Datasheet

114--16017
Rev L 9 of 12
3.6. Soldering
A. Flux Selection
The solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux
will depend on the type of pc board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the
PRODUCT INFORMA TION at the number at the bottom of page 1 for consideration of other types of flux.
Fluxes that are compatible with these connectors are provided in Figure 6.
F
L
U
X
T
Y
P
E
A
C
T
I
V
I
T
Y
R
E
S
I
D
U
E
COMMERCIAL DESI GNATION
FLU
X
T
Y
PE
A
CTIVIT
Y
RESIDUE
KESTER ALPHA
RMA Mild Non--Corrosive 186 611
Figure 6
B. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary . Consult with the suppli er of the
solder and flux for recommended cl eaning sol vents. A list of common cl eaning sol vents and specifi ed time
and temperature that will not affect the connectors is given in Figure 7.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufactur er’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however Tyco
Electr onics does not recommend them because of the harmful occupational and environmental effects. Both are
carcinogenic (cancer--causing) and Trichloroethylene is harmful to the earth’s ozone layer.
For solvent s not listed, contact the PRODUCT I NFORMATION at the number at the bottom of page 1.
CLEANER
TIME TEMPER
A
TURE
NAME TYPE
T
I
M
E
(Minutes)
T
E
M
P
E
R
A
T
U
R
E
(Maximum)
ALPHA 2110 Aqueous 1
132_C [270_F]
BIOACT EC-- 7 Solvent 5
100_C [212_F]
Butyl CARBITOL Solvent Solvent 1 Ambient Room
Isopropyl Alcohol Solvent 5
KESTER 5778 Aqueous 5
KESTER 5779 Aqueous 5
1
0
0
_
C
[
2
1
2
_
F
]
LONCOTERGE 520 Aqueous 5
100_C
[
212_F]
LONCOTERGE 530 Aqueous 5
Terpene Solvent Solvent 5
Figure 7
C. Drying
When drying cleaned assemblies and pc boards, make certain that temperature limitations of --55 to
105_C [ --67 to 222_F] are not exceeded. Excessive temperatures may cause connector degradation
and/or plating deterioration.
D. Process
The connectors and pc boards can be soldered using wave soldering techniques. The temperatures and
exposure time shall be wi thin the ranges specified in Figure 8.
ALPHA, BIOACT, CARBITOL, KESTER, and LONCOTERGE are trademarks of their respective owners.
DANGER
NOTE
i