User Manual

114- 13120
Rev E10 of 17
More Than 3 Minutes
3_C [37.4_F]
Per Second
100 Seconds
0.5_C[33_F]
Per Second
Equalization
Figure 7
20_C[68_F]
110_C [230_F]
160_C [320_F]
230_C [446_F]
Ramp--Up Reflow Cool--Down
Reflow So ldering Process Cycle
Pre--Heat Soldering Solidification
30 Seconds
3_C [37.4_F]
Per Second
Peak Dwell
20 Seconds
45 Seconds
3_C [37.4_F]
Per Second
Ambient Rate
Ambient Rate
Tin--Lead Solder
(Maximum 230_C [446_F] for 20 Seconds)
Lead--Free Solder
(Maximum 260_C [500_F])
250_C [482_F]
Time (Seconds)
00.0 120.0 240.0 360.0
200_C [392_F]
150_C [302_F]
100_C [212_F]
50_C [122_F]
0
Entry Zone
#1 #2 #3 #4 #5 #6 #7 #8
Solder Will Begin to Reflow at
218_C [424_F]
Solder Will Begin to Reflow at
183_C [361_F]