Datasheet

01-2016, Rev. 0116
www.te.com
© 2015 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
3
AXICOM
Signal Relays
IM - E Relay (Continued)
Recommended soldering conditions
Processing
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 25 of 28
AXICOMÊSignalÊRelays
IM Relay
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240°C
180°C
130°C
100°C
20-40sec
Full line: typical
Dottedline: processlimits
forced
cooling
Time (s)
Temperature °C
Time (s)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Temperature °C
Time (s)
Recommended Soldering Conditions
Recommended Reflow Soldering Profile
Resistance to Soldering Heat - Reflow Profile
Temperature °C
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 25 of 28
AXICOMÊSignalÊRelays
IM Relay
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240°C
180°C
130°C
100°C
20-40sec
Full line: typical
Dottedline: processlimits
forced
cooling
Time (s)
Temperature °C
Time (s)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Temperature °C
Time (s)
Recommended Soldering Conditions
Recommended Reflow Soldering Profile
Resistance to Soldering Heat - Reflow Profile
Temperature °C
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Resistance to soldering heat - Reflow profile
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
Infrared Soldering: temperature/
time profile (lead and housing
peak temperature)
Packing
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 26 of 28
AXICOMÊSignalÊRelays
IM Relay
Packing Dimensions in mm
Reel Dimension
Tube for THT version
50 relays per tube
1,000 relays per box
Tape and reel for SMT version
1,000 relays per reel
1,000 or 5,000 relays per box
Tube for THT version
50 relays per tube, 1000 relays per box
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 26 of 28
AXICOMÊSignalÊRelays
IM Relay
Packing Dimensions in mm
Reel Dimension
Tube for THT version
50 relays per tube
1,000 relays per box
Tape and reel for SMT version
1,000 relays per reel
1,000 or 5,000 relays per box
Tape and reel for SMT version
1000 relays per reel, 1000 or 5000 relays per box
Reel dimensions
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 26 of 28
AXICOMÊSignalÊRelays
IM Relay
Packing Dimensions in mm
Reel Dimension
Tube for THT version
50 relays per tube
1,000 relays per box
Tape and reel for SMT version
1,000 relays per reel
1,000 or 5,000 relays per box
108-98001 Rev. M
All specifications subject to change. Consult Tyco Electronics for latest specifications. 26 of 28
AXICOMÊSignalÊRelays
IM Relay
Packing Dimensions in mm
Reel Dimension
Tube for THT version
50 relays per tube
1,000 relays per box
Tape and reel for SMT version
1,000 relays per reel
1,000 or 5,000 relays per box