Integration Manual

TSD-19090601 - R15 Contents Page 124 of 143
 To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If there
is any risk that such an exposed antenna area is touched in a non-ESD protected work area, implement
suitable ESD protection measures in the design.
 When soldering the module and patch antennas to the RF pin, make sure to use an ESD safe soldering
iron.
3.3 Soldering
3.3.1 Soldering paste
"No Clean" soldering paste is strongly recommended for TOBY-L3 series modules, as it does not require
cleaning after the soldering process has taken place. The paste listed in the example below meets these
criteria.
Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: 95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)
95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)
Melting Temperature: +217 °C
Stencil Thickness: 150 µm for base boards
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.13.
☞ The quality of the solder joints should meet the appropriate IPC specification.
3.3.2 Reflow soldering
A convection type-soldering oven is strongly recommended for TOBY-L3 series modules over the infrared
type radiation oven. Convection heated ovens allow precise control of the temperature and all parts will be
heated up evenly, regardless of material properties, thickness of components and surface color.
Refer to the ”IPC-7530A Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”.
Reflow profiles are to be selected according to the following recommendations.
⚠ Failure to observe these recommendations can result in severe damage to the device!
Preheat phase
Initial heating of component leads and balls. Residual humidity will be dried out. Note that this preheat
phase will not replace prior baking procedures.