WL865E4-P HW User Guide [01.2017] 1VV0301580 Rev. 4 – 2019-08-08 Mod. 0805 2017-01 Rev.
WL865E4-P Module Hardware User Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
WL865E4-P Module Hardware User Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
WL865E4-P Module Hardware User Guide APPLICABILITY TABLE (REMOVE UNUSED) PRODUCTS WL865E4-P 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide Contents NOTICE 2 COPYRIGHTS ................................................................................................ 2 COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3 I. License Agreements ..................................................................... 3 II. Copyrighted Materials ..................................................
WL865E4-P Module Hardware User Guide Communication ports .................................................................. 24 5.5.1. High Speed UART ...................................................................... 24 5.5.2. Low Speed UART ....................................................................... 24 5.5.3. SDIO........................................................................................... 25 5.5.4. SPI...................................................................
WL865E4-P Module Hardware User Guide Footprint ..................................................................................... 42 PCB pad design .......................................................................... 42 PCB pad dimensions .................................................................. 43 Stencil......................................................................................... 43 Solder paste ...............................................................................
WL865E4-P Module Hardware User Guide 1. INTRODUCTION Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit WL865E4-P module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our WL865E4-P modules.
WL865E4-P Module Hardware User Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. 2019-01-08. 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide Related Documents WL865E4-P AT Command Reference Guide WL865E4-P_EVB_User_Guide WL865_PCB_Antenna_Integration_Guide 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 2. OVERVIEW The aim of this document is the description of some hardware solutions useful for developing a product with the Telit WL865E4-P module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced.
WL865E4-P Module Hardware User Guide The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.
WL865E4-P Module Hardware User Guide 3. PINS ALLOCATION Pin-out Table Pin Signal I/O Function Type Comment USB HS 2.0 COMMUNICATION PORT 12 VUSB I Power Supply for the internal USB transceiver.
WL865E4-P Module Hardware User Guide Serial Peripheral Interface (SPI) (cont…) 55 SPI_M_MISO / GPIO_14 DIO General Purpose Input/Output VDD_VIO SPI MISO (Master) 56 SPI_M_MOSI / GPIO_13 DIO General Purpose Input/Output VDD_VIO SPI MOSI (Master) DIO SDIO card CLK signal VDD_VIO SPI_S_CLK Slave (PWM) DIO SDIO card Command signal VDD_VIO SPI_S_CS (Active LOW) Slave (PWM) DIO SDIO card DAT[3] signal VDD_VIO SPI_S_MOSI Slave (PWM) DIO SDIO card DAT[2] signal VDD_VIO USB BOOT Mode (Act
WL865E4-P Module Hardware User Guide Digital Audio Interface (I2S) Master/Slave 17 I2S_SYNC / GPIO_28 DIO I2S - Frame Sync or LR Clock VDD_VIO 18 I2S_SCK / GPIO_30 DIO I2S - Bit Clock VDD_VIO 19 I2S_SDO / GPIO_31 DIO I2S - Data Ouput VDD_VIO 20 I2S_SDI / GPIO_29 DIO I2S - Data Input VDD_VIO Miscellaneous Fuctions 1 RESET# DIO Hardware RESET Power Disable VDD_VIO Open Drain Active LOW 2 BT_PRIORITY / GPIO_02 DIO GENERIC IO VDD_VIO BT_PRIORITY 15 PWM_OUT0 / GPIO_05 DIO GENE
WL865E4-P Module Hardware User Guide RF Pads 37 ANT_BLE AIO BT 2.4G RF 50 ohm 40 ANT_WIFI AIO WIFI 2.4G and 5G RF 50 ohm I WiFi main power supply Power (3.0V to 3.6V) Power Supply 6 VDD_WLAN 3.3V Nominal Power Supply 9 11 VDD_VIO VDD_BLE I I Digital Input/Output power supply Power Bluetooth main power supply Power (1.8V to 3.6V) 3.3V Nominal Power Supply (3.0V to 3.6V) 3.
WL865E4-P Module Hardware User Guide Pads Layout The figure 1 shows the pads layout configuration for the module (top view) Figure 1: Top View Pad Layout 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 4. POWER SUPPLY Power Supply Requirements Power Supply Minimum Typical Absolute Maximum to avoid permanent -0.3 V damage. At any power supply pin. Maximum 4.0V Recommended VDD_BLE, VDD_WLAN, 3.14 V USB_VDD 3.3V 3.46V 3.14V or 1.71V 3.3V or 1.8V 3.46V or 1.89V Recommended VDD_VIO (see notes) Table 2: Wl865E4-P power supply requirements Note: The ADC can be used only if VDD_VIO is equal to 1V8. 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide Power Consumption vs TX power at 2.4 GHz WIFI 2G4 / CH 6 Modulation Standard 802.11x Data rates RF Output Current (Mbps) (dBm) @3.3V Unit b BPSK 1 Mbps 19 339 mA b QPSK 2 Mbps 19 342 mA b CCK 5.
WL865E4-P Module Hardware User Guide Power Consumption vs TX power at 5 GHz WIFI 5G / CH 100 Modulation Data rates Standard 802.11x RF Output Current (dBm) @3.3V Unit a BPSK 6 Mbps 15.5 267 mA a BPSK 9 Mbps 15.5 265 mA a QPSK 12 Mbps 15.5 265 mA a QPSK 18 Mbps 15.5 263 mA a 16 QAM 24 Mbps 15.5 265 mA a 16 QAM 36 Mbps 14 230 mA a 64 QAM 48 Mbps 13 218 mA a 64 QAM 54 Mbps 13 216 mA n BPSK MCS0_20 15.5 267 mA n QPSK MCS1_20 15.
WL865E4-P Module Hardware User Guide 5. DIGITAL SECTION Logic Levels Parameter Min Max Input level on any digital pin -0.3V VDD_VIO + 0.3V Levels with VDD_VIO = 3.3V Min Max VIH Input high level 2.4V 3.6V VIL Input low level -0.3V 0.3V VOH Output high level 3.0V 3.6V VOL Output low level -0.3V 0.4V Levels with VDD_VIO = 3.3V Typical IIH Input current 60 µA (Rod is ON) 0.1 µA (Rpd is OFF) IIL Input current 60 µA (Rod is ON) 0.
WL865E4-P Module Hardware User Guide Power Up/Down Sequence The RESET# is the main power disable/enable pin, including both the WIFI and BLE. All supplies should be stable for a minimum of 10 µs before RESET# is de-asserted (that is, when greater than VIL for VDD_VIO). If VDD_VIO = 3.3V, then VDD_BLE, VDD_WLAN, and VDD_VIO can share same 3.3V power Figure 2: WL865E4-P P on RESET 5.2.1.
WL865E4-P Module Hardware User Guide Periferals Interface Summary The module has the following peripherals Interfaces. Peripherals Features QSPI Internal Serial Flash, 8/64/96MHz SDIO 2.0Slave 48Mhz clockrate SPI 48Mhz clock rate,4-wire Master/Slave USB2.0 FW upgrade, Manufacture interface Peripherals I2S One port –2 audiochannels Master/Slave PCM Master/Slave, 8/16-bit,48KHz.
WL865E4-P Module Hardware User Guide Communication ports 5.5.1. High Speed UART High-Speed Universal Asynchronous Receiver/Transmitter (HS-UART) interfaces, which may be configured to serve as either a host interface link or a debug message console.
WL865E4-P Module Hardware User Guide 5.5.3. SDIO One SDIO Slave interface: • • • 5.5.4. Compliant to SDIO v2.0 specification Interface clock frequency up to 48 MHz Data transfer modes: 4-bit SDIO, 1-bit SDIO, SPI SPI Two general-purpose SPI interfaces. One configured as master only and a second one can be configured as master or slave where pin-mux with SDIO interface pins. • Interface clock frequency up to 48 MHz 5.5.5. I2C The I2C Master/Salve interface has weak internal pull-up.
WL865E4-P Module Hardware User Guide GPIO Alternate Function Direction Internal PU/PD GPIO_07 I2C_SCL Output PU GPIO_08 LF_CLK_IN from an external 32KHz for Low Power Input Accurancy GPIO_09 WoW (Wakeup On Wireless) (PWM) Input GPIO_10 SW_RESET, WHATCH DOG, etc Input/Output GPIO_11 SPI_MASTER_CS Output PU GPIO_12 SPI_MASTER_CLK Output PD GPIO_13 SPI_MASTER_MISO Input PU GPIO_14 SPI_MASTER_MOSI Output PU GPIO_15 ADC_IN1 (Analog to Digital Converter) (VDD_VIO=1V8) Input GPIO_16 ADC_I
WL865E4-P Module Hardware User Guide GPIO_29 I2S_SDI Input GPIO_30 I2S_SCK Input/Output GPIO_31 I2S_SDO Output GPIO_32 SDIO_CLK (PWM) Input GPIO_33 SDIO_CMD (PWM) Input GPIO_34 SDIO_D3 (PWM) Input/Output PD GPIO_35 SDIO_D2 (PWM) Input/Output PD GPIO_36 SDIO_D1 (PWM) Input/Output PD GPIO_37 SDIO_D0 (PWM) Input/Output PD PD Table 10: WL865E4-P GPIO Alternate Function ADC Converter • • 12-bit ADC up to 1Msps Alternatively 1 differential input, -1.75V to +1.75V, common mode 0.875V.
WL865E4-P Module Hardware User Guide We strongly suggest using a dual supply buffer component for unidirectional signals like UART. Example of this are SN74AVC2T245, SN74AVC4T774 or SN74LVC2T45, for 5V signals. They are more immune to RF and are independent on Pull-Up or Pull-Down that could be present at any side of the voltage translator. Place 33pF on both power supplies. The Power bank side connected to the modem should be powered with same VDD_VIO to prevent latch-up from happening.
WL865E4-P Module Hardware User Guide 6. RF SECTION Bands Variants 6.1.1. WIFI Supported Frequency Bands Technology Frequency Range (GHz) Channel spacing (MHz) WIFI 2.4 GHz 2.401 ≤ Fc ≤ 2.495 5 WIFI 5 GHz 5.170 ≤ Fc ≤ 5.835 5 Table 11: WL865E4-P supported Frequency Bands for WiFi 6.1.2. BlueTooth Technology Frequency Range (GHz) Channel Number (k) BLE 5 2.402 ≤ Fc ≤ 2.480 Fc=2402 + k × 2 MHz, where k = 0, ..., 39. Table 32: WL865E4-P supported Frequency Bands for BLE 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide TX Output power 6.2.1. WIFI 6.2.1.1. 2.4GHz WIFI 2G4 Transmit power with IEEE 802.11 EVM and spectral mask compliance at RF output Pad at 25 °C WIFI 2G4 / CH 6 Modulation Data rates Standard 802.11x RF Output EVM IEEE EVM (dBm) (dB) (dB) b BPSK 1 Mbps 19 -30,4 -14 b QPSK 2 Mbps 19 -25,6 -14 b CCK 5.5 Mbps 19 -27,5 -14 b CCK 11 Mbps 19 -26,5 -14 g BPSK 6 Mbps 19 -17.
WL865E4-P Module Hardware User Guide 6.2.1.2. 5GHz WIFI 5G Transmit power with IEEE 802.11 EVM and spectral mask compliance at RF output Pad at 25 °C WIFI 5G / CH 100 Modulation Data rates Standard 802.11x RF Output EVM IEEE limit (dBm) (dB) (dB) a BPSK 6 Mbps 15.5 -18.4 -5 a BPSK 9 Mbps 15.5 -18.5 -8 a QPSK 12 Mbps 15.5 -17.9 -10 a QPSK 18 Mbps 15.5 -18.0 -13 a 16 QAM 24 Mbps 15.5 -22.8 -16 a 16 QAM 36 Mbps 14 -29.8 -19 a 64 QAM 48 Mbps 13 -31.
WL865E4-P Module Hardware User Guide RX Sensitivity 6.3.1. WIFI 6.3.1.1. 2.4GHz WIFI 2G4 RX Sensibility Tested at RF output Pad at 25 °C WIFI 2G4 / CH 6 Modulation Data rates Standard 802.11x Sensibilty IEEE limit (dBm) (dB) b BPSK 1 Mbps -96.5 -80 b QPSK 2 Mbps -94.1 -80 b CCK 5.5 Mbps -93.7 -76 b CCK 11 Mbps -90.0 -76 g BPSK 6 Mbps -94.4 -82 g BPSK 9 Mbps -93.0 -81 g QPSK 12 Mbps -92.1 -79 g QPSK 18 Mbps -89.2 -77 g 16 QAM 24 Mbps -86.
WL865E4-P Module Hardware User Guide 6.3.1.2. 5GHz WIFI 5G RX Sensibility Tested at RF output Pad at 25 °C WIFI 5G / CH 100 Modulation Data rates Standard 802.11x Sensibilty IEEE limit (dBm) (dBm) a BPSK 6 Mbps -95.4 -82 a BPSK 9 Mbps -94.1 -81 a QPSK 12 Mbps -93.0 -79 a QPSK 18 Mbps -90.6 -77 a 16 QAM 24 Mbps -87.1 -74 a 16 QAM 36 Mbps -84.0 -70 a 64 QAM 48 Mbps -80.0 -66 a 64 QAM 54 Mbps -78.2 -65 n BPSK MCS0_20 -95.2 -82 n QPSK MCS1_20 -92.
WL865E4-P Module Hardware User Guide WIFI Antenna requirements Special care must be taken during the design of the RF section on the application board. RF performance degradation, and infringements of emission limits, may arise if the following recommendations are not respected. A 50Ω antenna is required. Telit’s WL865E4-P interface features an SMA connector for an external antenna, but other antenna integrated choices are possible, such as a chip or a printed one.
WL865E4-P Module Hardware User Guide The position of the external antenna with respect to other boards is of maximum importance, since conductive planes close to antenna modify the impedance seen by the antenna and any board of the system must be RF proof, not only the modem board. Move components, tracks, vias and connectors away from antenna area to reduce their coupling with RF signal; you can also bury tracks in the inner layers of a multi-layer PCB.
WL865E4-P Module Hardware User Guide The Bypass capacitors must be placed close to the Telit modem’s power input pads or at least on the same path. In case of switching power supply another Bypass low ESR capacitor must be placed close to the inductor output to reduce the ripple. Some protection diode must be placed close to the input connector where the power source is drained.
WL865E4-P Module Hardware User Guide An example of a waveguide having the same width as the RF Pad are shown in figures below. Figure 4: Coplanar Waveguide dimensioning example Figure 5: Coplanar Waveguide calculation tool example Please pay attention to cut the GND plane close to the Antenna pad, otherwise you can change drastically the impedance value. To give you an idea below we are showing the RF track used in our EVB.
WL865E4-P Module Hardware User Guide Figure 6: RF Track on EVB 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 7. AUDIO SECTION Electrical Characteristics The audio interface is only digital, through the I2S. The voltage of this interface pins have same electrical characteristics as for digital pins and are related to the power bank VDD_VIO. 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 8. MECHANICAL DESIGN Drawing Figure 7: WL865E4-P Top and bottom side mechanical Drawing 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide Figure 8: WL865E4-P side view 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 9. APPLICATION PCB DESIGN Footprint Figure 9: WL865E4-P recommended footprint PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Figure 10: SMD and NSMD PAD 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide PCB pad dimensions It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Figure 5: inhibit area for not solder covered vias Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer thickness [µm] Properties Electro-less Ni / Immersion Au 3 –7 / 0.03 – 0.
WL865E4-P Module Hardware User Guide We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.
WL865E4-P Module Hardware User Guide All temperatures refer to topside of the package, measured on the package body surface. WL865E4-P module withstands one reflow process only. Warning: The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range.
WL865E4-P Module Hardware User Guide 10. PACKAGING Tray The WL865E4-P modules are packaged on trays of 50 pieces each when small quantities are required (i.e. for test and evaluation purposes). Trays are not designed to be used in SMT processes for pick and place handling. Figure 63: WL865E4-P Packaging 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide Caution or Warning –These trays can withstand at the maximum temperature of 65°C. Moisture sensitivity The moisture sensitivity level of the Product is “3” according with standard IPC/JEDEC JSTD-020, take care of all the relative requirements for using this kind of components.
WL865E4-P Module Hardware User Guide 11. CONFORMITY ASSESSMENT ISSUES FCC/IC Regulatory notices Hereby, Telit Communications S.p.A declares that the NB IOT Module is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 12. FCC/IC COMPLIANCE Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
WL865E4-P Module Hardware User Guide radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver.
WL865E4-P Module Hardware User Guide Label and compliance information The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module. The exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7WL865E4” or “Contains FCC ID: RI7WL865E4”. Information on test modes and additional testing requirements The module has been evaluated in mobile stand-alone conditions.
WL865E4-P Module Hardware User Guide 13. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: • • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
WL865E4-P Module Hardware User Guide 14. ACRONYMS TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC BLE SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK MRDY 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide SRDY CS RTC PCB ESR VSWR VNA 1VV0301580 Rev.
WL865E4-P Module Hardware User Guide 15. DOCUMENT HISTORY Revision Date Changes 0 2017-12-15 First issue 1 2019-03-29 General Review of all chapters 2 2019-05-01 Minor changes 3 2019-07-02 Updated GPIO and RF tables 4 2019-08-08 Added FCC/IC COMPLIANCE 1VV0301580 Rev.
[01.2017] Mod. 0805 2017-01 Rev.