User Manual

114- 13120
Rev E 5 of 17
Holes for the EMI suppression pins must be drilled and can be used with or without plating. The finished
hole diameter is provided on the customer drawing for the specific cage assembly. The finished hole
diameter for connector alignment posts are provided on the customer drawing for the specific connector.
Recomm ended Hol e Di mensions and Plating
For Cage Assembly Compliant Pin Contacts
Drilled Hole Diameter
(See Table)
Finished Hole Diameter
After Plating (Ref) (See Table)
0.025--0.050 Copper Plating
(Max Hardness 150 Knoop)
0.004--0.010 Hot Air Solder Leveling (HASL) Tin--Lead (SnPb)
0.0005 (Min) Immersion Tin (Sn)
0.0002--0.0005 Organic Solderability Preservative (OSP)
0.004--0.0076 Nickel (Ni), 0.0001--0.0005 Immersion Gold (Au)
0.0001--0.0005 Immersion Silver (Ag)
HOLE
DIAMETER
H
O
L
E
(See Customer Drawing for Hole Designation;
Also Shown in Figure 3—Sample PC Board Layout)
DRILLED HOLE
FINISHED HOLE
(After Plating)
A 1.15+0.02 1.05 (Ref)
B 1.05+0.02 0.95 (Ref)
C 0.95+0.02 0.85 (Ref)
Figure 2
E. Layout
The pc board holes and circuit pads must be precisely located to ensure proper placement and optimum
performance of the connector and cage assembly. The layout must be designed using the dimensions
provided on the customer drawing for the specific connector and cage assembly. A sample layout is
provided in Figure 3.
When mounting cage assemblies to both sides of the board, the same EMI suppression pin holes must be
shared by the cage assemblies on the opposite side of the board.