Datasheet

Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min T
smin
100 °C 150 °C
- Temperature max
T
smax
150 °C 200 °C
- Time
t
smin
to t
smax
60 ... 120 s 60 ... 120 s
Average ramp-up rate T
smax
to T
p
3 °C/ s max. 3 °C/ s max.
Liquidous temperature T
L
183 °C 217 °C
Time at liquidous t
L
40 ... 150 s 40 ... 150 s
Peak package body temperature T
p
215 °C ... 260 °C
1)
235 °C ... 260 °C
Time above (T
P
5 °C) t
p
10 ... 40 s 10 ... 40 s
Average ramp-down rate T
p
to T
smax
6 °C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature max. 8 minutes max. 8 minutes
1) Depending on package thickness.
Notes: All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Temperature measurement B57861S
Miniature sensors with bendable wires S861
Page 10 of 21Please read Cautions and warnings and
Important notes at the end of this document.