Datasheet

ManualsBrandsTDK ManualsCapacitorsCeramic capacitor SMD 0805 3.3 pF 50 V DC 5 % (L x W x H) 2 x 1.25 x 1.25 mm 1 pc(s)

Data SheetData Sheet

Multilayer ceramic capacitors

Date: October 2006

ã EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the

information contained therein without EPCOS’ prior express consent is prohibited.

Chip capacitors, C0G

Summary of content (23 pages)

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Multilayer ceramic capacitors Chip capacitors, C0G Date: October 2006 Data Sheet ã EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited.
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Multilayer ceramic capacitors Chip C0G Ordering code system B37940 K 5 010 C 5 60 Packaging 60 62 70 72 01 ^ ^ ^ ^ ^ cardboard tape, 180-mm reel blister tape, 180-mm reel cardboard tape, 330-mm reel blister tape, 330-mm reel bulk case Decimal place for cap. values <10 pF, otherwise 0 Capacitance tolerance CR <10 pF: B ^ ±0.1 pF C ^ ±0.25 pF (standard for capacitance values ≤4.7 pF) D ^ ±0.5 pF (standard for capacitance values ≤8.
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Chip Multilayer ceramic capacitors C0G Features ■ ■ ■ ■ ■ Good thermal stability High insulation resistance Low dissipation factor Low inductance To AEC-Q200 Applications ■ ■ ■ ■ Resonant circuits Filter circuits Timing elements Coupling and filtering, particularly in RF circuits Termination ■ For soldering: Nickel barrier terminations (Ni) ■ For conductive adhesion: Silver-palladium terminations (AgPd) on request Options ■ Alternative capacitance tolerances available on request Delivery mode ■ Cardb
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Multilayer ceramic capacitors C0G C0G Capacitance tolerances CR £ 4.7 pF 5.6 pF £ CR £ 8.2 pF Code letter B C (standard) Tolerance ± 0.1 pF ± 0.25 pF (on request) D B C D (standard) ± 0.5 pF ± 0.1 pF ± 0.25 pF ± 0.
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Multilayer ceramic capacitors C0G C0G Recommended solder pad C A D KKE0308-1 Recommended dimensions (mm) for reflow soldering Case size (inch/mm) Type A C D 0402/1005 single chip 0.35 … 0.45 1.0 … 1.40 0.4 … 0.6 0603/1608 single chip 0.60 … 0.70 1.8 … 2.20 0.6 … 0.8 0805/2012 single chip 0.60 … 0.70 2.2 … 2.60 0.8 … 1.1 1206/3216 single chip 0.80 … 0.90 3.8 … 4.32 1.0 … 1.4 1210/3225 single chip 1.00 … 1.20 4.0 … 4.80 1.8 … 2.
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C0G Multilayer ceramic capacitors C0G Product range chip capacitors, C0G Size1) inch mm 0402 1005 Type B37920 VR (VDC) 50 CR 0603 1608 0805 2012 1206 3216 1210 3225 B37930 B37940 B37871 B37949 50 100 50 100 200 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.
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Multilayer ceramic capacitors C0G C0G Product range chip capacitors, C0G Size1) inch mm 0402 1005 Type B37920 VR (VDC) 50 CR 100 pF 120 pF 150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 0603 1608 0805 2012 1206 3216 1210 3225 B37930 B37940 B37871 B37949 50 100 50 100 200 1.0 nF 1.2 nF 1.5 nF 1.8 nF 2.2 nF 2.7 nF 3.3 nF 3.9 nF 4.7 nF 5.6 nF 6.8 nF 8.
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C0G Multilayer ceramic capacitors C0G; 0402 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 0402, 50 VDC Chip thickness CR1) 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 33. pF 39. pF 47. pF 56. pF 68. pF 82. pF 100.
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Multilayer ceramic capacitors C0G C0G; 0603 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 0603, 50 VDC Chip thickness CR 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 33. pF 39. pF 47. pF 56. pF 68. pF 82. pF 100. pF 120. pF 150. pF 180. pF 220. pF 270. pF 330. pF 390. pF 470.
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C0G Multilayer ceramic capacitors C0G; 0603 Ordering codes and packing for C0G, 100 VDC, nickel barrier terminations Case size 0603, 100 VDC Chip thickness CR 1.0 pF 1.5 pF 2.2 pF 3.3 pF 4.7 pF 6.8 pF 10. pF 15. pF 22. pF 33. pF 47. pF 68. pF 100. pF 150. pF 220.
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Multilayer ceramic capacitors C0G C0G; 0805 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 0805, 50 VDC Chip thickness CR 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 33. pF 39. pF 47. pF 56. pF 68. pF 82. pF 100. pF 120. pF 150. pF 180. pF 220. pF 270. pF 330. pF 390. pF 470.
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C0G Multilayer ceramic capacitors C0G; 0805 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 0805, 50 VDC Chip thickness CR 560. pF 680. pF 820. pF 1.0 nF 1.2 nF 1.5 nF 1.8 nF 2.2 nF Ordering code 1) B37940K5561J0** B37940K5681J0** B37940K5821J0** B37940K5102J0** B37940K5122J0** B37940K5152J0** B37940K5182J0** B37940K5222J0** mm 0.6 ± 0.1 0.6 ± 0.1 0.6 ± 0.1 0.6 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 1.2 ± 0.1 1.2 ± 0.
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Multilayer ceramic capacitors C0G C0G; 0805 Ordering codes and packing for C0G, 100 VDC, nickel barrier terminations Case size 0805, 100 VDC Chip thickness CR 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 33. pF 39. pF 47. pF 56. pF 68. pF 82. pF 100. pF 120. pF 150. pF 180. pF 220. pF 270. pF 330. pF 390. pF 470.
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C0G Multilayer ceramic capacitors C0G; 0805 Ordering codes and packing for C0G, 100 VDC, nickel barrier terminations Case size 0805, 100 VDC Chip thickness CR 560. pF 680. pF 820. pF 1.0 nF Ordering code 1) B37940K1561J0** B37940K1681J0** B37940K1821J0** B37940K1102J0** Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel 4000 4000 3000 3) 3000 3) mm 0.8 ± 0.1 0.8 ± 0.1 1.2 ± 0.1 1.2 ± 0.
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Multilayer ceramic capacitors C0G C0G; 1206 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 1206, 50 VDC Chip thickness CR 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 33. pF 39. pF 47. pF 56. pF 68. pF 82. pF 100. pF 120. pF 150. pF 180. pF 220. pF 270. pF 330. pF 390. pF 470.
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C0G Multilayer ceramic capacitors C0G; 1206 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 1206, 50 VDC Chip thickness CR 560. pF 680. pF 820. pF 1.0 nF 1.2 nF 1.5 nF 1.8 nF 2.2 nF 2.7 nF 3.3 nF 3.9 nF 4.7 nF 5.
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Multilayer ceramic capacitors C0G C0G; 1206 Ordering codes and packing for C0G, 100 VDC, nickel barrier terminations Case size 1206, 100 VDC Chip thickness CR 1.0 pF 1.5 pF 2.2 pF 3.3 pF 4.7 pF 6.8 pF 10. pF 15. pF 22. pF 33. pF 47. pF 68. pF 100. pF 150. pF 220. pF 330. pF 470. pF 680. pF 1.0 nF 1.5 nF 2.
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C0G Multilayer ceramic capacitors C0G; 1210 Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Case size 1210, 50 VDC Chip thickness CR 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10. nF Ordering code 1) B37949K5102J0** B37949K5152J0** B37949K5222J0** B37949K5332J0** B37949K5472J0** B37949K5682J0** B37949K5103J0** Blister tape, Æ 180-mm reel ** ^ 62 pcs/reel 4000 4000 4000 4000 4000 4000 3000 mm 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 1.2 ± 0.
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Multilayer ceramic capacitors C0G C0G Typical characteristics 1) Capacitance change DC/C25 versus temperature T (tolerance range ) ∆C C 25 Capacitance change DC/C0 versus superimposed DC voltage V KKE0107-F 1.0 % KKE0458-8 0.5 0.6 ∆C % C0 0.3 0.4 0.2 0.2 0.1 0 0 _ 0.2 _ 0.1 _ 0.4 _ 0.2 _ 0.6 _ 0.3 _ 0.8 _ 0.4 _ 1.
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Multilayer ceramic capacitors C0G C0G Typical characteristics 1) Capacitance change DC/C1 versus time t Insulation resistance Rins versus temperature T KKE0129-B 10 8 MΩ KKE0100-S 5 ∆C % C1 0 R ins 10 6 _5 10 5 _ 10 10 4 _ 15 10 3 10 2 0 20 40 60 80 100 _ 20 10 0 ˚C 140 T 10 1 10 2 h 10 3 t 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors Cautions and warnings Notes on the selection of ceramic capacitors In the selection of ceramic capacitors, the following criteria must be considered: 1. Depending on the application, ceramic capacitors used to meet high quality requirements should at least satisfy the specifications to AEC-Q200. They must meet quality requirements going beyond this level in terms of ruggedness (e.g.
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Multilayer ceramic capacitors Cautions and warnings The following should be considered in the placement process 1. Ensure correct positioning of the ceramic capacitor on the solder pad. 2. Caution when using casting, injection-molded and molding compounds and cleaning agents, as these may damage the capacitor. 3. Support the circuit board and reduce the placement forces. 4. A board should not be straightened (manually) if it has been distorted by soldering. 5.
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Multilayer ceramic capacitors Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.