User's Manual

Technalogix Ltd TAUD-1000 Transmitter
VII-1
Section VII – Mechanical Section
The heat sink in each TAUD-500 which make up the amplification stage of the TAUD-1000
allows the amplifiers to operate at a cooler temperature and prevents overheating, which helps
the longevity of the entire system. The heat sink has hollow fins, which help dissipate the heat
from the amplifiers faster than a conventional serrated or corrugated fin.
In addition to the cooling effects of the heat sink, within each TAUD-500 power amplifier
enclosure, there are four fans that each provide 170 cubic feet per minute (CFM) of air flow (into
zero static pressure). There are two fans mounted at the front of the heat sink and two mounted
at the back end of the heat sink. The fans are mounted side-by-side to produce the best cooling
for the system and are operating in a push-pull configuration to assist with heat dissipation.
The Combiner/Filter enclosure also contains additional fan cooling, specifically for the digital mask
filter and also for the termination resistors on the 2-way combiner. In the event of any RF power or
phase imbalance between the two TAUD-500 Power Amplifier enclosures, the unbalance gets
dissipated in the form of heat through the flanged resistor.