User's Manual
Table Of Contents
- 1 Overview
- 2 GE864-QUAD V2 Mechanical Dimensions
- 3 GE864-QUAD V2 module connections
- 4 Hardware Commands
- 5 Power Supply
- 6 Antenna
- 7 Logic level specifications
- 8 Serial Ports
- 9 Audio Section Overview
- 10 General Purpose I/O
- 10.1 GPIO Logic levels
- 10.2 Using a GPIO Pad as INPUT
- 10.3 Using a GPIO Pad as OUTPUT
- 10.4 Using the RF Transmission Control GPIO4
- 10.5 Using the RFTXMON Output GPIO5
- 10.6 Using the Alarm Output GPIO6
- 10.7 Using the Buzzer Output GPIO7
- 10.8 Indication of network service availability
- 10.9 RTC Bypass out
- 10.10 External SIM Holder Implementation
- 11 DAC and ADC section
- 12 Conformity Assessment Issues
- 14 Document Change Log
GE864-QUAD V2 Hardware User Guide
1vv0300841 Rev.0.1 24/11/09
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 57 of 65
11.3.4 Debug of the GE864 in production
To test and debug the mounting of the GE864, we strongly recommend to foreseen test pads on the
host PCB, in order to check the connection between the GE864 itself and the application and to test
the performance of the module connecting it with an external computer. Depending by the customer
application, these pads include, but are not limited to the following signals:
• TXD
• RXD
• ON/OFF
• RESET
• GND
• VBATT
• TX_TRACE
• RX_TRACE
• PWRMON
11.3.5 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.