User's Manual

CE910-DUAL Hardware User Guide
1vv0301010 Rev .0 – 2012-07-10
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 54 of 63
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish Layer thickness (um) Properties
Electro-less Ni / Immersion Au 3 ~ 7 / 0.05 ~ 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is better compared to lead-free solder
paste.