WE866C3 HW Design Guide [01.2017] 1VV0301495 Rev. 8 – 2019-05-27 Mod.0818 2017-01 Rev.
WE866C3_Hardware_Design_Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
WE866C3_Hardware_Design_Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
WE866C3_Hardware_Design_Guide APPLICABILITY TABLE PRODUCTS WE866C3-P 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide Contents NOTICE 2 COPYRIGHTS .................................................................................................. 2 COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3 APPLICABILITY TABLE .................................................................................. 4 CONTENTS ..............................................................
WE866C3_Hardware_Design_Guide 5.2.1. WLAN Interfaces .......................................................................... 25 5.2.1.1. SDIO Interface .............................................................................. 25 5.2.1.2. WL_EN ......................................................................................... 25 5.2.1.3. WOW ............................................................................................ 25 5.2.1.4. LF_CLK_IN .............................
WE866C3_Hardware_Design_Guide 6.2.3.5. 802.11a (5GHz) ............................................................................ 33 6.2.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 33 6.2.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 33 6.2.3.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 33 Receiver Sensitivity ...................................................................... 34 6.3.1.
WE866C3_Hardware_Design_Guide 7.3.2. Regulator operating conditions ..................................................... 41 Antenna requirements .................................................................. 42 7.4.1. Main Antenna ............................................................................... 42 7.4.2. Antenna Cable .............................................................................. 42 7.4.3. Antenna design ............................................................
WE866C3_Hardware_Design_Guide 1. INTRODUCTION Scope This document introduces the Telit WE866C3 module and presents possible and recommended hardware solutions for developing a product based on this module. Obviously, this document cannot include every hardware solution or every product that can be designed.
WE866C3_Hardware_Design_Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide Related Documents LE910Cx HW Design Guide Telit EVB User Guide LE910Cx Multi Technology Interface Board TLB - HW User Guide 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 2. GENERAL PRODUCT DESCRIPTION Overview The WE866C3 is a low power and low-cost wireless module solution based on Qualcomm QCA9377-3. It supports 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT 4.2 + HS + BLE, enabling seamless integration of WLAN/BT and low energy. It is a perfect companion solution for Telit cellular modules such as LE910Cx or LE920A4. WE866C3 supports low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.
WE866C3_Hardware_Design_Guide Target market WE866C3 can be used in IoT applications complementing client data availability coverage of the Cellular modems, with low power and low cost, for example: Bridging LTE / WLAN Industrial floor Healthcare instrument data terminals Smart Home automation and remote control Main features Feature Power Specification Main supply voltage: 3.3V VIO supply voltage: 1.8V or 3.3V WLAN SDIO 3.
WE866C3_Hardware_Design_Guide Data Standard IEEE 802.11a/b/g/n/ac Operating Modes Access Point Modulation BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM Station Size: 15±0.15 x 13±0.15 x 2.15±0.15 mm Mechanical Package: LGA Weight: 1g Temperature Range Operating: -30°C to +85°C 1) RoHS All hardware components are fully compliant with EU RoHS directive Storage and non-operating: -40°C to +105°C Notes: 1) The module complies with IEEE standard. 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 3. PINS ALLOCATION Pin Type Definition Type Description DI Digital Input DO Digital Output PD Pull-Down PU Pull-Up OD Open-Drain Output B Bi-Directional AI Analog/RF Input AO Analog/RF Output P Power Input Pins directions are with respect to the WE866C3 module.
WE866C3_Hardware_Design_Guide Pin Pin name Pin Reference Voltage Pin Type Pin Description Coexistence and control signals Secondary UART - LTE coexistence UART RXD / AUX UART RXD Secondary UART - LTE coexistence UART_TXD / AUX_UART_TXD WLAN enable (Active high) Bluetooth enable (Active high) C3 LTE_UART_RX VIO DI, PU C4 LTE_UART_TX VIO DO G5 G6 WL_EN BT_EN RF Antennas VIO VIO DI, PD DI, PD D1 ANT1 A AI, AO G3 RFU ANT2 Power VDD_3.3V VDD_3.
WE866C3_Hardware_Design_Guide LGA Pads Layout A B C D E F G 1 VDD_3.3V GND GND ANT1 GND GND GND 2 VDD_3.
WE866C3_Hardware_Design_Guide 4. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. Power Supply Requirements There are 2 power supply inputs to the module. The main power supply, connected to VDD_3.3V input and the VDDIO input, each must fulfil the following requirements: VDD_3.
WE866C3_Hardware_Design_Guide Power Consumption The below tables provides the typical current consumption values of the module for the various available modes. 4.2.1. Typical power consumption for WLAN low-power states Mode Total power consumption [mA] (VDDIO = 1.8V) Mode Description Standby 0.2 Deep Sleep 1.3 DTIM=1 0.8 DTIM=3 0.6 DTIM=10 1.5 DTIM=1 0.9 DTIM=3 0.7 DTIM=10 Power Save, 2.4GHz Power Save, 5GHz 4.2.2. Typical Power consumption for WLAN continuous Rx [2.
WE866C3_Hardware_Design_Guide 4.2.3. 4.2.4. Typical Power consumption for WLAN continuous Rx [5 GHz] Rate Total power consumption [mA] (VDDIO = 1.8V) MCS0 HT20 96 MCS7 HT20 94 MCS8 VHT20 112 MCS0 HT40 94 MCS7 HT40 99 MCS8 VHT40 115 MCS9 VHT40 100 MCS7 VHT80 130 MCS8 VHT80 162 MCS9 VHT80 131 Typical Power consumption for WLAN continuous TX [2.4 GHz] Rate Total power consumption [mA] (VDDIO = 1.
WE866C3_Hardware_Design_Guide 4.2.5. 4.2.6. Typical Power consumption for WLAN continuous TX [5 GHz] Rate Total power consumption [mA] (VDDIO = 1.8V) MCS0 HT20 495 MCS7 HT20 432 MCS8 VHT20 422 MCS0 HT40 475 MCS7 HT40 435 MCS8 VHT40 432 MCS9 VHT40 429 MCS7 VHT80 440 MCS8 VHT80 438 MCS9 VHT80 436 Typical Power consumption for BT Rate Total power consumption [mA] (VDDIO = 1.8V) Continuous Rx burst 25 Continuous TX Class 2 (+4 dBm) 42 Continuous TX Class 2 (+12.5 dBm) 70 1.
WE866C3_Hardware_Design_Guide NOTE: Current consumptions specification refers to typical samples and typical material. Values represent an average measurement done over few seconds. Values may vary depending on network and environmental conditions. Power consumptions values obtained with VDD_3.3V = 3.3V and VDDIO = 1.8V. NOTE: Current consumption is measured at the system level and is the sum of both VDD_3.3V and VDDIO current consumpotions.
WE866C3_Hardware_Design_Guide Power Supply Sequencing The recommended power sequence between VDD_3.3V and VDDIO inputs is shown below: Power up Normal Operation Reset Normal Operation Power down VBATT 90% of VDDIO to 10% of 3.3V Minimum 0 Sec VDDIO 90% of 3.3V to WL_EN and BT_EN high Minimum 10 uSec VDD_3.3V WL_EN BT_EN WL_EN and BT_EN low to 90% of 3.3V Minimum 10 uSec WLAN_EN valid to LF_CLK_IN Minimum 0 Sec LF_CLK_IN Notes: 1. VDDIO voltage should match VIO voltage of the host.
WE866C3_Hardware_Design_Guide 5. DIGITAL SECTION DC electrical characteristics Parameter Min Typical Max Unit High-level input voltage 0.7 * VDDIO - VDDIO + 0.3 V Low-level input voltage -0.3 - 0.3 * VDDIO V Input low leakage current (VIN = 0 V Supply = VDDIO max) -5.0 0 5.0 μA - kΩ Input pull resistor (Up or down) 1.8V IO: 120 - 3.3V IO: 70 High-level output voltage VDDIO - 0.4 - VDDIO V Low-level output voltage 0 - 0.
WE866C3_Hardware_Design_Guide Interface Ports and Signals 5.2.1. WLAN Interfaces The following figure shows the WLAN related interface connection between the WE866C3 module and the LTE modem module. The following clauses describe the various interfaces VBATT V. Reg 1.8V VBATT/VBATT_PA VDDIO Telit Module VDD_3.
WE866C3_Hardware_Design_Guide 5.2.1.4. LF_CLK_IN The LF_CLK_IN 32 kHz clock is used in low-power modes such as IEEE power-save and sleep. It serves as a timer to determine when to wake up to receive beacons in various power-save schemes and to maintain basic logic operations when in sleep. The module does not require an external 32 kHz clock. By default, it utilizes its internal clock shared with the WLAN and BT subsystem.
WE866C3_Hardware_Design_Guide BT Interface The following figure shows the BT interface connection between the WE866C3 module and the modem module. The BT controller consists of BT radio and digital baseband blocks. It is controlled by the host through the UART. The BT audio interface can be configured to UART/PCM (I2S). The BT power on/off is controlled through BT_EN. VBATT VBATT/VBATT_PA V. Reg 1.8V V. Reg 3.3V VDDIO VDD_3.
WE866C3_Hardware_Design_Guide 6. RF SECTION RF Frequencies The following table is listing the supported frequencies: Parameter Conditions WLAN Center channel frequency for 2.4 GHz Center frequency at 5 MHz spacing 2.412 – 2.484 GHz WLAN Center channel frequency for 5 GHz Center frequency at 5 MHz spacing 4.9 – 5.925 GHz BT Frequency range BT Specification: 2.4 ≤ f ≤ 2.4835 Center frequency f = 2402 + k, where k is the channel number.
WE866C3_Hardware_Design_Guide 6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.2.1.4. BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM Units 16.5 16,5 16,5 16 16 15,5 15,5 15 dBm dBm dBm dBm dBm dBm dBm dBm Data rate Index MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 CHL/CHM/CHH Units 15 15 15 14,5 14.5 13.5 13.5 13 dBm dBm dBm dBm dBm dBm dBm dBm CHL/CHM/CHH Units 16.5 16.5 16.5 16.5 16.5 16.5 14.
WE866C3_Hardware_Design_Guide 6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) Modulation BPSK 256 QAM 6.2.1.8. BPSK 256 QAM Units 15.5 11 (ac Only) dBm dBm Data rate Index MCS0 MCS9 CHL/CHM/CHH Units 15.5 10.5 dBm dBm Modulation CHL/CHM/CHH Units GFSK π/4 DQPSK 3.9 2.4 2 -5.2 dBm dBm dBm dBm Bluetooth TX power BT Spec BR EDR 8DPSK BLE 6.2.2. CHL/CHM/CHH 802.11ac, Channel BW = 80MHz (5GHz) Modulation 6.2.1.9.
WE866C3_Hardware_Design_Guide 6.2.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.2.2.4. BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM Units 17 17 17 16.5 16.5 16 16 15.5 dBm dBm dBm dBm dBm dBm dBm dBm Data rate Index MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 CHL/CHM/CHH Units 15.5 15.5 15.5 15 15 14 14 13.5 dBm dBm dBm dBm dBm dBm dBm dBm CHL/CHM/CHH Units 17 17 17 17 17 17 15 14.5 dBm dBm dBm dBm dBm dBm dBm dBm 802.
WE866C3_Hardware_Design_Guide 6.2.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) Modulation BPSK 256 QAM 6.2.2.8. CHL/CHM/CHH Units 16 11 .5(ac Only) dBm dBm 802.11ac, Channel BW = 80MHz (5GHz) Modulation BPSK 256 QAM 6.2.3. Data rate Index MCS0 MCS9 Data rate Index MCS0 MCS9 CHL/CHM/CHH Units 16 11 dBm dBm TX Output power at Hot Temperature The tables below are measured at +85°C with VDD_3.3V = 3.3V and VDDIO=1.8V. 6.2.3.1. 802.11b (2.4GHz) Modulation BPSK QPSK CCK CCK 6.2.3.2.
WE866C3_Hardware_Design_Guide 6.2.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.2.3.5. BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 14.5 14.5 14.5 14 14 13 13 12.
WE866C3_Hardware_Design_Guide Receiver Sensitivity The following clauses lists the receiver sensitivity WE866C3. Measurements are done at the module Antenna pad with 10% packet error rate. 6.3.1. Receiver Sensitivity at Room Temperature All measurements data are taken at 25°C and VDDIO=1.8V. 6.3.1.1. 802.11b (2.4GHz) Modulation BPSK QPSK CCK CCK 6.3.1.2. 1 Mbps 2 Mbps 5.5Mbps 11 Mbps Typical sensitivity -93 -91 -88 -87 Units dBm dBm dBm dBm 802.11g (2.
WE866C3_Hardware_Design_Guide 6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.3.1.5. BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM Units dBm dBm dBm dBm dBm dBm dBm dBm Data rate 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps Typical sensitivity -90 -89 -88 -86 -83 -79 -75 -74 Units dBm dBm dBm dBm dBm dBm dBm dBm 802.11n/ac, Channel BW = 20MHz (5GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.3.1.7.
WE866C3_Hardware_Design_Guide 6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz) Modulation 256 QAM 256 QAM 6.3.1.9. Data rate Index MCS8 MCS9 Units dBm dBm Bluetooth (BER < 0.1%) BT Spec BR EDR Modulation GFSK π/4 DQPSK 8DPSK BLE 6.3.2. Typical sensitivity -63 -62 GFSK Typical sensitivity -91 -90 -83 -94 Units dBm dBm dBm dBm Receiver Sensitivity at Cold Temperature All measurements data are taken at -40°C and VDDIO=1.8V. 6.3.2.1. 802.11b (2.4GHz) Modulation BPSK QPSK CCK CCK 6.3.2.2.
WE866C3_Hardware_Design_Guide 6.3.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.3.2.4. BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM Units dBm dBm dBm dBm dBm dBm dBm dBm Data rate Index MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 Typical sensitivity -86 -83 -81 -78 -74 -69 -68 -67 Units dBm dBm dBm dBm dBm dBm dBm dBm 802.11a (5GHz) Modulation BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 6.3.2.6.
WE866C3_Hardware_Design_Guide 6.3.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) Modulation BPSK 64 QAM 256 QAM 256 QAM 6.3.2.8. Typical sensitivity -87 -68 -66 -65 Units dBm dBm dBm dBm 802.11ac, Channel BW = 80MHz (5GHz) Modulation 256 QAM 256 QAM 6.3.3. Data rate Index MCS0 MCS7 MCS8 MCS9 Data rate Index MCS8 MCS9 Typical sensitivity -64 -63 Units dBm dBm Receiver Sensitivity at Hot Temperature All measurements data are taken at +85°C and VDDIO=1.8V. 6.3.3.1. 802.11b (2.
WE866C3_Hardware_Design_Guide 6.3.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) Modulation BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 6.3.3.5.
WE866C3_Hardware_Design_Guide 7. DESIGN GUIDELINES General PCB design guidelines Ground stitch any ground planes to improve thermal dissipation. The VDD_3.3V main power rail must support > 700 mA (average). It is recommended to place a 10µF capacitor near the VDD_3.3V pins and a 2.2µF on the VDDIO pin. Keep power traces as wide as possible to lower the risk of IR drop. Wherever possible, add 30% current margin for all trace widths.
WE866C3_Hardware_Design_Guide 7.3.2. Regulator operating conditions Below table shows the recommended operating conditions of the VDD_3.3V Buck-Boost voltage regulator: Parameter Input Voltage range Condition Min IOUT=0mA, VOUT=3.3V Output voltage Output ripple voltage Power efficiency Overshoot/Undershoot Startup time 1 5 uA 30 60 uA V A PWM mode -2 2 2 % PFM mode -4 4 4 % PWM mode 20 mVpp PFM mode 50 mVpp Vout=3.3V, Iout=1300mA 85 90 % Vout=3.
WE866C3_Hardware_Design_Guide Antenna requirements 7.4.1. Main Antenna The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit device shall fulfil the following requirements: 7.4.2. Frequency Range Requirements 2.412 ~ 2.484GHz 2.412~2.484GHz 4.
WE866C3_Hardware_Design_Guide 7.4.3. Antenna design When using the WE866C3, since there's no antenna connector on the module, the antenna must be connected to the WE866C3 antenna pad by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements: Item Value Characteristic Impedance 50 Ohm Max Attenuation 0.
WE866C3_Hardware_Design_Guide If cases where EMI is not a concern, using a micro strip on the superficial copper layer for the antenna line is recommended as the line attenuation will be lower than a buried one. NOTE: The following image is showing the suggested layout for the Antenna pad connection (dimensions in mm): 7.4.4. Antenna installation Guidelines Install the antenna in a place with WiFi signal coverage. Antenna shall not be installed inside metal cases.
WE866C3_Hardware_Design_Guide 8. MECHANICAL DESIGN Mechanical Dimensions The WE866C3 overall dimensions are: Length: 15 mm Width: 13 mm Thickness: 2.15 mm Weight: 1g 8.1.1. Mechanical Drawing 8.1.2. Top View The figure below shows the mechanical top view of the WE866C3 Dimensions are in mm 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 8.1.3. Bottom View The figure below shows the mechanical Bottom view of the WE866C3 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 8.1.4. Side View The figure below shows mechanical side view of the WE866C3 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 9. APPLICATION PCB DESIGN The modules have been designed to be compliant with a standard lead-free SMT process Recommended footprint for the application Figure 2 Copper Pad Outline Top View 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide In order to easily rework the module, it is suggested to add a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. The area under WIRING INHIBIT (see figure above) must be clear from signal or ground paths. PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
WE866C3_Hardware_Design_Guide PCB pad dimensions The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself Holes in pad are allowed only for blind holes and not for through holes. 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide Recommendations for PCB pad surfaces: Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15 good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures which are occurring at the leadfree process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
WE866C3_Hardware_Design_Guide Solder reflow Recommended solder reflow profile Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) 150°C – Temperature Max (Tsmax) 200°C – Time (min to max) (ts) 60-180 seconds Tsmax to TL – Ramp-up rate 3°C/second max Time maintained above: – Temperature (TL) 217°C – Time (tL) 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak temperature (tp) 10-30 seconds Ramp-do
WE866C3_Hardware_Design_Guide 10. PACKING SYSTEM Tray The WE866C3 modules are packaged on trays of 126 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide Tray Drawing 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide Moisture sensitivity The module is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD-020. Customer should take care about all the related requirements for using this kind of components. Moreover, the customer must take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
WE866C3_Hardware_Design_Guide 11. CONFORMITY ASSESSMENT ISSUES Declaration of Conformity Hereby, Telit Communications S.p.A declares that the NB IOT Module is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red 1VV0301495 Rev.
WE866C3_Hardware_Design_Guide 12. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
WE866C3_Hardware_Design_Guide 13. FCC/IC COMPLIANCE Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
WE866C3_Hardware_Design_Guide installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
WE866C3_Hardware_Design_Guide Limited module procedures N/A Trace antenna designs See 7.4.3 Antenna design Antennas This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Type Max Gain Omnidirectional 4.
WE866C3_Hardware_Design_Guide Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
WE866C3_Hardware_Design_Guide 14.
WE866C3_Hardware_Design_Guide 15.
[01.2017] Mod.0818 2017-01 Rev.
