Datasheet

Mini- Universal MATE- N- LOK Splash- Proof Sealed Connect ors 114- 13089
Rev B14 of 20 Tyco Electronics Corporation
B. Process
The connectors can be soldered using wave soldering or equivalent soldering techniques. The
temperatures and exposure time shall be as specified in Figure 14.
SOLDERING PROCESS WAVE TEMPERATURE TIME (At Max Temperature)
Wave
260_C [500_F]
5 Seconds
Figure 14
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. The following is a list of common cleaning solvents
that will not affect the connectors for the time and temperature specified. See Figure 15.
CLEANER
TIME
(
M
i
n
u
t
e
s
)
TEMPERATU RE
(Maximum)
NAME TYPE
(
M
i
nutes
)
CELSIUS FAHRENHEIT
ALPHA 2110 Aqueous 1 132 270
BIOACT EC--7 Solvent 5 100 212
Butyl CARBITOL Solvent 1 Ambient Room
Isopropyl Alcohol Solvent 5 100 212
KESTER 5778 Aqueous 5 100 212
KESTER 5779 Aqueous 5 100 212
LONCOTERGE 520 Aqueous 5 100 212
LONCOTERGE 530 Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
Figure 15
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer--causing).
If you have a particular solvent that is not listed, contact Product Information at the number at the bottom of page 1.
D. Drying
When drying cleaned assemblies and pc boards, make certain that temperature limitations are not
exceeded: --55_ to 105_C[--68_ to 221_F]. Excessive temperatures may cause degradation or
deterioration.
3.14. Checking Installed Pin Header
All solder joints should conform to those specified in Workmanship Specification 101--21 and all other
requirements specified in this document. The installed pin header must have solder fillets evenly formed
around each contact with no skips or voids. There should be no solder on the boardlocks. Refer to Figure 16.
DANGER
NOTE
i