User's Manual

CE910-DUAL Hardware User Guide
1vv0301010 Rev .0 – 2012-07-10
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 55 of 63
12.7. Solder Paste
Solder Paste Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
12.7.1. Solder Reflow
The following is the recommended solder reflow profile:
Profile stage Description
Leed-free(High-Temp)
condition limits
Preheat
Initial ramp
3 ℃/sec max
Soak
Dry out and flux activation
135 to 175 ℃
60 to 120 sec
Reflow
Time above solder paste melting point 40 to 90 sec
SMT peak package body temperature
245 ℃
Cool down
Cool rate-ramp to ambient
6 ℃/sec max
NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
WARNING:
The CE910-DUAL module withstands one reflow process only.