Product Manual

sETRX357-LRS Family

12 Recommended Reflow Profile

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 200°C

90 ±30s

20s

Figure 6. Recommended Reflow Profile

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.

Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent

and other residuals are remaining underneath the shielding can as well as in the gap between the

module and the host board.

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your PCB and re-flow).