User's Manual

ETRX358x-LRS and ETRX358x-LRS
©2014 Telegesis (UK) Ltd - 31 - ETRX358x-LRS Product Manual
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such
as through-hole vias, planes or tracks on your board component layer, should be located below the
ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB
containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
Figure 11. Typical pad dimensions
Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules
and to not use a washing process after reflow. If the process does require washing then care must
be taken that no washing agent is trapped underneath the shielding can after the drying process
has completed.