WE310F5-I/P Module Hardware User Guide 1VV0301662 Rev 12 – 2021-04-07
WE310F5-I/P Module Hardware User Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
WE310F5-I/P Module Hardware User Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
WE310F5-I/P Module Hardware User Guide APPLICABILITY TABLE PRODUCTS WE310F5-I WE310F5-P 1VV0301662 Rev 12 Page 4 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide Contents NOTICE 2 COPYRIGHTS ................................................................................................ 2 COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3 I. License Agreements ..................................................................... 3 II. Copyrighted Materials ................................................
WE310F5-I/P Module Hardware User Guide Power Supply Requirements....................................................... 24 Logic Levels................................................................................ 24 Power Up and Shutdown Sequences.......................................... 25 6. RF SPECIFICATION .................................................................. 26 Wi-Fi Tx Power ........................................................................... 26 BLE Tx Power .................
WE310F5-I/P Module Hardware User Guide 12. SAFETY RECOMMENDATIONS................................................ 56 Read Carefully ............................................................................ 56 13. ACRONYMS............................................................................... 57 14. DOCUMENT HISTORY ..............................................................
WE310F5-I/P Module Hardware User Guide FIGURE LIST Figure 1: WE310F5-I 15mm*18mm ............................................................................... 12 Figure 2: WE310F5-P 13.1mm*14.3mm ....................................................................... 12 Figure 3: WE310F5-I/P Block Diagram ......................................................................... 14 Figure 4: Power UP Sequence ......................................................................................
WE310F5-I/P Module Hardware User Guide TABLE LIST Table 1: Feature Description Table ............................................................................... 15 Table 2: Peripherals Interfaces ..................................................................................... 16 Table 3: ESD Characteristics of WE310F5-I/P modules ................................................ 17 Table 4: SAR ADC characteristics ................................................................................
WE310F5-I/P Module Hardware User Guide 1. INTRODUCTION Scope The aim of this document is to describe some of the hardware solutions useful for developing a product with the Telit WE310F5-I/P Wi-Fi/BLE module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our WE310F5-I/P modules.
WE310F5-I/P Module Hardware User Guide Text Conventions Danger – This information MUST be followed, or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. 2019-01-08.
WE310F5-I/P Module Hardware User Guide 2. PRODUCT DESCRIPTION Overview The WE310F5-I/P is a module with single band Wi-Fi/BLE (5.0) 2.4GHz combo module that provides an easy and cost-effective way to the users to add wireless connectivity to their products. This module is available in two different from factors the antenna version named WE310F5-I with 15mmx18mm dimensions and an on-board multilayer antenna and the WE310F5-P with 13.1mmX14.3mm with antenna PAD.
WE310F5-I/P Module Hardware User Guide NOTE: (EN) The integration of the WE310F5-I/P module within user application shall be done according to the design rules described in this manual. (IT) L’integrazione del modulo cellulare WE310F5-I/P all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale. (DE) Die Integration des WE310F5-I/P Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
WE310F5-I/P Module Hardware User Guide Block Diagram The following figure shows a high-level block diagram of WE310F5-I/P module and its major functional blocks Figure 3: WE310F5-I/P Block Diagram 1VV0301662 Rev 12 Page 14 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide 3. FEATURES Main Features 1. Highly integrated single chip with low power single band (2.4GHz) Wireless LAN (WLAN) and Bluetooth Low Energy (BLE5.0) communication controller. 2. Dedicated ArmV8-M Cortex-M33 (KM4) processor + low power Armv8-M Cortex-M23 (KM0) WLAN (802.11 b/g/n) MAC, an 1T1R capable WLAN, and Bluetooth. 3. FLASH Memory 4Mbytes(32Mbits) 4. 456Kb RAM 5. Retention SRAM 156Kb Item Description WiFi 802.11 b/g/n 1X1 2.
WE310F5-I/P Module Hardware User Guide The WE310F5-I/P module supports the following peripherals Interfaces. Item Peripherals Comment UART UART0 Low Power Mode Wakeup AUX_UART LOG UART/Low power mode wakeup (no Flow control)) SPI SPI0 Master/Slave Clock up to 50 MHz I2C HS_I2C Standard/fast/high speed mode (up to 3.33Mbps) SDIO 1-Bit SDIO mode Maximum Clock 50 MHz PWM HS_PWM8/ LP_PWM2 DVI I2S Sampling rates: 8kHz ~ 176.4kHz Mono, stereo, and 5.1 channel.
WE310F5-I/P Module Hardware User Guide Bootloader The bootloader sits in internal NOR flash. The firmware can be flashed only through AUX_UART. To program the firmware to module, TX_AUX (pin Y10) must be LOW before power on or reset.
WE310F5-I/P Module Hardware User Guide 4. PINS ALLOCATION Pin-out All IO’s are in LVTTL 3.3V logic.
WE310F5-I/P Module Hardware User Guide D9 IO4/SD_CLK I/O Configurable GPIO_04 I2S_MCLK D11 IO5/SD_D0 I/O Configurable GPIO_05 D13 IO6 I/O Configurable GPIO_06 AA5 SPI_MOSI I/O MOSI Y6 SPI_CS I/O Chip Select >1K AA7 SPI_CLK I/O Clock >1K Y8 SPI_MISO I/O MISO >1K SPI ADC and DAC B18 ADC I Analog to Digital Converter Input R16 DAC O PWM output WIFI/BT ANTENNA I/O RF pad (50 ohm) on P variant 0V ~ 3.
WE310F5-I/P Module Hardware User Guide E1 DVI_TX I I2S TX F2 DVI_CLK I I2S CLK Power Supply W1 VBATT_3V3 - Main power supply 3.3V Power AA3 VBATT_3V3 - Main power supply 3.
WE310F5-I/P Module Hardware User Guide F18 GND - Thermal Ground Power G19 GND - Thermal Ground Power H6 GND - Thermal Ground Power H14 GND - Thermal Ground Power J19 GND - Thermal Ground Power K18 GND - Thermal Ground Power M18 GND - Thermal Ground Power N19 GND - Thermal Ground Power P6 GND - Thermal Ground Power P14 GND - Thermal Ground Power T8 GND - Thermal Ground Power T12 GND - Thermal Ground Power U1 GND - Power Ground Power V2 GND -
WE310F5-I/P Module Hardware User Guide L4 SWD_DATA Bootstrap pin.
WE310F5-I/P Module Hardware User Guide N1 RESERVED - RESERVED N4 RESERVED - RESERVED P2 RESERVED - RESERVED P18 RESERVED - RESERVED R1 RESERVED - RESERVED R4 RESERVED - RESERVED R19 RESERVED - RESERVED T2 RESERVED - RESERVED T18 RESERVED - RESERVED V7 RESERVED - RESERVED V9 RESERVED - RESERVED Y12 RESERVED - RESERVED Y14 RESERVED - RESERVED AA11 RESERVED - RESERVED AA13 RESERVED - RESERVED Table 5: Pinout Table Note: Reserved Pins must not be conn
WE310F5-I/P Module Hardware User Guide 5. POWER SUPPLY Power Supply Requirements The WE310F5-I/P can be directly supplied by a 3.3V power supply source capable of at least 500mA or higher. The voltage supply to all the required parts of the chipset is provided by an embedded switching regulator. Power Supply Minimum Typical Maximum Main Power ratings 3.0 V 3.3V 3.6 V Table 6: Power Supply requirements Logic Levels Levels with VIO = 3.3V Min Typical Max VIH Input high level 2.
WE310F5-I/P Module Hardware User Guide Power Up and Shutdown Sequences Module power up and shutdown sequences are shown below: Figure 4: Power UP Sequence Figure 5: Shutdown Sequence Symbol Parameter Minimum Typical Maximum Unit TPRDY VDD_IO ready time 0.6 0.6 1 ms VRST Shutdown occurs after ON* lower than this voltage 0 0 0.
WE310F5-I/P Module Hardware User Guide 6. RF SPECIFICATION Wi-Fi Tx Power Wi-Fi Transmit power at RF pad at 25 °C @3.3V. Wi-Fi CH 6 Modulation Data Rates RF Output (dBm) BPSK 1 Mbps 18.0 QPSK 2 Mbps 18.0 CCK 5.5 Mbps 18.0 CCK 11 Mbps 18.0 BPSK 6 Mbps 18.0 BPSK 9 Mbps 17.0 QPSK 12 Mbps 17.0 QPSK 18 Mbps 16.5 16 QAM 24 Mbps 16.5 16 QAM 36 Mbps 16.0 64 QAM 48 Mbps 16.0 64 QAM 54 Mbps 16.0 BPSK MCS0_20 17.0 QPSK MCS1_20 16.0 QPSK MCS2_20 16.
WE310F5-I/P Module Hardware User Guide Wi-Fi CH 6 Modulation Data Rates RF Output (dBm) QPSK MCS2_40 15.0 16 QAM MCS3_40 14.5 16 QAM MCS4_40 14.5 64 QAM MCS5_40 14.0 64 QAM MCS6_40 14.0 64 QAM MCS7_40 14.0 WE310F5-I/P* Table 9: WLAN Tx power * For P version remove the antenna and apply a pigtail to the hot pad. BLE Tx Power BLE transmit power with at RF Pad at 25 °C.
WE310F5-I/P Module Hardware User Guide Wi-Fi (CH 6) Modulation Data Rates Sensibility (dBm) BPSK 6 Mbps -92 BPSK 9 Mbps -91 QPSK 12 Mbps -90 QPSK 18 Mbps -87 16 QAM 24 Mbps -84 16 QAM 36 Mbps -81 64 QAM 48 Mbps -76 64 QAM 54 Mbps -75 BPSK MCS0_20 -92 QPSK MCS1_20 -89 QPSK MCS2_20 -87 16 QAM MCS3_20 -84 16 QAM MCS4_20 -80 64 QAM MCS5_20 -76 64 QAM MCS6_20 -74 64 QAM MCS7_20 -72 g n Table 11: Wi-Fi Rx Sensitivity BLE Rx Sensitivity BLE Rx sensitivity te
WE310F5-I/P Module Hardware User Guide General Purpose I/O The module has 6 GPIO’s which can be configured as Input/output. They also have Alternate Functions. GPIO Number Alternate Function1 Alternate Function2 - I2C - 1bit mode SDIO IO1 I2C_SCL (I2C Clock) SD_CMD (SD Command) IO2 I2C_SDA (I2C Data) IO3 IO4 SD_CLK (SD Clock) SD_D0 (SD Data 0) I2S_MCLK (I2S MCLK) IO5 IO6 Table 13: GPIO Pinmux Table Power Consumption 6.6.1.
WE310F5-I/P Module Hardware User Guide 6.6.2. WLAN Continuous Tx Power consumption Wi-Fi 2G4 / CH 6 Modulation Data Rates Standard 802.11x RF Output Current (dBm) mA@3.3V b BPSK 1 Mbps 18.0 265 b QPSK 2 Mbps 18.0 261 b CCK 5.5 Mbps 18.0 256 b CCK 11 Mbps 18.0 248 g BPSK 6 Mbps 18.0 245 g BPSK 9 Mbps 17.0 239 g QPSK 12 Mbps 17.0 225 g QPSK 18 Mbps 16.5 212 g 16 QAM 24 Mbps 16.5 205 g 16 QAM 36 Mbps 16.0 185 g 64 QAM 48 Mbps 16.
WE310F5-I/P Module Hardware User Guide n 16QAM MCS3_40 14.5 167 n 16QAM MCS4_40 14.5 155 n 64QAM MCS5_40 14.0 146 n 64QUAM MCS6_40 14.0 142 n 64QAM MCS7_40 14.0 139 Table 15: WLAN Tx Power Consumption Caution: The equipment must be supplied by an external limited power source in compliance with the clause 2.5 of the standard EN 60950-1.
WE310F5-I/P Module Hardware User Guide Figure 6: Pads Layout Top View – WE310F5-I 1VV0301662 Rev 12 Page 32 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide Figure 7: Pads Layout Top View – WE310F5-P Figure 8: Pinout Legend Color 1VV0301662 Rev 12 Page 33 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide 7. DESIGN GUIDELINES General Digital Interface Recommendations There are two UART’s in WE310F5, intended to be used as explained below. 1. UART0 is for AT commands and response for application use. Baudrate supported 300 ~ 921600 (default baud 115200). HW flow control is supported. 2. AUX UART (also referred as UART1) is for flashing, RF Tests, and debug logs. Do not use this port for AT commands and response.
WE310F5-I/P Module Hardware User Guide If the system includes cellular module, consider adding some bypass capacitors to the supply lines of the voltage level translators to provide a protection from RF signal. For bypass use 33pF for 0402 package or 56pF when are you going to use 0201. For example, SN74AVC2T245, SN74AVC4T774 or SN74LVC2T45, for 5V signals. Moreover, while using level shifters for better testability, it is recommended to use those having OE pins.
WE310F5-I/P Module Hardware User Guide Power supply design guidelines We recommend adding and external EMI filter to improve the quality of the power supply especially when the module will be embedded with other technologies, (i.e. Cellular).
WE310F5-I/P Module Hardware User Guide For example, to effectively filter the Wi-Fi RF bands, these small signal capacitors must have a self-resonant (SRF) at about 2.4GHz. Example capacitor values, depending on manufacture and its mechanical dimensions should be around 10pF, in general by reducing the packaging size you will need to increase the capacitance value. Please check carefully the datasheet to find the proper component suitable for this purpose.
WE310F5-I/P Module Hardware User Guide For WE310F5-I version the antenna is placed directly on the board, so you will need to leave a copper keep-out area as shown in below: Figure 11: WE310F5-I Placement Example showing no copper in any layer of the board. For WE310F5-P you will need to use an external antenna connected to the antenna pad of the module, such as SMA connector as shown in figure below.
WE310F5-I/P Module Hardware User Guide • • • The WE310F5-P module provides a 50Ω antenna pad, which needs to be routed to the antenna connector (or the integrated antenna) with a transmission line Please keep as close as possible to 50Ω impedance in the RF track, including the RF Pad.
WE310F5-I/P Module Hardware User Guide ANT1 C1 Antenna_PAD L1 L2 GND Figure 15: Minimal RF Matching Network Circuitry A possible network topology is seen in the above figure and it consist of three passive components.
WE310F5-I/P Module Hardware User Guide 6. Use one layer for horizontal lines only, and the another one for vertical lines. Fill the remaining empty space with ground. 7. Use several vias to connect all ground planes and areas in all layers with possible through hole drills. 8. Place warmer components on the PCB side facing up and do not place anything near them, leaving space for air. 9. If it is a closed application, consider opening holes on top and bottom of the cover for ventilation.
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WE310F5-I/P Module Hardware User Guide 8.
WE310F5-I/P Module Hardware User Guide Figure 19: WE310F5-I Bottom View 1VV0301662 Rev 12 Page 44 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide WE310F5-P Figure 20: WE310F5-P mechanical design Figure 21: WE310F5-P side view detail 1VV0301662 Rev 12 Page 45 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide Figure 22: WE310F5-P Bottom View PCB Pad Design For the solder pads, it is recommended to use Non-Solder Mask Defined pad (NSMD) on the PCB.
WE310F5-I/P Module Hardware User Guide PCB Pad Dimensions It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself as shown below. Figure 24: Inhibit Area for Not Solder Covered Vias The holes in pad are allowed only for blind holes and not for through holes. Table 16: shows the recommended PCB pad surfaces Finish Layer thickness [µm] Properties Electro-less Ni / Immersion Au 3 –7 / 0.03 – 0.
WE310F5-I/P Module Hardware User Guide Solder Reflow Figure 25: and Table 18: shows the recommended solder reflow profile. Figure 25: Solder Reflow Profile Profile Feature Pb-Free Assembly Average ramp-up rate (TL to Tp) 3 °C/second max. Preheat • Temperature Min. (Tsmin) 150 °C • Temperature Max.
WE310F5-I/P Module Hardware User Guide Profile Feature Pb-Free Assembly Time 25 °C to peak temperature 8 minutes max. Table 18: Solder Reflow Table All temperatures refer to topside of the package, measured on the package body surface. WARNING: The WE310F5-I/P module withstands only one reflow process. The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range.
WE310F5-I/P Module Hardware User Guide 9. PACKAGING Tray The WE310F5-I/P modules are packaged on trays of 50 pieces each when small quantities are required (i.e. for test and evaluation purposes). These trays are not designed for use in SMT processes for pick and place handling. Figure 26: WE310F5-I/P Packaging example (to replace with the final one and add the WE310F5-P figure) WARNING: The maximum temperature for these trays shall not exceed 65°C.
WE310F5-I/P Module Hardware User Guide Moisture Sensitivity The WE310F5-I/P module is classified as a LEVEL 3 moisture sensitive device in accordance with IPC/JEDEC J-STD-020. Moreover, the customer must take care of the following conditions: a) The shelf life of the product inside the dry bag is 12 months starting from the bag seal date, when stored in a non-condensing atmospheric environment of < 40°C and < 90% relative humidity (RH).
WE310F5-I/P Module Hardware User Guide 10. CONFORMITY ASSESSMENT ISSUES FCC/IC Regulatory Notices Hereby, Telit Communications S.p.A F5-I/P Module is following Directive 2014/53/EU. declares that the WE310 The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red 1VV0301662 Rev 12 Page 52 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide 11. FCC/IC COMPLIANCE Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
WE310F5-I/P Module Hardware User Guide radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver.
WE310F5-I/P Module Hardware User Guide Label and compliance information The product has FCC ID and ISED label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module. The exterior label will read as follows: Contains TX FCC ID: RI7WE310F5 Contains IC: 5131A-WE310F5 Information on test modes and additional testing requirements The module has been evaluated in mobile stand-alone conditions.
WE310F5-I/P Module Hardware User Guide 12. SAFETY RECOMMENDATIONS Read Carefully Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. • Where there is risk of explosion such as gasoline stations, oil refineries, etc.
WE310F5-I/P Module Hardware User Guide 13.
WE310F5-I/P Module Hardware User Guide PCB Printed Circuit Board ESR Equivalent Series Resistance 1VV0301662 Rev 12 Page 58 of 61 2021-04-07
WE310F5-I/P Module Hardware User Guide 14. DOCUMENT HISTORY Revision Date Changes 0 2020-05-27 First issue. 1 2020-06-29 Update of SD card, Clock and Memory specification. 3 2020-09-04 Pinout and some figures. 4 2020-09-04 Pinout table fixed on debug port. 5 2020-09-14 Pinout Figure 6 and Figure 7 updated.
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