HE910 Hardware User Guide 1vv03700925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Applicability Table PRODUCT HE910 (*) HE910-D HE910-GL HE910-EUR HE910-EUD HE910-EUG HE910-NAR HE910-NAD HE910-NAG (*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Contents 1 INTRODUCTION ......................................................................................................................................................... 8 1.1 SCOPE ................................................................................................................................................................................ 8 1.2 AUDIENCE .......................................................................
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.1 RF Signal Requirements .......................................................................................................................................... 52 7.3.2 GPS Antenna Polarization ...................................................................................................................................... 53 7.3.3 GPS Antenna Gain ............................................................................................
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.5 PCB PAD DESIGN .............................................................................................................................................................. 81 15.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 82 15.7 SOLDER PASTE.............................................................................
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 1 Introduction 1.1 Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. 1.2 Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our HE910 modules. 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 1.4 Document Organization This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. Chapter 2: “Overview” provides an overview of the document. Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout. Chapter 4: “Hardware Commands” How to operate on the module via hardware.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 1.5 Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 2 Overview The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 3 HE910 module connections 3.1 PIN-OUT PAD Signal I/O Function USB differential Data (+) Type COMMENT USB HS 2.0 COMMUNICATION PORT B15 USB_D+ I/O C15 USB_D- I/O USB differential Data (-) I Power sense for the internal USB transceiver. VUSB A13 Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control N15 C103/TXD I Serial data input from DTE CMOS 1.8V M15 C104/RXD M14 C108/DTR O Serial data output to DTE CMOS 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 SIMVCC A3 - External SIM signal – Power supply for the SIM 1.8 / 3V Digital Voice Interface (DVI) 16K pull down when in Input Input with 16K 1.8V) 16K pull down when in Input Input with 16K 1.8V) (typical at 1.8V) B9 DVI_WA0 I/O Digital Audio Interface (WA0) 1.8V B6 DVI_RX I Digital Audio Interface (RX) 1.8V B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.
HE910 Hardware User Guide 1vv0300925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 NOTE: If not used, almost all pins should be left disconnected.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 3.1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 3.1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 3.1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 3.1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 4 Hardware Commands 4.1 Turning ON the HE910 To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then released. The maximum current that can be drained from the ON_OFF* pad is 0,1 mA. A simple circuit to do it is: NOTE: Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper power on/off of the module.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 A flow chart showing the proper turn on procedure is displayed below: “Modem ON Proc” START N VBATT > 3.22V ? Y Y PWMON = ON ? N ON_OFF* = LOW GOTO “HW SHUTDOWN unconditional” Delay = 5 Sec ON_OFF* = HIGH PWMON = ON ? N Y Delay 1s GOTO “Start AT CMD.” “Modem ON Proc” END Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD.” START DELAY 300msec Enter AT AT answer in 1 sec ? N GOTO “HW SHUTDOWN unconditional” Y “Start AT CMD.” GOTO END “Modem ON Proc.” NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button: WARNING It is recommended to set the ON_OFF* line LOW to power on the module only after VBATT is higher than 3.22V. Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF * line. An example of this is described in the following diagram: After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on the module. Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 4.2 Turning OFF the HE910 Turning off of the device can be done in two ways: • via AT command (see HE910 Software User Guide, AT#SHDN) • by tying low pin ON_OFF* Either ways, the device issues a detach request to network informing that the device will not be reachable any more. To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and then released.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 The following flow chart shows the proper turn off procedure: Modem OFF Proc. START PWRMON=ON? N Y AT Key OFF Mode ON_OFF* = LOW AT#SHDN Delay >= 3 Sec ON_OFF* = HIGH PWMON = ON ? N “Modem OFF Proc” END Y N Looping for more than 15s ? Y GOTO “HW Shutdown Unconditional” Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 4.3 HE910 Unconditional Shutdown The Unconditional Shutdown of the module could be activated using the HW_SHUTDOWN* line (pad R13). WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 A typical circuit is the following: For example: 1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 “HW SHUTDOWN Unconditional” START HW_SHDN = LOW Delay 1s Delay 200ms Disconnect VBATT HW_SHDN = HIGH PWRMON = ON Y N “HW SHUTDOWN Unconditional” END Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5 Power Supply The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. 5.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5.2 Power Consumption HE910 Mode Average (mA) SWITCHED OFF Switched Off 40uA AT+CFUN=1 12.2 AT+CFUN=5 AT+CFUN=1 AT+CFUN=4 AT+CFUN=5 WCDMA Voice WCDMA HSDPA (0dBm) WCDMA HSDPA (22dBm) EDGE 4TX+2RX GSM900 PL5 DCS1800 PL0 Mode description Module supplied but Switched Off IDLE mode (WCDMA) Normal mode: full functionality of the module Full functionality with power saving; DRX7; 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5.3 General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: • the electrical design • the thermal design • the PCB layout. 5.3.1 Electrical Design Guidelines The electrical design of the power supply depends strongly from the power source where this power is drained.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 An example of linear regulator with 5V input is: 5.3.1.2 + 12V Guidelines input Source Power Supply Design • The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the HE910.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 • Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes. • A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion. This can be the same diode as for spike protection.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5.3.1.3 Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit HE910 module. WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5.3.2 Thermal Design Guidelines The thermal design for the power supply heat sink should be done with the following specifications: • Average current consumption during HSDPA transmission @PWR level max : 600 mA • Average current during idle: 1.5 mA NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 5.3.3 Power Supply PCB layout Guidelines As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 • The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. • The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6 GSM/WCDMA Radio Section 6.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6.3 Sensitivity Band GSM 850 GSM 900 DCS1800 PCS 1900 WCDMA FDD B1 WCDMA FDD B2 WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 Typical (without Diversity) Note -109.5 dBm -109 dBm -110 dBm -109.5 dBm -111 dBm -110 dBm -111 dBm -111 dBm -110 dBm BER Class II <2.44% BER Class II <2.44% BER Class II <2.44% BER Class II <2.44% BER <0.1% BER <0.1% BER <0.1% BER <0.1% BER <0.1% 6.
HE910 Hardware User Guide 1vv0300925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6.6 PCB Guidelines in case of FCC certification In the case FCC certification is required for an application using HE910, HE910-D, HE910NAx, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on module’s interface board and described in the following chapter. 6.6.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6.6.2 Transmission line measurements HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Insertion Loss of G-CPW line plus SMA connector is shown below: Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6.7 GSM/WCDMA Antenna - Installation Guidelines • Install the antenna in a place covered by the GSM signal.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 6.8 Antenna Diversity Requirements This product is including an input for a second RX antenna to improve the radio sensitivity. The function is called Antenna Diversity.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7 GPS Receiver The HE910 module is integrating a GPS receiver that could be used in Autonomous or in A-GPS (assisted GPS) mode. With the help of advanced digital signal processing algorithms and the use of A-GPS data, the receiver is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.2 GPS Signals Pinout The Pads related to this function are the following: PAD Signal I/O Function Type R9 ANT_GPS I GPS Antenna (50 ohm) RF R7 GPS_LNA_EN O Output enable for External LNA supply CMOS 1.8V 7.3 RF Front End Design The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the module to work well with a passive GPS antenna.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 However, the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies, etc., as well as outright blockage caused by building, terrain or other items in the line of sight to the specific GPS satellite. This variable attenuation is highly dependent upon GPS satellite location.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.3 GPS Antenna Gain Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical isotropic antenna (equally sensitive in all directions). For example, a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by 70mm) will give an antenna gain at zenith of 5 dBic.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.5 GPS Antenna - PCB Line Guidelines • Ensure that the antenna line impedance is 50ohm. • Keep the antenna line on the PCB as short as possible to reduce the loss. • Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves. • Keep one layer of the PCB used only for the Ground plane, if possible.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.7 Implications of the Pre-select SAW Filter The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA, that is, the RF input of the HE910 ties directly into the SAW filter. Any circuit connected to the input of the HE910 would see complex impedance presented by the SAW filter, particularly out of band, rather than the relatively broad and flat return loss presented by the LNA.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.10 External LNA Enable The HE910 is already provided by an internal LNA. In case the Application needs to include an additional LNA stage, the module is provided by a digital signal usable to enable the power supply of the external amplifier. The signal is set to High only when the GPS receiver is active. The electrical characteristics of the GPS_LNA_EN signal are: Level Min Max Output high level 1.6V 1.9 Output low level 0V 0.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 7.3.11 Shielding Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS antenna itself, the most sensitive portion of the RF path. The antenna cannot be shielded because then it can’t receive the GPS signals. There are two solutions, one is to move the antenna away from the source of interference or the second is to shield the digital interference to prevent it from getting to the antenna. 7.3.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 8 Logic level specifications The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V Input level on any digital pin (CMOS 1.2) with respect to ground -0.3V 1.4V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 8.1 Unconditional Shutdown Signal Function I/O PAD HW_SHUTDOWN* Unconditional Shutdown of the Module I R13 HW_SHUTDOWN* is used to unconditionally shutdown the HE910. Whenever this signal is pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release of the line, the HE910 is unconditionally shut down, without doing any detach operation from the network where it is registered.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 9 USB Port The HE910 includes one integrated universal serial bus (USB 2.0 HS) transceiver. 9.1 USB 2.0 HS Description This port is compliant with the USB 2.0 HS. The USB FS is supported for AT interface and data communication. The following table is listing the available signals: PAD Signal I/O Function Type B15 USB_D+ I/O USB differential Data (+) 3.3V C15 USB_D- I/O USB differential Data (-) 3.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 10 SPI port The HE910 Module is provided by one SPI interface. The SPI interface defines two handshake lines for flow control and mutual wake-up of the modem and the Application Processor: SRDY (slave ready) and MRDY (master ready). The AP has the master role, that is, it supplies the clock. The following table is listing the available signals: PAD Signal I/O Function Type COMMENT D15 SPI_MOSI I SPI MOSI CMOS 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 10.1 SPI Connections SPI_MISO E15 SPI_MOSI D15 SPI_CLK F15 SPI_MRDY H15 HE910 SPI_SRDY J15 VDD_IO1 D13 1V8_SEL E13 D14 AP nc Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 11 USB HSIC The HE910 Module is provided by one USB HSIC interface. The USB HSIC (High Speed Inter Processor) Interface allows supporting the inter-processor communication between an application processor (AP) – the host, and the modem processor (CP) – the HE910. The following table is listing the available signals: Pad Signal A12 Direction Function Type HSIC_USB_DATA I/O USB HSIC data signal CMOS 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 12 Serial Ports The HE910 module is provided with by 2 Asynchronous serial ports: • MODEM SERIAL PORT 1 (Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: • RS232 PC com port • microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) • microcontroller UART @ 5V or other voltages different from 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 12.1 MODEM SERIAL PORT 1 (USIF0) The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 The input line ON_OFF and RESET state can be treated as in picture below NOTE: According to V.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 12.2 MODEM SERIAL PORT 2 (USIF1) The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX signals. The signals of the HE910 serial port are: PAD Signal I/O Function Type COMMENT D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V SHARED WITH SPI_MTSR E15 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 12.3 RS232 level translation In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: • invert the electrical signal in both directions; • Change the level from 0/1.8V to +15/-15V.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only). The RS232 serial port lines are usually connected to a DB9 connector with the following layout: Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 13 Audio Section Overview The Audio of the HE910 Module is carried by DVI digital audio interface. The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed). 13.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14 General Purpose I/O The HE910 module is provided by a set of Digital Input / Output pins Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the HE910 firmware and acts depending on the function implemented.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14.1 GPIO Logic levels Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14.2 Using a GPIO Pad as INPUT The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14.4 Indication availability of network service The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command). In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14.5 RTC Bypass out The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 14.8 ADC Converter 14.8.1 Description The HE910 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word. The following table is showing the ADC characteristics: Input Voltage range AD conversion Input Resistance Input Capacitance Min 0 1 - Typical Max 1.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15 Mounting the application HE910 on the 15.1 General The HE910 modules have been designed in order to be compliant with a standard lead-free SMT process. 15.2 Module finishing & dimensions Pin B1 Bottom view Dimensions in mm Lead-free Alloy: Surface finishing Ni/Au for all solder pads Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.3 Recommended foot print for the application TOP VIEW In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.4 Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. 15.5 PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Pad Pad Solder Mask PCB SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined) Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.6 PCB pad dimensions The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) Solder resist openings Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Electro-less Ni / Immersion Au Layer thickness [µm] 3 –7 / 0.05 – 0.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.7 Solder paste Solder paste Lead free Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. 15.7.1 HE910 Solder reflow Recommended solder reflow profile: Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.8 Packing system (Tray) The HE910 modules are packaged on trays of 36 pieces each. These trays can be used in SMT processes for pick & place handling. Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.9 Packing System (Reel) The HE910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. 15.9.1 Carrier Tape Detail Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.9.2 Reel Detail Reproduction forbidden without Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 15.9.3 Packaging Detail 15.10 Moisture sensitivity The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC JSTD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 16 SAFETY RECOMMANDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 17 Conformity assessment issues 17.1 1999/5/EC Directive The HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-GL, HE910-NAG, HE910NAR, HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC Directive. Bulgarian Czech Danish Dutch English Estonian German Greek Hungarian Finnish French Icelandic Italian С настоящето Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Latvian Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Maltese Hawnhekk, Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 The HE910-D, HE910-GL, HE910-EUR, HE910-EUD modules are compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EMC (R&TTE art. 3.1b) Health & Safety (R&TTE art. 3.1a) EN 301 511 V9.02 EN 301 908-1 V6.2.1 EN 301 908-2 V6.2.1 EN 301 489-1 V1.9.2 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the following assessments: RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product. EMC (R&TTE art. 3.1b) Testing Health & Safety (R&TTE art. 3.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 17.2 FCC/IC Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
HE910 Hardware User Guide 1vv0300925 Rev.28 – 2015-06-24 Contains FCC ID: RI7HE910 Contains IC: 5131A-HE910 HE910-GL Contains FCC ID: RI7HE910GL Contains IC: 5131A-HE910GL HE910-NAR, HE910-NAD, HE910-NAG Contains FCC ID: RI7HE910NA Contains IC: 5131A-HE910NA CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. Reproduction forbidden without Telit Communications S.p.A.
