User Guide

GE9

GE9GE9

GE910 Hardware User Guide

10 Hardware User Guide10 Hardware User Guide

10 Hardware User Guide

1vv0300962 Rev.4 2012-06-25

Mod. 0805 2011-07 Rev.2

5.3.2. Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following

specifications:

See para 6.2 Power Consumption

Considering the very low current during idle, especially if Power Saving function is enabled, it

is possible to consider from the thermal point of view that the device absorbs current

significantly only during calls.

For the heat generated by the GE910, you can consider it to be during transmission 1W max

during CSD/VOICE calls and 2W max during class10 GPRS upload.

This generated heat will be mostly conducted to the ground plane under the GE910; you must

ensure that your application can dissipate it.

NOTE:

The average consumption during transmissions depends on the power level at which the device

is requested to transmit by the network. The average current consumption hence varies

significantly.