Instructions

INSTRUCTION MANUAL
CCG
TDKLambda
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Fig.72 Output Current VS Ambient Temperature Measurement Method (for forced cooling)
Fig.71 Output Current VS Ambient Temperature Measurement Method (for convection cooling)
(2) Output Current VS Ambient Temperature Measurement Method (for forced cooling)
76mm
12.7mm
Ambient temperature
measurement point
Power supply
PCB
Power supply
PCB
CL
Airflow
Ambient
temperature and
air velocity
measurement
point
76mm
Top view
25.4mm
12.7mm
Airflow
7. Output Derating
71. Output Derating Measurement Method
There is no restriction on mounting direction but there should be enough consideration for airflow so
that heat dose not accumulate around the power supply vicinity. Determine external components
configuration and mounting direction on PCB such that air could flow around the power supply at
forced cooling and conventional cooling. The derating of the output current is necessary when the
ambient temperature is high. (See Output current VS Ambient Temperature.) Output current VS
Ambient Temperature is measured according to Fig.71 and Fig.72. When mounting on actual
device, do actual measurement based on measurement points shown in Fig.71 and Fig.72.
For this measurement, in order not to exceed the Rating temperature of the critical component, refer to
the case temperature measurement point shown on Fig.73.
(1) Output Current VS Ambient Temperature Measurement Method (for convection cooling)