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Application Specification

Small Form- Factor Pluggable (SFP) and

SFP+ Surface Mount PT Connectors

114--13120

LOC B

1 of 17

E2011 T yco Electronics Corporation, a TE Connectivity Ltd. Company

TE logo is a trademark.

*Trademark. Other product names, logos, or company names might be trademarks of their respective owners.

TOOLING ASSISTANCE CENTER 1--800--722--1111

PRODUCT INFORMATION 1--800--522--6752

This controlled document is subject to change.

For latest revision and Regional Customer Service,

visit our website at www.te.com

and Cage Assemblies

17 MAR 11 Rev E

All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

otherwise specified, dimensions have a tolerance of +

0.13 and angles have a tolerance of +2_. Figures and

illustrations are for identification only and are not drawn to scale.

1. INTRODUCTION

This specification covers the requirements for application of SFP and SFP+ surface mount PT connectors and

cage assemblies to interconnect SFP and SFP+ fiber optic or copper transceiver modules to printed circuit (pc)

boards. The connectors are available in 20, 30, 40, and 70 positions with contact spacing on 0.8 mm

centerlines; however, ONLY the 20--position

connector is designed to be used with these cage assemblies.

The cage assemblies are available in single port or ganged 1¢2, 1¢4, or 1¢6 configurations (two, four, or six

adjoined ports), and with or without a light pipe. The light pipe is used to transmit light from an LED on the pc

board to a panel (information for cage assemblies with light pipe is not included in this document). Each cage

assembly is designed to be inserted into a bezel after being seated onto the pc board.

The connector is supplied in tape--and--reel form for manual or high--speed automatic machine placement

(typically vacuum pick and place). The cage assemblies are supplied in plastic tray packaging for manual

placement.

When corresponding with TE Connectivity (TE) Personnel, use the terminology provided in this specification to

facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.

Figure 1 (Cont’d)

SFP Single Port Cage Assembly

Connector

Surface Mount Contact

(Ref)

Housing

Card Entry

Slot

Standoff

(2 Places)

Alignment Post

(2 Places)

Pin 1 Identifier

Chamfered

Corner

Panel Ground

Spring (Ref)

Module

Locking Latch

Compliant Pin

Contact (Ref)

Thermal Vent

Hole (Ref)

Standoff

(Ref)

Kick--Out

Spring

EMI Suppression

Pin (Ref)

Frame

Port

Dust Cover

Light Pipe

Without Light Pipe With Light Pipe

Standoff

(Ref)

Note: Different Compliant Pin Contact Configurations Are Available

NOTE

Summary of content (17 pages)

PAGE 1
Application Specification Small Form- Factor Pluggable (SFP) and SFP+ Surface Mount PT Connectors and Cage Assemblies NOTE i 114-- 13120 17 MAR 11 Rev E All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and illustrations are for identification only and are not drawn to scale. 1.
PAGE 2
114- 13120 SFP Ganged Cage Assembly 1¢4 Configuration Without Light Pipe (Shown With Bottom Side Up) Kick-- Out Spring (1 Per Port) Compliant Pin Contact (Ref) EMI Suppression Pin (Ref) 1¢2 Configuration With Light Pipe Light Pipe (Ref) Standoff (Ref) Module Locking Latch (1 Per Port) Thermal Vent Hole (Ref) Panel Ground Spring (Ref) Frame Port (Ref) Dust Cover (1 Per Port) SFP Enhanced EMI Single Port Cage Assembly Enhanced EMI Panel Ground Springs With Light Pipe SFP Enhanced EMI Ganged Assembly
PAGE 3
114- 13120 Each connector is a housing with right--angle surface mount contacts. The connector features an embossed “1” for Pin 1 identification, a chamfered corner for orientation, alignment posts that provide stability for placement on the pc board, standoffs to allow easy pc board cleaning after soldering, and a card entry slot that accepts a 1.0+0.1 mm thick integrated circuit card housed in the transceiver module.
PAGE 4
114- 13120 B. Transceiver Module For applications using ganged cage assemblies, the width of the mating transceiver module (portion outside of the cage assembly) cannot exceed the width of the port of the cage assembly. This will prevent any possible interference between ports when inserting the transceiver modules. Port--to--port centerline spacing is 14.25 mm; therefore, the maximum width of the transceiver (outside of the cage assembly) cannot exceed 14 mm. 3.3.
PAGE 5
114- 13120 Holes for the EMI suppression pins must be drilled and can be used with or without plating. The finished hole diameter is provided on the customer drawing for the specific cage assembly. The finished hole diameter for connector alignment posts are provided on the customer drawing for the specific connector. Recommended Hole Dimensions and Plating For Cage Assembly Compliant Pin Contacts Drilled Hole Diameter (See Table) Finished Hole Diameter After Plating (Ref) (See Table) 0.025-- 0.
PAGE 6
114- 13120 Sample Recommended PC Board Layout (Connector and Single Port Cage Assembly) Refer to Figure 2, Hole C Refer to Figure 2, Hole A Pads and Vias and Chassis Ground, 11 Places Datum and Basic Dimension Established by Customer Note: For a Specific PC Board Layout, Refer to the Customer Drawing for the Specific Connector and Cage Assembly Figure 3 (Cont’d) 6 of 17 Rev E
PAGE 7
114- 13120 Detail X Figure 3 (End) 3.7. Solder Paste Characteristics 1. Alloy type for tin--lead solder shall be 63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag. Alloy type for lead--free solder shall be compatible with pure tin or gold; for example, SAC305 (96.5 Sn/3 Ag/0.5 Cu) or SAC405 (95.5 Sn/4 Ag/0.5 Cu). 2. Flux incorporated in the paste shall be rosin, mildly active (RMA) type. 3. Paste will be at least 80% solids by volume. 4.
PAGE 8
114- 13120 3.10. Stencil The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as long as it prevents solder bridging from one pad to another. Generally, a thinner stencil will need a larger aperture to maintain the given volume of solder paste. The stencil should be 0.15 mm thick. The stencil layout must be designed using the dimensions provided on the customer drawing for the specific connector. Sample stencil layout is provided in Figure 4.
PAGE 9
114- 13120 Contact Solder Tine Overhang Up to 50% is Permissible PC Board Contact Solder Tine Centered on PC Board Circuit Pad Preferred Figure 5 C. Seating Because the connector alignment posts are for clearance and fit only, the force required to seat the connector is minimal. Apply only that force necessary to seat the contact solder tines into the top surface of the solder paste. The alignment posts must be inserted into the pc board holes and the standoffs must be seated on the board. See Figure 6.
PAGE 10
114- 13120 Reflow Soldering Process Cycle Tin--Lead Solder (Maximum 230_C [446_F] for 20 Seconds) Peak Dwell 20 Seconds Solder Will Begin to Reflow at 183_C [361_F] 230_C [446_F] Ambient Rate 160_C [320_F] 110_C [230_F] Ambient Rate 20_C [68_F] Ramp-- Up 30 Seconds 3_C [37.4_F] Per Second Equalization 100 Seconds 0.5_C [33_F] Per Second Pre-- Heat Reflow 45 Seconds 3_C [37.4_F] Per Second Cool-- Down More Than 3 Minutes 3_C [37.
PAGE 11
4- 13120 B. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other contaminants. It is recommended cleaning the pc board on its edge. If using aqueous cleaner, standard equipment such as a soak--tank or an automatic in--line machine should be used.
PAGE 12
114- 13120 3.15. Bezel A. Thickness The bezel thickness range shall be 0.8 mm through 2.6 mm. B. Cutout The bezel must provide a cutout that allows proper mounting of the cage assembly. The cage assembly panel grounding feature must be compressed by the bezel in order to provide an electrical ground between the cage assembly and bezel for EMI suppression. Care must be used to avoid interference between adjacent cage assemblies and other components.
PAGE 13
114- 13120 CAGE ASSEMBLY CONFIGURATION DIMENSION (Non-- PCI Application) SFP+ CAGE ASSEMBLY With External EMI Panel Ground Springs B (Min) C +0.1 D +0.1 A +0.1 E Single Port 15.25 16.25 10.4 0.23 3.5+0.3 1¢2 Ganged 29.70 30.75 10.4 0.23 3.5+0.3 1¢4 Ganged 58.20 59.25 10.4 0.23 3.5+0.3 1¢6 Ganged 86.70 87.75 10.4 0.23 3.5+0.3 PCI Application Note: Not to Scale AA 0.30 Maximum Radius (4 Places Each Cutout) Y Section Y--Y Cutout in Bezel Cutout in PC Board 10.
PAGE 14
114- 13120 When using tooling to seat a ganged cage assembly, the shut height of the application tool must be specifically set for proper seating of the cage assembly. The shut height can be calculated by: Seating Height (Cage Assembly Seated) + Height of Seating Tool + Combined Thicknesses of PC Board and PC Board Support Fixture = Shut Height (Ram Down) NOTE i The shut height may need to be adjusted to maintain the 0.10 mm maximum gap between the standoffs of the cage assembly and the pc board.
PAGE 15
114- 13120 Note: Single Port Cage Assembly Shown—Requirements Also Apply to Ganged Cage Assemblies Without Light Pipe Requirements Do Not Apply to Cage Assemblies with Light Pipe Cutout Non--PCI Application Front View Cage Assembly Panel Grounding Feature Compressed By Bezel Cage Assembly Module Locking Latch Slightly Raised Bezel 10 (Ref) Connector Cage Assembly Cutout Side View PCI Application Front View 10.
PAGE 16
114- 13120 5.3. Application Tool Power for the seating tools and extraction tools must be provided by application tool (with a ram) capable of supplying a downward force of 44.5 N [10 lb] per compliant pin contact. For available application tools, call PRODUCT INFORMATION at the number at the bottom of page 1. 5.4. PC Board Support Fixture A pc board support must be used with the seating tool and extraction tool.
PAGE 17
114- 13120 6. VISUAL AID Figure 14 shows a typical application of SFP and SFP+ surface mount PT connectors and cage assemblies. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling.