User Guide

GE9
GE9GE9
GE910 Hardware User Guide
10 Hardware User Guide10 Hardware User Guide
10 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 60 of 73
Mod. 0805 2011-07 Rev.2
It is not recommended to place via or micro-via not covered by solder resist in an area of
0.3 mm around the pads unless it carries the same signal of the pad itself (see following
figure).
Holes in pad are allowed only for blind holes and not for through holes. When using the hole in
pad, we suggest the via filling.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
Inhibit area for micro
-
via