User Manual

114- 13120

Rev E 7 of 17

Figure 3 (End)

Detail X

3.7. Solder Paste Characteristics

1. Alloy type for tin--lead solder shall be 63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag.

Alloy type for lead--free solder shall be compatible with pure tin or gold; for example,

SAC305 (96.5 Sn/3 Ag/0.5 Cu) or SAC405 (95.5 Sn/4 Ag/0.5 Cu).

2. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.

3. Paste will be at least 80% solids by volume.

4. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).

5. Minimum viscosity of screen print shall be 5¢10% cp (centipoise).

6. Minimum viscosity of stencil print shall be 7.5¢10% cp (centipoise).

3.8. Solder Volume

Minimum solder volume (V) (before curing) for each circuit pad is calculated by multiplying the pad length (L)

by the pad width (W) by the stencil thickness (T):

2.0(L)¢0.5(W)¢0.15(T) = 0.15 mm

(V)

Solder volume for each connector must be 0.15 mm

per contact solder tine.

Solder volume may vary depending on solder paste composition.

3.9. Solder Paste Thickness

Solder paste thickness for the connector contact solder tines must be at least 0.15 mm.

NOTE