Information

108-1092
Test Description Requirement Procedure
Physical shock. No discontinuities greater than 1
microsecond.
See Note.
TE Spec 109-26-1.
Subject mated connectors to 50 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
Mating force. Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1 15 5.6 33
2 26 9.8 38
3 44 16.5 46
4 62 23.3 52
5 78 29.3 58
TE Spec 109-42, Condition A.
Measure force necessary to mate
connector assemblies at rate of 1
inch per minute.
Unmating force. Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1 15 5.6 33
2 26 9.8 38
3 44 16.5 46
4 62 23.3 52
5 78 29.3 58
TE Spec 109-42, Condition A.
Measure force necessary to
unmate connector assemblies at
rate of 1 inch per minute.
Durability. See Note. TE Spec 109-27.
Mate and unmate connector
assemblies for 100 cycles for gold
flash and 500 cycles for 30 µin gold
plating at maximum rate of 200
cycles per hour.
Solderability. Solderable area shall have
minimum of 95% solder coverage.
TE Spec 109-11-1.
Subject contacts to solderability for
connectors with tin-lead plated
solder tails.
TE Spec 109-11-11.
Subject contacts to solderability for
connectors with lead-free tin plated
soldertails.
ENVIRONMENTAL
Thermal shock. See Note. TE Spec 109-22.
Subject mated connectors to 100
cycles between -55 and 105°C for
regular housings and -55 and
130°C for high temperature
housings.
Figure 1 (continued)
Rev F 3 of 8