BARING TS UNFURNISHED RESEED FoR FULLERTON = SESSIONS © COPYRIGHT _— By — ALL RIGHTS RESERVED. CM O P LTR DESCRIPTION DATE DWN AVDP D REVISED PER 23duLzo1s| RK | SC 18.11 HOUSING 1. PINS TO COMPLY WITH AMP SOLDER ABILITY SPEC. /A 0.00381 MIN MATTE TIN LEAD PLATE OVER 0.00127 MIN NICKEL. D.00076 MIN GOLD PLATE IN THE LOCALIZED PLATE AREA, 0.00381 MATTE TIN LEAD PIN CONTACT THE LOCALIZED PLATE AREA, BOTH OVER REQUIRED 0.00127 MIN NICKEL. 0.00381 MIN MATTE TIN PLATE OVER 0.00127 983 MIN NICKEL. D.