NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: B57550G1 Date: January 2018 © EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Applications Temperature measurement Dimensional drawing Features Glass-encapsulated, heat-resistive and highly stable For temperature measurement up to 300 °C Very short response time Small dimensions Leads: dumet wires (copper-clad FeNi) Options Leads: nickel-plated dumet wires Alternative dimensions available on request Dimensions in mm Approx. weight 40 mg Delivery mode Bulk General technical data Climatic category Max.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Electrical specification and ordering codes R25 Ω 2k 2.5 k 5k 10 k 10 k 20 k 30 k 50 k 100 k 230 k No.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Reliability data Test Standard Storage in dry heat IEC 60068-2-2 Storage in damp heat, steady state Rapid temperature cycling Test conditions Storage at upper category temperature T: 300 °C t: 1000 h IEC Temperature of air: 85 °C 60068-2-67 Relative humidity of air: 85% Duration: 1000 h IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 200 °C Number of cycles: 1000 Please read Cautions and warnings and Important
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Reliability data according to AEC-Q200, Rev. D Test Standard High temperature exposure (storage) Operational life MIL-STD-202, method 108 MIL-STD-202, method 108 Temperature cycling Terminal strength (leaded) Test conditions Storage at T = +125 °C t = 1000 h 1000 h / +125 °C Test voltage max. 0.3 V DC on NTC1) JESD 22, Lower test temperature: 55 °C method JA-104 Upper test temperature: 125 °C 1000 cycles Dwell time: max.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 R/T characteristics R/T No. T (°C) 7003 7006 8304 B25/100 = 3625 K B25/100 = 3560 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 63.225 45.46 33.07 24.324 18.081 6.7 6.5 6.3 6.0 5.8 55.947 40.765 30.014 22.321 16.760 6.4 6.2 6.0 5.8 5.6 30.0 25.0 20.0 15.0 10.0 13.575 10.29 7.8716 6.0739 4.7258 5.6 5.4 5.3 5.1 4.9 12.700 9.7089 7.4853 5.8179 4.5572 5.5 5.3 5.1 5.0 4.8 18.
Temperature measurement B57550G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 7003 G1550 7006 8304 B25/100 = 3625 K B25/100 = 3560 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.021665 2.0 0.023099 2.0 0.012967 2.3 0.019613 2.0 0.020939 1.9 0.011566 2.3 170.0 175.0 180.0 185.0 190.0 0.017793 0.016176 0.014735 0.013448 0.012297 1.9 1.9 1.8 1.8 1.8 0.019022 0.017315 0.015774 0.014407 0.013189 1.9 1.9 1.8 1.8 1.7 0.010341 0.0092664 0.0083224 0.0074907 0.0067564 2.2 2.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 R/T characteristics R/T No. T (°C) 8307 8320 8326 B25/100 = 3492 K B25/100 = 3420 K B25/100 = 3497 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 52.624 38.452 28.401 21.194 15.972 6.4 6.2 6.0 5.8 5.6 48.459 35.668 26.524 19.920 15.103 6.2 6 5.8 5.6 5.4 53.680 39.112 28.817 21.459 16.142 6.4 6.2 6.0 5.8 5.6 30.0 25.0 20.0 15.0 10.0 12.149 9.3246 7.2181 5.6332 4.4308 5.4 5.2 5.0 4.9 4.
Temperature measurement B57550G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 8307 G1550 8320 8326 B25/100 = 3492 K B25/100 = 3420 K B25/100 = 3497 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.024694 2.0 0.026703 1.9 0.024654 2.0 0.022414 1.9 0.024290 1.9 0.022384 1.9 170.0 175.0 180.0 185.0 190.0 0.020385 0.018577 0.016961 0.015514 0.014216 1.9 1.8 1.8 1.8 1.7 0.022139 0.020217 0.018497 0.016953 0.015566 1.8 1.8 1.8 1.7 1.7 0.020364 0.018564 0.016955 0.015515 0.014223 1.9 1.8 1.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 R/T characteristics R/T No. T (°C) 8332 8344 8350 B25/100 = 4006 K B25/100 = 4006 K B25/100 = 4264 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 97.675 67.930 47.838 34.093 24.576 7.4 7.1 6.9 6.7 6.4 99.651 69.067 48.490 34.465 24.786 7.5 7.2 6.9 6.7 6.5 30.0 25.0 20.0 15.0 10.0 17.909 13.186 9.8062 7.3621 5.5776 6.2 6 5.8 5.6 5.5 18.026 13.251 9.8411 7.3803 5.5866 6.3 6.1 5.9 5.7 5.
Temperature measurement B57550G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 8332 G1550 8344 8350 B25/100 = 4006 K B25/100 = 4006 K B25/100 = 4264 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.014585 2.2 0.014504 2.2 0.010690 2.4 0.013077 2.2 0.012989 2.2 0.0094790 2.4 170.0 175.0 180.0 185.0 190.0 0.011753 0.010588 0.0095600 0.0086500 0.0078436 2.1 2.1 2 2 1.9 0.011659 0.010488 0.0094560 0.0085436 0.0077352 2.1 2.1 2 2 2 0.0084257 0.0075072 0.0067043 0.0060006 0.0053824 2.3 2.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max. 360 °C Soldering time max.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
Temperature measurement B57550G1 Glass-encapsulated sensors 1.3.1 G1550 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3.
Temperature measurement B57550G1 Glass-encapsulated sensors Profile feature Preheat and soak - Temperature min - Temperature max - Time G1550 Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ... 260 °C1) 235 °C ...
Temperature measurement B57550G1 Glass-encapsulated sensors 1.3.4 G1550 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress.
Temperature measurement B57550G1 Glass-encapsulated sensors Tensile strength: G1550 Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.0 N Bending strength: Test Ub: Two 90°-bends in opposite directions Value of applied force for Ub test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 0.5 N 0.
Temperature measurement B57550G1 Glass-encapsulated sensors 5 G1550 Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded.
Temperature measurement B57550G1 Glass-encapsulated sensors 8 G1550 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Cautions and warnings General See "Important notes" on page 2. Storage Store thermistors only in original packaging. Do not open the package prior to processing. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Symbols and terms Symbol English German A AWG Area American Wire Gauge Fläche Amerikanische Norm für Drahtquerschnitte B B25/100 B value B value determined by resistance measurement at 25 °C and 100 °C B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Pdiss Pel Pmax Maximum power at 25 °C Power di
Temperature measurement B57550G1 Glass-encapsulated sensors G1550 Symbol English German α Temperature coefficient Temperaturkoeffizient ∆ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc τa Thermal cooling time constant Thermal time constant Thermische Abkühlzeitkonstante Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in ordering Platzhalter für Z
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
Important notes 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.
