Integration Manual
Table Of Contents
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in 2G connected mode
- 1.5.1.3 VCC current consumption in 3G connected mode
- 1.5.1.4 VCC current consumption in LTE connected mode
- 1.5.1.5 VCC current consumption in cyclic low power idle mode / active mode
- 1.5.1.6 VCC current consumption in fixed active mode
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interfaces
- 1.9 Data communication interfaces
- 1.10 eMMC interface
- 1.11 Digital Audio interfaces
- 1.12 ADC interfaces
- 1.13 General Purpose Input/Output
- 1.14 Reserved pins (RSVD)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Jamming detection
- 1.15.3 IP modes of operation
- 1.15.4 Dual stack IPv4 and IPv6
- 1.15.5 Embedded TCP/IP and UDP/IP
- 1.15.6 Embedded FTP and FTPS
- 1.15.7 Embedded HTTP and HTTPS
- 1.15.8 SSL and TLS
- 1.15.9 Firmware update Over AT (FOAT)
- 1.15.10 Firmware update Over The Air (FOTA)
- 1.15.11 Power Saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for the external battery charging circuit
- 2.2.1.8 Guidelines for external charging and power path management circuit
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Guidelines for VCC supply layout design
- 2.2.1.11 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interfaces
- 2.6 Data communication interfaces
- 2.7 eMMC interface
- 2.8 Digital Audio interface
- 2.9 ADC interfaces
- 2.10 General Purpose Input/Output
- 2.11 Reserved pins (RSVD)
- 2.12 Module placement
- 2.13 Module footprint and paste mask
- 2.14 Thermal guidelines
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- 6 FCC Notes
- Appendix
- Glossary
- Related documents
- Revision history
- Contact
TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 91 of 143
Removable SIM cards are suitable for applications requiring a change of SIM card during the product’s
lifetime.
A SIM card holder can have 6 or 8 positions if a mechanical card presence detector is not provided, or it
can have 6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch
integrated in the SIM connector for the mechanical card presence detection are provided. Select a SIM
connector providing 6+2 or 8+2 positions if the optional SIM detection feature is required by the custom
application, otherwise a connector without an integrated mechanical presence switch can be selected.
Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671:
Case Pin 8 = UICC Contact C1 = VCC (Supply) It must be connected to VSIM
Case Pin 7 = UICC Contact C2 = RST (Reset) It must be connected to SIM_RST
Case Pin 6 = UICC Contact C3 = CLK (Clock) It must be connected to SIM_CLK
Case Pin 5 = UICC Contact C4 = AUX1 It must be left not connected
Case Pin 1 = UICC Contact C5 = GND (Ground) It must be connected to GND
Case Pin 2 = UICC Contact C6 = VPP It can be left not connected
Case Pin 3 = UICC Contact C7 = I/O (Data I/O) It must be connected to SIM_IO
Case Pin 4 = UICC Contact C8 = AUX2 It must be left not connected
A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses,
but only 5 contacts are required (C1, C2, C3, C5, C7) to be connected as described above.
Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once
installed.
Guidelines for single SIM card connection without detection
A removable SIM card placed in a SIM card holder must be connected to the SIM interface of TOBY-L3
series modules as shown in Figure 36, where the optional SIM detection feature is not implemented.
Follow these guidelines to connect the module to a SIM connector without SIM presence detection:
Connect the UICC / SIM contact C1 (VCC) to the VSIM pin of the module.
Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
Connect the UICC / SIM contact C5 (GND) to ground.
Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) on SIM supply line, close to the
relative pad of the SIM connector, to prevent digital noise.
Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line,
very close to each related pad of the SIM connector, to prevent RF coupling especially when the RF
antenna is placed closer than 10 - 30 cm from the SIM card holder.