Datasheet
Form Type Distribute Version 2.0 Ref IPC 1752A Sectionals Manufacturing
Info/ Material
Info
Subsectionals D, A
Supplier Information
Company Name TE Connectivity Request
Document ID
Contact Name Penica, John R Contact Title Mgr Environmental Engineering
Company
Unique ID
- Response Date 2014-06-09 Contact Email jrpenica@te.com
Contact Phone Number 1717592-3266
Legal Statement
Supplier
Acceptance
true
Legal Statement
The information provided in this document is based upon reasonable inquiry of our suppliers. This information is subject to change. This information does not in any
way modify existing purchase specifications or existing contractual or other agreements terms between TE Connectivity (or its affiliated companies) and its customers.
Product
Manufacturer
Item number
5103310-5 Amount 2583.5560926 Version - Identity
Manufacturer
Item Name
Weight Uom mg Mfr Site Authority
Date UOM Each
EURoHS-0508 Product(s) meets EU RoHS requirement without any exemptions - true
ChinaRoHS-
0508
Product(s) is eligible for marking with the e code under China's Measures for Administration of the control of pollution by Electronic Information
Products - true
Manufacturing Information
J-STD-020 MSL
Rating
Max Total a
Wave Time
Ramp Rate Wave
Additional Info
Classification
Temp
Max Wave
Solder Time
10.0 Ramp Down
Rate
Psl Rating
Reflow
Max Time
Within 5
Psl Rating
Wave
Package
Designator
Size 0.0
Time Above 217 Reflow
Additional Info
Preheat Max
Temp
Terminal Base
Alloy
Cu Alloy
Preheat
Duration
bulk Solder
Termination
NAC Nbr or Reflow
Cycles
Terminal
Plating
Matte Tin (Sn) - reflowed over
Nickel (Ni) barrier
Preheat Min
Temp
Nbr of
Instances
0 Component
Temp Spike
Shape NAC
Product Disclosure
Sub-
Item/Material/
Substance
Level Name Substance
Category
Substance
CAS
Substance
Concentration
Quantity Mass per Unit UOM Exemption
Sub-Item 1 1-1888096-8 10.0 61.72588513 mg
Material 2 Tin Plate 10.0 0.246189 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.0999 10.0 2.4594E-4 mg
Substance 3 Tin Supplier 7440-31-5 99.9001 10.0 0.24594 mg
Material 2 Nickel Plate 10.0 0.74793 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
1212
0.2 10.0 0.00149586 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.1 10.0 7.4793E-4 mg
Substance 3 Nickel Nickel 7440-02-0 99.7 10.0 0.74569 mg
Material 2 Gold Plate 10.0 0.00647273 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
1212
0.3 10.0 1.941819E-5 mg
Substance 3 Gold Supplier 7440-57-5 99.7 10.0 0.00645331 mg
Material 2 Gold Plate 10.0 0.0252934 mg
Substance 3 Gold Supplier 7440-57-5 99.7 10.0 0.02521752 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
0909
0.3 10.0 7.58802E-5 mg
Material 2 Brass Wire 10.0 60.7 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.07 10.0 0.04249 mg
Substance 3 Copper Supplier 7440-50-8 71.5 10.0 43.4005 mg
Substance 3 Beryllium Supplier 7440-41-7 0.0010 10.0 6.07E-4 mg
Substance 3 Zinc Supplier 7440-66-6 27.9975 10.0 16.99448 mg
Substance 3 Manganese Supplier 7439-96-5 0.05 10.0 0.03035 mg