 2.11 Reserved pins (RSVD)
- 2.12 Module placement
- 2.13 Module footprint and paste mask
- 2.14 Thermal guidelines
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- 6 FCC Notes
- Appendix
- Glossary
- Related documents
- Revision history
- Contact
TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 120 of 143
Light-Blue marked pads: Paste layout reduced circumferentially 0.1 mm to Copper layout
The recommended solder paste (i.e. stencil) thickness is 150 µm, according to application production process
requirements.
☞ These are recommendations only and not specifications. The exact mask geometries, distances and
stencil thicknesses must be adapted to the specific production processes of the customer.
2.14 Thermal guidelines
☞ Modules’ temperature range and thermal parameters are specified in the TOBY-L3 series Data Sheet [1].
The most critical condition concerning module thermal performance is the uplink transmission at maximum
power (data upload in connected mode), because when the baseband processor runs at full speed, radio
circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not
often encountered in real networks (for example, see the Terminal Tx Power distribution for WCDMA, taken
from operation on a live network, described in the GSMA TS.09 Battery Life Measurement and Current
Consumption Technique [10]); however the application should be correctly designed to cope with it.
During transmission at maximum RF power, the TOBY-L3 series modules generate thermal power that may
exceed 4 W in the worst case condition: this is an indicative value since the exact generated power strictly
depends on operating conditions such as the actual antenna return loss, the number of allocated TX
resource blocks, the transmitting frequency band, etc. The generated thermal power must be adequately
dissipated through the thermal and mechanical design of the application.
The spreading of the actual Module-to-Ambient thermal resistance (Rth,M-A) depends on the module
operating condition. The overall temperature distribution is influenced by the configuration of the active
components during the specific mode of operation and their different thermal resistance toward the case
interface.
☞ The actual Module-to-Ambient thermal resistance value and the relative increase of module temperature
will differ according to the specific mechanical deployments of the module, e.g. application PCB with
different dimensions and characteristics, mechanical shells enclosure, or forced air flow.
The increase of the thermal dissipation, i.e. the reduction of the actual Module-to-Ambient thermal
resistance, will decrease the temperature of the modules’ internal circuitry for a given operating ambient
temperature. This improves the device long-term reliability in particular for applications operating at high
ambient temperature.
Recommended hardware techniques to be used to improve heat dissipation in the application:
Connect each GND pin with solid ground layer of the application board and connect each ground area
of the multilayer application board with a complete thermal via stacked down to the main ground layer.
Provide a ground plane as wide as possible on the application board.