Integration Manual

TSD-19090601 - R15 Contents Page 89 of 143
Removable SIM cards are suitable for applications requiring a change of SIM card during the product’s
lifetime.
A SIM card holder can have 6 or 8 positions if a mechanical card presence detector is not provided, or it
can have 6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch
integrated in the SIM connector for the mechanical card presence detection are provided. Select a SIM
connector providing 6+2 or 8+2 positions if the optional SIM detection feature is required by the custom
application, otherwise a connector without an integrated mechanical presence switch can be selected.
Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671:
 Case Pin 8 = UICC Contact C1 = VCC (Supply)  It must be connected to VSIM
 Case Pin 7 = UICC Contact C2 = RST (Reset)  It must be connected to SIM_RST
 Case Pin 6 = UICC Contact C3 = CLK (Clock)  It must be connected to SIM_CLK
 Case Pin 5 = UICC Contact C4 = AUX1  It must be left not connected
 Case Pin 1 = UICC Contact C5 = GND (Ground)  It must be connected to GND
 Case Pin 2 = UICC Contact C6 = VPP  It can be left not connected
 Case Pin 3 = UICC Contact C7 = I/O (Data I/O)  It must be connected to SIM_IO
 Case Pin 4 = UICC Contact C8 = AUX2  It must be left not connected
A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses,
but only 5 contacts are required (C1, C2, C3, C5, C7) to be connected as described above.
Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once
installed.
Guidelines for single SIM card connection without detection
A removable SIM card placed in a SIM card holder must be connected to the SIM interface of TOBY-L3
series modules as shown in Figure 24, where the optional SIM detection feature is not implemented.
Follow these guidelines to connect the module to a SIM connector without SIM presence detection:
 Connect the UICC / SIM contact C1 (VCC) to the VSIM pin of the module.
 Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
 Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
 Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
 Connect the UICC / SIM contact C5 (GND) to ground.
 Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) on SIM supply line, close to the
relative pad of the SIM connector, to prevent digital noise.
 Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line,
very close to each related pad of the SIM connector, to prevent RF coupling especially when the RF
antenna is placed closer than 10 - 30 cm from the SIM card holder.