User Guide

GE9
GE9GE9
GE910 Hardware User Guide
10 Hardware User Guide10 Hardware User Guide
10 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 6 of 73
Mod. 0805 2011-07 Rev.2
10.3. EAR connection .....................................................................................................................................................49
10.4. Electrical Characteristics........................................................................................................................................50
10.4.1. Input Lines.....................................................................................................................................................50
10.4.2. Output Lines ..................................................................................................................................................51
11. General Purpose I/O.................................................................................................................................................52
11.1. GPIO Logic levels..................................................................................................................................................53
11.2. Using a GPIO Pad as INPUT .................................................................................................................................54
11.3. Using a GPIO Pad as OUTPUT .............................................................................................................................54
11.4. Indication of network service availability..............................................................................................................55
11.5. RTC Bypass out .....................................................................................................................................................56
11.6. External SIM Holder Implementation....................................................................................................................56
11.7. ADC Converter ......................................................................................................................................................56
11.7.1. Description....................................................................................................................................................56
11.7.2. Using ADC Converter ...................................................................................................................................56
12. Mounting the GE910 on your Board.......................................................................................................................57
12.1. General...................................................................................................................................................................57
12.2. Module finishing & dimensions.............................................................................................................................57
12.3. Recommended foot print for the application..........................................................................................................58
12.4. Stencil.....................................................................................................................................................................59
12.5. PCB pad design......................................................................................................................................................59
12.6. Recommendations for PCB pad dimensions (mm): ...............................................................................................59
12.7. Solder paste............................................................................................................................................................61
12.7.1. GE910 Solder reflow.....................................................................................................................................61
13. Debug of the GE910 in production..........................................................................................................................63
14. Packing system..........................................................................................................................................................64
14.1. Packing on tray.......................................................................................................................................................64
14.2. Moisture sensibility................................................................................................................................................66
15. Conformity Assessment Issues..................................................................................... Error! Bookmark not defined.
16. SAFETY RECOMMANDATIONS.........................................................................................................................67
17. Document History.....................................................................................................................................................73