THIS DRAWING 15 UNPUBLISHED. RELEASED FOR PUBLICATION -, = Loc DIST REVISIONS ‘ COPYRIGHT RIGHTS RESERVED. CM 0 R DESCRIPTION DATE TWN | AVDP M REVISED PER 220uL2015| PINS TO COMPLY WITH AMP SOLDER ABILITY SPEC. 109—11—3. D D A 0.00381 MIN MATTE TIN LEAD PLATE OVER 0.00127 MIN NICKEL. 9.83 A 0.00076 MIN GOLD PLATE IN THE LOCALIZED PLATE AREA, 0.00381 MATTE TIN LEAD IN THE LOCALIZED PLATE AREA, BOTH OVER ‘ 0.00127 MIN NICKEL. HOUSING 2 T A 0.00381 MIN MATTE TIN PLATE OVER j@& j@& = 0.00127 MIN NICKEL.
