Data Sheet

Tel：[phone] / 30 http://www.temolin.com
Temolin Technology, I n c .
Wireless with Temolin
Wireless with Android
Wrireless on your device
3 Platform Features
• General
− Smartphone, two MCU subsystems architecture
− eMMC on board (8GB/16GB/32GB) optional
− LPDDR-3 (1GB/2GB/3GB) optional
• AP MCU subsystem
− Octa-core ARM® 1.28GHz Cortex-A53 MPCore
TM
− NEON multimedia processing engine with SIMDv2/VFPv4 ISA support
− 32KB L1 I-cache and 32KB L1 D-cache
− 512KB unified L2 cache for one quad- core and 256KB for another quad-core
− DVFS technology with adaptive operating voltage from 0.85V to 1.25V
• MD MCU subsystem
− ARM® Cortex-R4 processor with max. 600MHz operation frequency
− 64KB I-cache, 64KB D-cache
− 512KB TCM (tightly-coupled memory)
− Coresonic DSP for running LTE modem tasks, with max. 240MHz operation frequency
− FD216 DSP for running modem/voice tasks, with max. 250MHz operation frequency
− High-performance AXI and AHB bus
− General DMA engine and dedicated DMA channels for peripheral data transfer
− Watchdog timer for system error recovery
− Power management for clock gating control
• MD external interfaces
− Dual SIM/USIM interface
− Interface pins with RF and radio-related peripherals (antenna tuner, PA, etc.)
• Security
− ARM® TrustZone® Security
• External memory interface
− LPDDR2/3 up to 3GB
− Single channel with 32-bit data bus width
− Memory clock up to 667MHz
− Self-refresh/partial self-refresh mode
− Low-power operation
− Programmable slew rate for memory controller’s IO pads
− Dual rank memory device
− Advanced bandwidth arbitration control