User Manual

114- 13120

Rev E8 of 17

3.10. Stencil

The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as long as

it prevents solder bridging from one pad to another. Generally, a thinner stencil will need a larger aperture to

maintain the given volume of solder paste. The stencil should be 0.15 mm thick. The stencil layout must be

designed using the dimensions provided on the customer drawing for the specific connector . Sample stencil

layout is provided in Figure 4.

Figure 4

Sampl e Recomm ended Connector Stencil Layout

Note: For Specific Circuit Pad Locations, Refer to the Customer Drawing for the Specific Connector

3.11. Solder Mask

When soldering, solder mask is recommended between all circuit pads to minimize solder bridging between

pads. The mask must not exceed the height of the pad. If a trace is run between adjacent pads on the pc

board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the

connector contact solder tines. Mask most suitable is Liquid Photo Imageable.

All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create

a short, or wick solder away from the solder tines, producing a weak solder joint.

3.12. Connector Placement

Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact

solder tines.

The connector must be soldered to the pc board BEFORE seating the cage assembly.

A. Registration

The connector contact solder tines must be aligned with matching circuit pads and alignment posts aligned

with matching holes before placing the connector onto the pc board.

B. Position

Optimally, the connector contact solder tines should be centered on the pc board circuit pads. However,

slight misalignment is permissible as shown in Figure 5.

CAUTION

NOTE