User Manual

114- 13120
Rev E 11 of 17
B. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended cleaning the pc board on its edge. If using aqueous cleaner, standard
equipment such as a soak--tank or an automatic in--line machine should be used. Common cleaning
solvents that will not affect the connector for the time and temperature specified are listed in Figure 8.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not r ecommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer--causing).
CLEANER
TIME TEMPERATURE
NAME TYPE
T
I
M
E
(Minutes)
T
E
M
P
E
R
A
T
U
R
E
(Maximum)
ALPHA 2110 Aqueous 1
132_C [270_F]
Isopropyl Alcohol Solvent 5
100_C [212_F]
KESTER 5778 Aqueous 5
100_C [212_F]
KESTER 5779 Aqueous 5
100_C [212_F]
LONCOTERGE 520 Aqueous 5
100_C [212_F]
LONCOTERGE 530 Aqueous 5
100_C [212_F]
Figure 8
C. Drying
When drying cleaned assemblies and pc boards, make certain that temperatures do not exceed 85_C
[185_F]. Excessive temperatures may cause connector housing degradation.
3.14. Checking Installed Connector
All solder joints must conform to those specified in Workmanship Specification 101--21 and all other
requirements specified in this document. The installed connector must have solder fillets evenly formed around
each contact solder tine. Solder must have 95% minimum coverage over the circuit pad. See Figure 9.
Figure 9
Solder Fillet Even Formed
Around Each Contact Solder Tine
95% Minimum Solder
Coverage Over Circuit Pad
PC Board
Connector
ALPHA, KESTER, and LONCOTERGE are trademarks of their respective owners.
DANGER