User's Manual

CL865-DUAL Hardware User Guide
1vv0301104 Rev.1 – 2014-03-07
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Reserved. Page 57 of 70
Mod. 0805 2011-07 Rev.2
13.4. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
13.5. PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)