NTC thermistors for temperature measurement Miniature sensors with bendable wires Series/Type: B57863S Date: January 2018 © EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Applications Temperature measurement Dimensional drawing Features Uni curve sensor Short response time High temperature accuracy between 0 °C and 70 °C Excellent long-term stability Epoxy encapsulation PTFE-insulated leads of silver-plated nickel wire, AWG 30 UL approval (E69802) Options Alternative lead lengths on request Dimensions in mm Approx. weight 90 mg Delivery mode Bulk General technical data Climatic category Max.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Note For calculation of the R/T characteristics refer to our special tool "NTC R/T calculation". You may download this tool from the Internet (www.epcos.com/tools → NTC Thermistors → NTC R/T Calculation).
Temperature measurement B57863S Miniature sensors with bendable wires S863 Reliability data according to AEC-Q200, Rev. D Test Standard High temperature exposure (storage) Biased humidity MIL-STD-202, method 108 MIL-STD-202, method 103 Operational life Temperature cycling Terminal strength (leaded) Test conditions Storage at T = +125 °C t = 1000 h T = 85 °C Relative humidity of air 85% t = 1000 h Test voltage max. 0.3 V DC on NTC1) MIL-STD-202, T = +125 °C method 108 t = 1000 h Test voltage max.
Temperature measurement B57863S Miniature sensors with bendable wires S863 R/T characteristics R/T No. T (°C) 8016 8018 55.0 50.0 45.0 40.0 35.0 96.3 67.01 47.17 33.65 24.26 7.4 7.2 6.9 6.7 6.4 82.408 58.344 41.775 30.235 22.109 7.0 6.8 6.6 6.4 6.2 30.0 25.0 20.0 15.0 10.0 17.7 13.04 9.707 7.293 5.533 6.2 6.0 5.8 5.6 5.5 16.327 12.171 9.1548 6.9458 5.3135 6.0 5.8 5.6 5.4 5.3 5.0 0.0 5.0 10.0 15.0 4.232 3.265 2.539 1.99 1.571 5.3 5.1 5.0 4.8 4.7 4.0972 3.1834 2.4915 1.9637 1.
Temperature measurement B57863S Miniature sensors with bendable wires Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Bath temperature Dip soldering Iron soldering max. 260 °C max.
Temperature measurement B57863S Miniature sensors with bendable wires S863 should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
Temperature measurement B57863S Miniature sensors with bendable wires 1.3.1 S863 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32.
Temperature measurement B57863S Miniature sensors with bendable wires Profile feature Preheat and soak - Temperature min - Temperature max - Time S863 Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ... 260 °C1) 235 °C ...
Temperature measurement B57863S Miniature sensors with bendable wires 1.3.4 S863 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress.
Temperature measurement B57863S Miniature sensors with bendable wires Tensile strength: S863 Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.0 N Bending strength: Test Ub: Two 90°-bends in opposite directions Value of applied force for Ub test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 0.5 N 0.
Temperature measurement B57863S Miniature sensors with bendable wires 5 S863 Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded.
Temperature measurement B57863S Miniature sensors with bendable wires 8 S863 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Cautions and warnings General See "Important notes" on page 2. Storage Store thermistors only in original packaging. Do not open the package prior to processing. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement B57863S Miniature sensors with bendable wires S863 sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.
Temperature measurement B57863S Miniature sensors with bendable wires S863 Symbols and terms Symbol English German A AWG Area American Wire Gauge Fläche Amerikanische Norm für Drahtquerschnitte B B25/100 B value B value determined by resistance measurement at 25 °C and 100 °C B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Pdiss Pel Pmax Maximum power at 25 °C
Temperature measurement B57863S Miniature sensors with bendable wires S863 Symbol English German α Temperature coefficient Temperaturkoeffizient ∆ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc τa Thermal cooling time constant Thermal time constant Thermische Abkühlzeitkonstante Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in ordering Platzhal
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
Important notes 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.
