FN980m TLB HW Design Guide r0
Table Of Contents
HW Design Guide Template
1VV0301651 Rev. 0 Page 11 of 25 2020-02-28
FN980m TLB
Information – There is the TIM on the TLB to transfer the heat
generated by FN980m.
There are the large solder resist opening area on the bottom of
FN980m for the better heat dissipation.
Adding a thermal TIM on the back of FN980m is the most important
thing in thermal dissipation point of view.
With this action, the temerature of FN980m
can be decreased
significantly.