User's Manual

CE910-DUAL Hardware User Guide
1vv0301010 Rev .0 – 2012-07-10
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 53 of 63
12.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested
thickness of stencil foil is less than 120 µm.
12.5. PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
Solder maskCopper pad
Solder Mask Defined
Copper pad
Non Solder Mask Defined
12.6. Recommendations for PCB Pad Dimensions (mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3
mm around the pads unless it carries the same signal as the pad itself (see following figure).