LM960 HW Design Guide [01.2017] 1VV0301485 Rev.15 – 2020-08-13 Mod.0818 2017-01 Rev.
LM960 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
LM960 HW Design Guide 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II.
LM960 HW Design Guide NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSS
LM960 HW Design Guide Applicability Table PRODUCTS LM960 LM960A18 LM960A9-P 1VV0301485 Rev.
LM960 HW Design Guide Contents NOTICE 2 COPYRIGHTS ................................................................................................ 2 COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3 APPLICABILITY TABLE ................................................................................ 5 CONTENTS ............................................................................
LM960 HW Design Guide 2.9.1. Temperature Range .................................................................... 27 2.9.2. RoHS Compliance ...................................................................... 28 3. PINS ALLOCATION ................................................................... 29 Pin-out ........................................................................................ 29 LM960 Signals That Must Be Connected .................................... 32 Pin Layout.............
LM960 HW Design Guide 6.3.2.2. Fast Shutdown by GPIO ............................................................. 47 6.3.3. Unconditional Shutdown ............................................................. 48 Reset .......................................................................................... 49 6.4.1. Graceful Reset ............................................................................ 50 6.4.2. Unconditional Hardware Reset ...................................................
LM960 HW Design Guide 9. APPLICATION GUIDE ............................................................... 69 Debug of the LM960 Module in Production ................................. 69 Bypass Capacitor on Power Supplies ......................................... 69 EMC Recommendations ............................................................. 70 10. PACKAGING .............................................................................. 73 Tray .......................................................
LM960 HW Design Guide 1. INTRODUCTION Scope This document introduces the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document are applicable to all LM960 variants, where “LM960” refers to the variants listed in the Applicability Table. If a specific feature is applicable to a specific product only, it will be clearly marked.
LM960 HW Design Guide TS-APAC@telit.com TS-SRD@telit.com For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
LM960 HW Design Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1VV0301485 Rev.
LM960 HW Design Guide Related Documents LM960 SW User Guide, 1VV0301477 LM960 AT Commands Reference Guide, 80568ST10869A Generic EVB HW User Guide, 1VV0301249 LM960 Interface Board HW User Guide, 1VV0301502 SIM Integration Design Guide Application Note Rev10, 80000NT10001A 1VV0301485 Rev.
LM960 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LM960 Mini PCIe module. In its most basic use case, LM960 can be applied as a wireless communication front-end for mobile products, offering mobile communication features to an external host CPU through its rich interfaces.
LM960 HW Design Guide 4DL CA CA_2A-2A-5A-30A, CA_2A-2A-5A-66A, CA_2A-2A-12A-30A, CA_2A-2A-12A-66A, CA_2A-2A-14A-66A, CA_2A-2A-29A-30A, CA_2A-2A-66A-66A, CA_2A-4A-4A-12A, CA_2A-4A-5A-30A, CA_2A-4A-12A-30A, CA_2A-5A-30A-66A, CA_2A-5A-66A-66A, CA_2A-5B-30A, CA_2A-5B-66A, CA_2A-12A-30A-66A, CA_2A-12A-66A-66A, CA_2A-14A-30A-66A, CA_2A-14A-66A-66A, CA_2A-29A-30A-66A, CA_[2A]-46D, CA_[4A]-46D, CA_4A-4A-12A-30A, CA_5A-30A-66A-66A, CA_5B-30A-66A, CA_5B-66A-66A, CA_12A-30A-66A-66A, CA_14A-30A-66A-66A, CA_29A-30A-66
LM960 HW Design Guide Generic (EU and rest of world) CA combos 2DL CA 3DL CA CA_1A-3A, CA_1A-5A, CA_1A-7A, CA_1A-8A, CA_1A-18A, CA_1A-19A, CA_1A-20A, CA_1A-26A, CA_1A-28A, CA_1A-32A, CA_1A-38A, CA_1A-40A, CA_1A-41A, CA_1A-42A, CA_[2A]-[4A], CA_[2A]-5A, CA_[2A]-7A, CA_[2A]-12A, CA_[2A]-28A, CA_[2A]-46A, CA_[2A]-48A, CA_[2A]-[66A], CA_[2A]-71A, CA_3A-5A, CA_3A-7A, CA_3A-8A, CA_3A-19A, CA_3A-20A, CA_3A-26A, CA_3A-28A, CA_3A-32A, CA_3A-38A, CA_3A-40A, CA_3A-42A, CA_[4A]-5A, CA_4A-7A, CA_[4A]-12A, CA_[4A]-28A
LM960 HW Design Guide 4DL CA CA_1A-1A-3A-28A, CA_1A-3A-3A-28A, CA_1A-3A-7A-7A, CA_1A-3A-7C, CA_1A-3A-7A-8A, CA_1A-3A-7A-20A, CA_1A-3A-7A-28A, CA_1A-3A-8A-40A, CA_1A-3A-3A-8A, CA_1A-3A-40C, CA_1A-3A-42C, CA_1A-3C-5A, CA_1A-3C-7A, CA_1A-3C-8A, CA_1A-3C-28A, CA_1A-7C-28A, CA_1A-42D, CA_1A-46D, CA_2A-2A-12A-66A, CA_2A-2A-66A-66A, CA_2A-2A-66A-71A, CA_[2A]-2A-66C, CA_2A-[2A]-66C, CA_2A-2A-[66C], CA_2A-4A-7A-12A, CA_2A-12A-66A-66A, CA_2A-46A-46A-66A, CA_[2A]-46A-46C, CA_[2A]-46C-66A, CA_2A-46C-[66A], CA_[2A]-46
LM960 HW Design Guide 3DL CA 4DL CA CA_[2A]-2A-5A, CA_2A-[2A]-5A, CA_[2A]-2A-12A, CA_2A-[2A]-12A, CA_2A-2A-30A, CA_[2A]-2A-66A, CA_2A-[2A]-66A, CA_2A-2A-[66A], CA_[2A]-2A-71A, CA_2A-[2A]-71A, CA_[2A]-4A-4A, CA_2A-[4A]-4A, CA_2A-4A-[4A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-12A, CA_2A-[4A]-12A, CA_[2A]-4A-29A, CA_2A-[4A]-29A, CA_2A-4A-30A, CA_[2A]-4A-71A, CA_2A-[4A]-71A, CA_2A-5A-30A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_2A-7A-12A, CA_2A-12A-30A, CA_[2A]-12A-66A, CA_2A-12A-[66A], CA_[2A]-12B, CA_2A-14A-
LM960 HW Design Guide 3DL CA CA_[2A]-2A-5A, CA_[2A]-2A-13A, CA_[2A]-2A-66A, CA_2A-2A-[66A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-13A, CA_2A-[4A]-13A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_[2A]-13A-66A, CA_2A-13A-[66A], CA_[2A]-66A-66A, CA_2A-[66A]-66A, CA_[2A]-[66B], CA_[2A]-[66C], CA_[4A]-4A-5A, CA_[4A]-4A-13A, CA_5A-[66A]-66A, CA_5A-[66B], CA_5A-[66C], CA_13A-[66A]-66A, CA_13A-[66B], CA_13A-[66C], CA_[66A]-[66C], CA_[66D], CA_[2A]-48A-48A, CA_[2A]-48A-66A, CA_2A-48A-[66A], CA_[2A]-48C, CA_13A-48A-48A,
LM960 HW Design Guide 3DL CA 4DL CA CA_1A-1A-3A, CA_1A-3A-3A, CA_1A-3A-7A, CA_1A-3A-8A, CA_1A-3A-19A, CA_1A-3A-20A, CA_1A-3A-28A, CA_1A-3A-32A, CA_1A-3A-38A, CA_1A-3A-40A, CA_1A-3A-41A, CA_1A-3A-42A, CA_1A-3C, CA_1A-7A-7A, CA_1A-7A-8A, CA_1A-7A-20A, CA_1A-7A-28A, CA_1A-7A-42A, CA_1A-7C, CA_1A-8A-40A, CA_1A-20A-32A, CA_1A-20A-42A, CA_1A-28A-42A, CA_1A-40C, CA_1A-41C, CA_1A-42C, CA_1A-46C, CA_1C-3A, CA_[2A]-2A-12A, CA_2A-[2A]-12A, CA_[2A]-2A-66A, CA_2A-[2A]-66A, CA_2A-2A-[66A], CA_[2A]-2A-71A, CA_2A-[2A]-7
LM960 HW Design Guide T-Mobile CA combos 2DL CA 3DL CA 4DL CA CA_[2A]-[4A], CA_[2A]-5A, CA_2A-7A, CA_[2A]-12A, CA_[2A]-14A, CA_[2A]-29A, CA_2A-30A, CA_[2A]-46A, CA_[2A]-48A, CA_[2A]-[66A], CA_[2A]-71A, CA_[4A]-5A, CA_4A-7A, CA_[4A]-12A, CA_[4A]-29A, CA_4A-30A, CA_[4A]-46A, CA_[4A]-71A, CA_5A-30A, CA_5A-[66A], CA_7A-12A, CA_12A-30A, CA_12A-[66A], CA_14A-30A, CA_14A-[66A], CA_[25A]-26A, CA_25A-41A, CA_26A-[41A], CA_29A-30A, CA_29A-[66A], CA_30A-66A, CA_46A-[66A], CA_48A-[66A], CA_[66A]-71A, CA_[2A]-[2A],
LM960 HW Design Guide Sprint CA combos 2DL CA CA_[25A]-[25A], CA_[25A]-26A, CA_25A-41A, CA_26A-[41A], CA_[41A]-[41A], CA_[41C] 3DL CA CA_[25A]-25A-26A, CA_26A-[41C], CA_[41A]-[41C], CA_[41D], CA_25A-41C 4DL CA CA_25A-41D, CA_[41C]-41C, CA_[41A]-41D, CA_41E 2UL CA CA_41C 2.2.1.3.
LM960 HW Design Guide Function Module Features Cellular module for data communication LM960/LM960A18 o LTE FDD/TDD Cat18(DL)/13(UL) (1.2 Gbps/150 Mbps) o WCDMA up to DC HSPA+, Rel.10 LM960A9-P o Two USIM ports – dual voltage Application processor Support for GPS, GLONASS, BeiDou and Galileo Support for two SIM interfaces Class B and Class C support Clock rates up to 4 MHz Application processor 32 bit ARM Cortex-A7 up to 1.
LM960 HW Design Guide Function Form factor Environment and quality requirements Single supply module RTC Operating temperature 1VV0301485 Rev. 15 Features Mini PCIe Form factor (50.95x30x2.7mm), supporting multiple RF bands The device is designed and qualified by Telit to satisfy environmental and quality requirements. The module internally generates all its required internal supply voltages. Real-time clock is supported. Range -40 °C to +85 °C (conditions as defined in Section 2.9.
LM960 HW Design Guide Block Diagram Below figure shows an overview of the internal architecture of the LM960 module. LM960 Block Diagram It includes the following sub-functions: Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end Rich IO interfaces.
LM960 HW Design Guide TX Output Power Band Power class 3G WCDMA Class 3 (0.2W) LTE All Bands Class 3 (0.2W) LTE Band 41 supports HPUE Class 2 (0.4W) RX Sensitivity Below the 3GPP measurement conditions used to define the RX sensitivity: Technology 3GPP Compliance 4G LTE Throughput >95% 10MHz Dual Receiver 3G WCDMA BER <0.1% 12.
LM960 HW Design Guide LM960 LTE FDD B71 -99.5 dBm WCDMA FDD B1 WCDMA FDD B2 WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 WCDMA FDD B9 WCDMA FDD B19 -111.0 dBm -110.0 dBm -111.0 dBm -111.0 dBm -110.0 dBm -110.0 dBm -111.0 dBm * LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously. ** 3.3 Voltage / Room temperature Mechanical specifications 2.8.1. Dimensions LM960 module overall dimensions are: Length: 50.95 mm, +/- 0.15 mm tolerance Width: 30.00 mm, +/- 0.
LM960 HW Design Guide Note parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. Storage and nonoperating Temperature Range –40°C ~ +85°C 2.9.2.
LM960 HW Design Guide 3. PINS ALLOCATION Pin-out LM960 Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 USB_D+ I/O USB 2.0 Data Plus Analog 36 USB_D- I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication 25 USB_TX_P O USB 3.0 superspeed Analog 23 USB_TX_M O USB 3.0 superspeed Analog 33 USB_RX_P I USB 3.0 superspeed Analog 31 USB_RX_M I USB 3.
LM960 HW Design Guide 19 SIMIO2 I/O Data connection with an external UIM2 card 1.8 / 2.85V 17 SIMCLK2 O Clock output to an external UIM2 card 1.8 / 2.85V 6 SIMRST2 O Reset output to an external UIM2 card 1.8 / 2.85V Digital I/O (GPIOs) 3 GPIO_01 I/O General purpose I/O Can be used as SIMIN1 1.8V 5 GPIO_02 I/O General purpose I/O Can be used as SIMIN2 1.8V 44 GPIO_03 I/O General purpose I/O 1.8V 46 GPIO_04 I/O General purpose I/O 1.
LM960 HW Design Guide Power Supply 2 VBATT I Power supply Power 24 VBATT I Power supply Power 39 VBATT I Power supply Power 41 VBATT I Power supply Power 52 VBATT I Power supply Power 4 GND - Ground Ground 9 GND - Ground Ground 15 GND - Ground Ground 18 GND - Ground Ground 21 GND - Ground Ground 26 GND - Ground Ground 27 GND - Ground Ground 29 GND - Ground Ground 34 GND - Ground Ground 35 GND - Ground Ground 37 GND - Ground Grou
LM960 HW Design Guide Information – PCIe bus is NOT supported LM960 Signals That Must Be Connected Below table specifies the LM960 signals that must be connected for debugging purposes, even if not used by the end application: Mandatory Signals Pin Signal Notes 2, 24, 39, 41, 52 VBATT 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 GND 38 USB_D+ If not used, connect to a test point or an USB connector 36 USB_D- If not used, connect to a test point or an USB connector 1VV0301485 Rev.
LM960 HW Design Guide Pin Layout 1VV0301485 Rev.
LM960 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are very important components of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LM960 power requirements are as follows: Power Supply Requirements Nominal supply voltage 3.3V Supply voltage range 3.10V – 3.
LM960 HW Design Guide Mode Average [Typ.] Mode Description 900mA CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL (FDD 300Mbps DL / 150Mbps UL) 5DL CA with 2x2 MIMO / 1UL 1000mA CA_2A-5B-66A-66A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL (FDD 1Gbps DL / 75Mbps UL) 3DL CA with 4x4 MIMO / 1UL 1200mA CA_2A-66C, 4x4 MIMO, Full RB, 256QAM DL / 64QAM UL (FDD 1.
LM960 HW Design Guide 4.3.1.1. + 5V Input Source Power Supply – Design Guidelines The desired output for the power supply is 3.3V. Being the difference between the input source and the desired output moderate, a linear regulator can be used. A switching power supply is preferred to reduce power consumption. When using a linear regulator, a proper heat sink must be provided to dissipate the power generated.
LM960 HW Design Guide In LTE/WCDMA/HSPA mode, the LM960 emits RF signals continuously during transmission. Therefore, special attention must be paid on how to dissipate the heat generated. While designing the application board, special care must be taken by placing the LM960 module on a large ground area of the application board for effective heat dissipation. Information – The LM960 must be connected to the ground and metal chassis of the host board for best RF performance and thermal dissipation.
LM960 HW Design Guide The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100500 kHz). Use a good common ground plane.
LM960 HW Design Guide Symbol Parameter Min Typ Max Unit VGNSS DC bias Voltage of Internal LDO for GNSS bias 2.9 3.1 3.15 [V] IGNSS DC bias Current of Internal LDO for GNSS bias - - 100 [mA] 1VV0301485 Rev.
LM960 HW Design Guide 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings – Not Operational Caution – A deviation from the value ranges listed below may harm the LM960 module. Absolute Maximum Ratings – Not Operational Symbol VBATT Parameter Battery supply voltage on pin VBATT Min Max Unit -0.5 +4.
LM960 HW Design Guide 6. DIGITAL SECTION Logic Levels Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
LM960 HW Design Guide Parameter IILPU Low-level input leakage current Min Max Unit Comment -97.5 -27.5 [uA] With pull-up IIHPD High-level input leakage current 27.5 97.5 [uA] With pull-down CI/o -- 5 [pF] I/O capacitance 6.1.3. 1.8V SIM Card Pins Operating Range – SIM Pins Working at 1.8V Parameter Min Max Unit Comment VIH Input high level 1.26V 2.1V [V] VIL Input low level -0.3V 0.36V [V] VOH Output high level 1.44V 1.8V [V] VOL Output low level 0V 0.
LM960 HW Design Guide Parameter Min Max Unit Comment VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -- 1000 [uA] No pull-up IIH High-level input leakage current -20 20 [uA] No pull-down Power On The LM960 is automatically turning on when the VBATT is supplied. Information – To turn on the LM960 module, the SYSTEM_RESET_N pin must not be asserted low. 6.2.1.
LM960 HW Design Guide LM960 Initialization and Activation Information – To verify if the LM960 has powered up properly, please check through one of two conditions below: (1) LM960 and the host should be connected via USB. When USB driver is completely loaded, the module has powered on without problems and is ready to accept AT commands. (2) Monitoring Boot OK (Shutdown Indicator). To use Boot OK (Shutdown Indicator), Boot OK(Shutdown Indicator) function must be enabled through AT#SHDNIND.
LM960 HW Design Guide Unconditional Shutdown using the SYSTEM_RESET_N 6.3.1. Graceful Shutdown To shutdown the LM960 module safely, host can use the graceful shutdown function. The graceful shutdown can be triggered by: AT command via USB 6.3.1.1. Graceful Shutdown by AT command To gracefully shutdown the LM960 module, AT#SHDN command must be sent via a USB communication.
LM960 HW Design Guide Warning – Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 6.3.2. Fast Shutdown For a quicker shutdown of the LM960 module, the host can use the fast shutdown functionFast shutdown can be triggered by: AT command via USB GPIO 6.3.2.1. Fast Shutdown by AT command Once AT#FASTSHDN command is sent through the USB port, the LM960 enters finalization state, terminates active processes and preparing to safely turn off.
LM960 HW Design Guide Information – VBATT must not be removed before Shutdown Indicator goes LOW. Warning – Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 6.3.2.2. Fast Shutdown by GPIO If properly configured, one of GPIO lines can be used as Fast Shutdown Trigger. Once the Fast Shutdown Trigger senses a HIGH to LOW transition, fast shutdown is initiated.
LM960 HW Design Guide Information – VBATT must not be removed before Shutdown Indicator goes LOW. Warning – Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 6.3.3. Unconditional Shutdown To turn off the LM960, SYSTEM_RESET_N pad must be asserted low for more than 1 seconds and then it should be kept low.
LM960 HW Design Guide Warning – Not following the recommended shut-down procedures might damage the device and consequently void the warranty. Shutdown by SYSTEM_RESET_N Pad Below figure shows a simple circuit for this action. Circuit for Shutdown by SYSTEM_RESET_N Reset Device reset can be achieved as follows: • Graceful Reset by USB AT command AT#REBOOT • Unconditional Reset using the SYSTEM_RESET_N 1VV0301485 Rev.
LM960 HW Design Guide 6.4.1. Graceful Reset To gracefully restart the LM960 module, AT#REBOOT AT command must be sent through USB port. Graceful Reset by AT#REBOOT 6.4.2. Unconditional Hardware Reset To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released.
LM960 HW Design Guide Information – Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latchup problems on the LM960 power regulator and improper functioning of the module. The RESET_N line must be connected only in an open-collector configuration. Dying Gasp If any major issue occurs within the Host System, the host itself can use the dying gasp function by notifying the LM960 module.
LM960 HW Design Guide Usually dying gasp feature is completed less than 1 second after triggered. This may take longer depending on network conditions. Communication ports Below table summarizes hardware interfaces available of the LM960 module. LM960 Hardware Interfaces Interface LM960 USB Super-speed USB3.0 with high-speed USB2.0 PCIe Peripheral Component Interconnect Express USIM x2, dual voltage each (1.8V/2.
LM960 HW Design Guide The USB port is typically the main interface between the LM960 module and OEM hardware. USB 3.0 needs AC coupling series capacitors on the TX lines in both directions. In order to interface USB3.0 with the application board controlling the modem, 0.1uF capacitors should be installed on USB_SS_RX_P/M lines of the LM960. Series capacitors are already placed on USB_SS_TX_P/M lines inside LM960 module.
LM960 HW Design Guide PIN Signal I/O Function Type 38 USB_D+ I/O USB 2.0 Data Plus Analog 36 USB_D- I/O USB 2.0 Data Minus Analog 33 USB_SS_RX_P I 31 USB_SS_RX_M I 25 USB_SS_TX_P O 23 USB_SS_TX_M O USB 3.0 super-speed receive – plus USB 3.0 super-speed receive – minus USB 3.0 super-speed transmit – plus USB 3.
LM960 HW Design Guide ESD Protection for USB3.0 6.6.2. SIM Interface The LM960 supports two external SIM interfaces (1.8V or 2.85V). Below table lists the SIM interface signals. SIM Interface Signals PIN Signal I/O Function Type Comment Power SIM Card Interface 1 8 SIMVCC1 O Supply output for an external UIM1 card 1.8V / 2.85V 10 SIMIO1 I/O Data connection with an external UIM1 card 1.8V / 2.85V 12 SIMCLK1 O Clock output to an external UIM1 card 1.8V / 2.
LM960 HW Design Guide 6 SIMRST2 O Reset output to an external UIM2 card 1.8 / 2.85V Digital I/O (GPIOs) 3 GPIO_01 I UIM1 Card Present Detect 1.8V GPIO_01 can be used as SIMIN1 5 GPIO_02 I UIM2 Card Present Detect 1.8V GPIO_02 can be used as SIMIN2 6.6.2.1. SIM Schematic Example The following Figures illustrate in particular how the application interface should be designed. SIM Schematics Information – LM960 contains an internal pull-up resistor on SIMIO.
LM960 HW Design Guide Below table lists the control signals of LM960. Module Control Signal PIN Signal I/O 20 W_DISABLE_N I 1 42 PCIE_WAKE_N WAN_LED_N I/O O 6.6.3.1. Function Type Comment RF disable (airplane mode) Open-drain Internal VBATT Pull-up PCIe wake-up LED control 1.
LM960 HW Design Guide Information – If enable the LED function and connect the LED to the WAN_LED_N pin, current consumption may be increased. 6.6.4. General Purpose I/O The general-purpose I/O pins can be configured to act in three different ways: Input Output Dedicated Function Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be set or the pin level can be queried. Below table lists the GPIO signals of LM960.
LM960 HW Design Guide 6.6.4.1. Using a GPIO Pin as Input GPIO pins, when used as inputs, can be tied to a digital output of another device and report its status, provided the device interface levels are compatible with the GPIO 1.8V CMOS levels. If a digital output of a device is tied to GPIO input, the pin has interface levels different than 1.8V CMOS. It can be buffered with an open collector transistor with a 47 kΩ pull-up resistor to 1.8V. 6.6.4.2.
LM960 HW Design Guide Below functions are not dedicated to specific GPIO. One of the dedicated GPIOs (GPIO_03 to GPIO_08) can be configured by means of AT commands for one of the following functions: Boot OK Shutdown Indicator Shutdown Trigger Dying Gasp Trigger Not Dedicated I/O Pin no. Signal IO/Level Dedicated Function 44 GPIO_03 I/O, 1.8V Can be used as specific functions. 46 GPIO_04 I/O, 1.8V Can be used as specific functions. 45 GPIO_05 I/O, 1.
LM960 HW Design Guide Information – I2C is supported only on from Modem side as SW emulation of I2C on GPIO lines. Please contact Telit Customer support for further information. Information – If the I2C interface is not used, the signals can be left floating.
LM960 HW Design Guide 7. RF SECTION Antenna requirements The antenna connection is one of the most important aspect in the full product design as it strongly affects the product overall performance. Hence, please read carefully and follow the requirements and the guidelines for a proper design. The LM960/LM960A18 is provided with five RF connectors. The available connectors are: Primary RF antenna #0: Tx and Rx path for low bands and middle bands / 4x4 MIMO path of band41.
LM960 HW Design Guide VSWR absolute max <= 10:1 VSWR recommended <= 2:1 Secondary Antenna Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Antenna Diversity Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.
LM960 HW Design Guide GNSS Receiver The LM960 integrates a GNSS receiver that could be used in Standalone mode and in AGPS (assisted GPS), according to the different configurations. LM960 supports an active antenna. Frequency range • Wide-band GNSS: 1559–1606 MHz recommended • GPS: 2.046 MHz BW NB GPS (centered on 1575.42 MHz) • Glonass (GLO): ~ 8.3 MHz BW (1597–1606 MHz) • BeiDou (BDS): 4.092 MHz BW (1559.05 – 1563.14 MHz) • Galileo (GAL): 4.092 MHz BW (centered on 1575.42 MHz) Gain 1.
LM960 HW Design Guide Antenna connection 7.5.1. Support bands on antenna ports The LM960/LM960A18 has an assigned antenna port depending on the frequency band.
LM960 HW Design Guide 7.5.2. Antenna Connector The LM960 is equipped with a set of 50 Ω RF MHF4 connectors from I-PEX 20449-001. For more information about mating connectors, please https://www.i-pex.com 7.5.3. Antenna Cable Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. If the host device is not designed to use the module’s GNSS antenna, the interface must be terminated with a 50Ω load.
LM960 HW Design Guide Information This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance.
LM960 HW Design Guide 8. MECHANICAL DESIGN General The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector. Finishing & Dimensions The LM960 module’s overall dimensions are: Length: 50.95 mm Width: 30.00 mm Thickness: 2.70 mm The module complies with the standard dimensions specified in the PCI Express Mini Card Electromechanical Specification Revision 1.
LM960 HW Design Guide 9.
LM960 HW Design Guide 100uF for VBATT considerate must be kept into account that the capacitance mainly depends on the application board. Generally, additional capacitance is required when the power line is longer. And if fast power down function is used, additional bypass capacitors should be mounted on the application board. EMC Recommendations EMC protection on the pins in the table below should be designed by application side according to the customer’s requirement.
LM960 HW Design Guide SIM Card Interface 2 6 SIMRST2 O Reset output to an external UIM2 card 1.8 / 2.85V 17 SIMCLK2 O Clock output to an external UIM2 card 1.8 / 2.85V 19 SIMIO2 I/O Data connection with an external UIM2 card 1.8 / 2.85V 16 SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.85V Power Digital I/O (GPIOs) 3 GPIO_01 I/O General purpose I/O 1.8V 5 GPIO_02 I/O General purpose I/O 1.8V 44 GPIO_03 I/O General purpose I/O 1.
LM960 HW Design Guide Charged Device Model (CDM) JESD22-C101-C: ± 250 V All Antenna pins up tolerate up to ± 4 kV. Warning – Do not touch the product without proper electrostatic protective equipment. The product must be handled with care, avoiding any contact with the pins because electrostatic discharge may damage the product itself. 1VV0301485 Rev.
LM960 HW Design Guide 10. PACKAGING Tray The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301485 Rev.
LM960 HW Design Guide 1VV0301485 Rev.
LM960 HW Design Guide 11. CONFORMITY ASSESSMENT ISSUES Approvals Fully type approved confirming with RE Directive (Directive 2014/53/EU) CE, GCF FCC, IC, PTCRB RoHS and REACH Approvals for major Mobile Network Operators Declaration of Conformity The DoC is available here: www.telit.com/RED/ FCC certificates The FCC Certifcate is available here: www.fcc.gov/oet/ea/fccid IC certificates The IC Certifcate is available here: https://sms-sgs.ic.gc.
LM960 HW Design Guide not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
LM960 HW Design Guide This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. Antenna List No. Manufacturer Part No. Antenna Type Peak Gain 1.5 dBi for 617 ~ 960 MHz 1 HNS WE14-LF-07 Dipole 3.
LM960 HW Design Guide Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device.
LM960 HW Design Guide This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20 cm separation distance to the user. OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module.
LM960 HW Design Guide 12. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
LM960 HW Design Guide 13. REFERENCE TABLE OF RF BANDS CHARACTERISTICS RF Bands Characteristics Mode Freq. Tx (MHz) WCDMA 2100 – B1 1920 ~ 1980 WCDMA 1900 – B2 1850 ~ 1910 WCDMA AWS – B4 1710 ~ 1755 WCDMA 850 – B5 824 ~ 849 Freq.
LM960 HW Design Guide Mode LTE 900 – B8 Freq. Tx (MHz) 880 ~ 915 Freq.
LM960 HW Design Guide Mode LTE 600 – B71 Freq. Tx (MHz) 663 ~ 698 Freq.
LM960 HW Design Guide 14. ACRONYMS TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC SIM SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK MRDY 1VV0301485 Rev.
LM960 HW Design Guide SRDY CS RTC PCB ESR VSWR VNA FDD I2C LTE SOC 1VV0301485 Rev.
LM960 HW Design Guide 15. DOCUMENT HISTORY Revision 0 1 Date 2018-02-09 2018-05-30 2 2018-07-05 3 4 2018-12-06 2019-03-15 5 2019-04-17 6 7 2019-06-04 2019-07-17 8 9 10 11 12 2020-01-21 2020-01-31 2020-02-05 2020-02-12 2020-04-01 13 2020-05-29 1VV0301485 Rev. 15 Changes First Draft Updated 1.5 Related documents Updated 3.3 Pin Layout Updated 4.2 Power Consumption Updated 6 Digital Section Updated 2.2.1 RF Bands per Regional Variant Updated 2.6 Tx output power Updated 2.
LM960 HW Design Guide 14 15 2020-07-06 2020-08-13 1VV0301485 Rev. 15 Residual references to PCIe bus removed Update 11.5.
[01.2017] Mod.0818 2017-01 Rev.
